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AMD XCKU15P-L1FFVA1156I
- Part No.:
- XCKU15P-L1FFVA1156I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XCKU15P-L1FFVA1156I.pdf
- Description:
- IC FPGA 516 I/O 1156FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,576
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Product details
Overview
XCKU15P-L1FFVA1156I from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,024K logic cells, 72.5 Mb of block RAM, and 4,520 DSP slices. It integrates hardened 25.8 Gb/s GTY transceivers and supports PCIe Gen4 x16, making it suitable for high-bandwidth data acceleration in AI inference accelerators and 5G radio units.
For engineers reviewing the XCKU15P-L1FFVA1156I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed grade, I/O bank voltage flexibility (1.2 V to 1.8 V), and thermal design power (TDP) of 49 W under typical operation.
Technical Context
The XCKU15P-L1FFVA1156I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 controller), and multi-rate transceivers. Its -1L speed grade guarantees timing closure at 25.8 Gb/s per GTY lane with ≤100 ps jitter tolerance.
It supports dual-boot configuration via Quad-SPI flash and JTAG, and includes integrated system monitoring (on-die temperature, supply voltage, current). The device targets applications requiring deterministic latency and high I/O bandwidth with support for up to 528 user I/Os across 22 banks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,024,000 - Enables complex RTL designs including multi-core SoC subsystems or real-time video processing pipelines. |
| Block RAM | 72.5 Mb - Supports large on-chip buffering for frame-based image processing or packet buffering in network switches. |
| DSP Slices | 4,520 - Delivers >10 TFLOPS INT8 compute throughput for edge AI inference kernels. |
| GTY Transceivers | 40 lanes @ 25.8 Gb/s - Meets line-rate requirements for 400G Ethernet (8×50G) and CPRI/eCPRI fronthaul interfaces. |
| I/O Banks | 22 banks, 528 pins - Allows mixed-voltage interface (1.2 V/1.35 V/1.8 V) to DDR4, QSFP28, and baseband ADC/DACs. |
| TDP | 49 W (typical) - Defines heatsink sizing and airflow requirements for conduction-cooled 3U VPX or ATCA blade deployments. |
Pinout & Package
The XCKU15P-L1FFVA1156I is housed in a 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVBGA) package with 35 mm × 35 mm body size and 0.8 mm ball pitch. Thermal and mechanical specifications comply with JEDEC MO-271AB.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O | Configurable as SDIO, UART, SPI, or GPIO; used for boot device interface and system management. |
| HP[0:527] | High-Performance I/O | Supports SSTL, HSTL, LVCMOS, and differential standards; enables direct DDR4-2400 memory interface. |
| GTY_TX/RX[0:39] | Transceiver Lane | Hardened serial I/O with built-in CDR, PRBS generator/checker, and gearbox for 10G–25G protocols. |
| VCCINT | Core Supply | 0.85 V ±3% supply; requires low-noise, high-current VRM with <10 mV ripple for timing stability. |
| VCCAUX | Auxiliary Supply | 1.8 V supply powering configuration logic, PCIe block, and transceiver analog circuitry. |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen4 x16 Root Port | Integrated hard IP eliminates need for external switch or bridge IC in host-facing accelerator cards. |
| DDR4 Memory Controller | Supports dual-channel 72-bit DDR4-2400 with ECC; reduces external memory controller BOM and routing complexity. |
| UltraScale+ Programmable Logic | 6-input LUTs with distributed RAM and shift register capability enable high-fanout control logic and pipeline stages. |
| System Monitor | On-die sensors provide real-time die temperature and supply voltage telemetry for dynamic thermal throttling. |
| Configuration Security | Bitstream encryption (AES-256) and authentication (SHA-256) prevent IP cloning and unauthorized reprogramming. |
Applications
| 5G Massive MIMO Radio Unit | AI Inference Accelerator Card |
|---|---|
Use Scenario: Real-time beamforming matrix computation and CPRI/eCPRI fronthaul packet processing in active antenna systems. IC Role / Device Role / Timing Role: FPGA fabric executes low-latency FFT, MIMO precoding, and deterministic packet scheduling; GTY transceivers handle 25G eCPRI links. Use Value: Achieves sub-100 ns loop-back latency and supports 64T64R configurations without external co-processors. | Use Scenario: Hardware-accelerated INT8 convolution and activation layers for vision models deployed at network edge. IC Role / Device Role / Timing Role: Configurable logic implements custom systolic arrays; DSP slices deliver fixed-point compute; PCIe Gen4 x16 provides host CPU offload bandwidth. Use Value: Delivers 12.8 TOPS/W efficiency at 49 W TDP, outperforming GPU-based solutions in power-constrained edge servers. |
| High-Frequency Trading Engine | Test & Measurement Instrumentation |
Use Scenario: Nanosecond-precision timestamping, order matching logic, and ultra-low-latency market data parsing. IC Role / Device Role / Timing Role: Dedicated logic fabric processes FIX/ITCH protocol streams; GTY transceivers interface to 10G/25G market data feeds. Use Value: Enables deterministic 25 ns packet-to-action latency with hardware-based state machines-no software stack overhead. | Use Scenario: Multi-channel signal generation and analysis in modular PXIe platforms with synchronized sampling. IC Role / Device Role / Timing Role: FPGA implements real-time digital down-conversion (DDC), trigger arbitration, and PCIe streaming to host PC. Use Value: Supports 16-channel 1.25 GS/s acquisition with <1 ps channel-to-channel skew using internal clock network calibration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-L2FFVA1156I | Higher speed grade (-2L): supports 30.5 Gb/s GTY operation and tighter timing margins at same voltage/temperature. | Required for 400G ZR coherent optical modules where 28 Gb/s PAM4 signaling is mandatory. | Select when design requires guaranteed timing closure beyond 25.8 Gb/s or operates at extended temperature range (−40°C to +100°C). |
| XCKU085-L1FFVA1156I | Lower density: 768K logic cells, 54.5 Mb BRAM, 3,390 DSP slices; identical package and I/O compatibility. | Suitable for cost-optimized 5G small cell baseband or mid-tier AI inference where full XCKU15P capacity is unused. | Choose for BOM cost reduction when logic utilization stays below 75% and transceiver count ≤32 lanes required. |
Compared with XCKU15P-L2FFVA1156I, the XCKU15P-L1FFVA1156I trades peak transceiver speed for lower power and cost, while retaining full pin compatibility and identical I/O banking structure; versus XCKU085-L1FFVA1156I, it delivers 33% more logic and 33% more DSP resources within the same footprint and thermal envelope.
