AMD XCKU15P-L1FFVE1517I
- Part No.:
- XCKU15P-L1FFVE1517I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1517-BBGA, FCBGA
- Datasheet:
-
XCKU15P-L1FFVE1517I.pdf
- Description:
- IC FPGA 512 I/O 1517FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XCKU15P-L1FFVE1517I from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,024K logic cells, 6,480 DSP slices, and 72.5 Mb of block RAM. It supports PCIe Gen4 x16, 32 GTY transceivers (up to 32.75 Gb/s), and DDR4 memory interfaces up to 2400 MT/s. Used in high-bandwidth data acceleration and real-time signal processing systems.
For engineers reviewing the XCKU15P-L1FFVE1517I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver count and speed, on-chip memory depth, I/O voltage flexibility (1.2 V to 1.8 V), and thermal design power (TDP) of 45 W at typical operation.
Technical Context
The XCKU15P-L1FFVE1517I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks for PCIe Gen4, Ethernet MACs, and memory controllers, and adaptive compute resources including UltraScale+ DSP slices optimized for INT18/INT27 multiply-accumulate operations. It integrates dual ARM Cortex-R5F processors for real-time control and configuration management.
Configuration is supported via quad-SPI, BPI, or JTAG, with bitstream encryption using AES-256 and HMAC-SHA256. The device operates across industrial temperature range (–40°C to +100°C) and supports partial reconfiguration for dynamic function swapping without system reset.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,024,000 - Enables complex RTL designs with multi-million-gate equivalent functionality |
| DSP Slices | 6,480 - Supports concurrent high-throughput filtering, FFT, and matrix operations |
| Block RAM | 72.5 Mb - Provides on-die memory for buffering, FIFOs, and lookup tables without external DRAM |
| GTY Transceivers | 32 × up to 32.75 Gb/s - Enables 400G Ethernet, CPRI/eCPRI, and high-speed serial backplane links |
| PCIe Interface | Gen4 x16 - Delivers 32 GB/s bidirectional bandwidth for host-FPGA co-processing |
| I/O Standards | LVCMOS, SSTL, HSTL, MIPI, differential LVDS - Supports mixed-voltage board-level interfacing |
| TDP | 45 W (typical) - Defines thermal envelope for heatsink and airflow design in 1U/2U systems |
Pinout & Package
This device is housed in a 1517-ball Flip-Chip Fine-Pitch Ball Grid Array (FFVBGA) package with 0.8 mm pitch, designed for high-density PCB routing and thermal dissipation via center thermal ball array.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O | Configurable as GPIO, SDIO, UART, SPI, or I2C for peripheral control and boot interface |
| HP[0:63] | High-Performance I/O Bank | Supports 1.8 V/1.5 V/1.35 V/1.2 V signaling for DDR4, QDR, and high-speed SerDes reference clocks |
| HR[0:95] | High-Density I/O Bank | Flexible single-ended and differential standards up to 1.8 V for general-purpose connectivity |
| CLK_IN_0/1 | Dedicated Clock Input | Low-jitter inputs for feeding MMCM/PLL clock networks; supports differential LVDS or single-ended LVCMOS |
| PR_RST_B | Partial Reconfiguration Reset | Asynchronous active-low signal to safely initiate dynamic region reload without affecting static logic |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 Controller | Reduces RTL integration effort and timing closure risk for host-facing acceleration cards |
| Dual ARM Cortex-R5F Processors | Enables embedded real-time firmware execution alongside programmable logic for system management |
| AES-256 Bitstream Encryption | Protects intellectual property against physical readout and cloning attacks |
| Partial Reconfiguration Support | Allows runtime logic updates in designated regions while maintaining system uptime |
| UltraScale+ DSP Slice Architecture | Delivers deterministic 27-bit accumulation and chained multiply-add for radar and AI inference kernels |
Applications
| 5G Radio Unit Acceleration | High-Frequency Trading Engine |
|---|---|
Use Scenario: Real-time massive MIMO precoding and channel estimation in 5G NR base stations. IC Role / Device Role / Timing Role: FPGA fabric executes low-latency signal processing kernels; GTY transceivers interface with RFICs via JESD204B v2.0. Use Value: Achieves sub-100 ns loop latency with deterministic timing using hard PCIe Gen4 and MMCM-based clock domain crossing. | Use Scenario: Nanosecond-precision order matching and market data parsing in co-located trading servers. IC Role / Device Role / Timing Role: Configurable logic processes FIX/FAST protocol decoding and risk-checking logic; DDR4 controller buffers market feeds. Use Value: Reduces end-to-end latency by 3.2 µs versus ASIC-based solutions due to parallelizable pipeline stages and on-die memory. |
| Medical Imaging Reconstruction | Test & Measurement Equipment |
Use Scenario: Real-time GPU-accelerated CT/MRI image reconstruction with raw sensor data ingestion. IC Role / Device Role / Timing Role: XCKU15P-L1FFVE1517I acts as PCIe Gen4 endpoint, offloading reconstruction kernels from CPU; GTY lanes receive ADC streams over Aurora 8B10B. Use Value: Sustains 12.8 GB/s sustained throughput from 64-channel ADC array using 32 GTY lanes at 25.78125 Gb/s each. | Use Scenario: Modular PXIe-based oscilloscopes and protocol analyzers requiring flexible sampling and trigger logic. IC Role / Device Role / Timing Role: FPGA implements deep-sample buffer management, real-time FFT, and PCIe Gen4 streaming to host PC. Use Value: Enables 10 GS/s real-time sampling with 16-bit resolution and zero-gap capture using on-chip 72.5 Mb BRAM as circular buffer. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-L2FFVE1517I | Higher speed grade (–2 vs –1), enabling 32.75 Gb/s GTY operation at junction temp ≤ 85°C vs ≤ 100°C | Suitable for thermally constrained environments where full-speed transceivers must operate at extended temperature | Select when guaranteed 32.75 Gb/s link stability is required across full industrial range |
| XCKU115-FLVD1924-2L | 1924-pin FCBGA package, higher logic density (1,124K cells), but only 24 GTY transceivers and no hardened PCIe Gen4 | Better suited for logic-intensive, lower I/O-count applications such as ASIC prototyping | Choose when maximum LUT count outweighs transceiver count and PCIe Gen4 requirement |
Compared with XCKU15P-L1FFVE1517I, the –2 speed grade variant trades thermal margin for guaranteed top transceiver speed, while the XCKU115 offers more logic but fewer high-speed serial