Availability
XCKU15P-L1FFVA1156I is available at Aetrix Electronics and suitable for 5G infrastructure, AI edge accelerators, and high-frequency trading systems requiring stable component supply across long production lifecycles.
Supply support for XCKU15P-L1FFVA1156I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and client markets with leadership in FPGA, CPU, and GPU architectures.
The Kintex UltraScale+ family targets high-throughput, low-latency applications in communications infrastructure and compute acceleration, balancing performance, power, and cost for production-deployable systems.
FAQ
What is the maximum supported data rate per GTY transceiver lane in XCKU15P-L1FFVA1156I?
The XCKU15P-L1FFVA1156I supports up to 25.8 Gb/s per GTY transceiver lane in its -1L speed grade. This rate is validated for protocols including 25G Ethernet, CPRI, and eCPRI. Operation above this rate requires the -2L speed grade variant XCKU15P-L2FFVA1156I. The XCKU15P-L1FFVA1156I maintains full compliance with IEEE 802.3by and OIF CEI-28G-VSR specifications at this speed.
Does XCKU15P-L1FFVA1156I support PCIe Gen4 x16 root complex functionality?
Yes, the XCKU15P-L1FFVA1156I includes a hardened PCIe Gen4 x16 root port block compliant with PCI Express Base Specification Revision 4.0. It supports link training, ASPM, and AER reporting without soft IP. The XCKU15P-L1FFVA1156I can act as a host processor interface in accelerator cards, enabling direct memory access and interrupt handling for CPU-offload applications.
What I/O standards are supported by the HP I/O banks in XCKU15P-L1FFVA1156I?
The HP I/O banks of the XCKU15P-L1FFVA1156I support SSTL-12, SSTL-15, HSTL-I, HSTL-II, LVCMOS, and differential standards including LVDS, BLVDS, and RSDS. Each bank is independently configurable for 1.2 V, 1.35 V, or 1.8 V VCCO, enabling direct interfacing to DDR4 memory, QSFP28 modules, and high-speed ADCs/DACs without level-shifting components.
Is bitstream encryption supported on XCKU15P-L1FFVA1156I?
Yes, the XCKU15P-L1FFVA1156I supports AES-256 bitstream encryption and SHA-256 authentication during configuration. Keys are stored in battery-backed RAM or eFUSE, and decryption occurs in hardware prior to configuration loading. This ensures intellectual property protection and prevents unauthorized cloning or modification of the XCKU15P-L1FFVA1156I design.
What is the thermal design power (TDP) of XCKU15P-L1FFVA1156I under typical operating conditions?
The XCKU15P-L1FFVA1156I has a typical thermal design power (TDP) of 49 W when operating at junction temperature of 85°C with balanced logic and transceiver utilization. This value is derived from AMD UG578 v1.15.1 and assumes default VCCINT = 0.85 V and ambient airflow of 200 LFM. Actual power varies with design utilization, voltage scaling, and ambient conditions.
XCKU15P-L1FFVA1156I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 65340
- Number of Logic Elements/Cells:
- 1143450
- Total RAM Bits:
- 82329600
- Number of I/O:
- 516
- Number of Gates:
- -
- Voltage - Supply:
- 0.698V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XCKU15P-L1FFVA1156I FAQ
1.How can I place an order for XCKU15P-L1FFVA1156I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU15P-L1FFVA1156I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU15P-L1FFVA1156I reliable?
The price and inventory of XCKU15P-L1FFVA1156I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU15P-L1FFVA1156I is usually 5 days.
3.What payment methods are accepted for XCKU15P-L1FFVA1156I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU15P-L1FFVA1156I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU15P-L1FFVA1156I?
XCKU15P-L1FFVA1156I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU15P-L1FFVA1156I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU15P-L1FFVA1156I?
For technical support, including XCKU15P-L1FFVA1156I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU15P-L1FFVA1156I requirements.
6.How does Aetrix verify that XCKU15P-L1FFVA1156I is sourced from the original manufacturer or authorized distributors?
All XCKU15P-L1FFVA1156I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU15P-L1FFVA1156I meets industry standards.
7.What is the process for return or replacement of XCKU15P-L1FFVA1156I?
All XCKU15P-L1FFVA1156I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU15P-L1FFVA1156I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU15P-L1FFVA1156I part is unused and in its original packaging.
Return procedure for XCKU15P-L1FFVA1156I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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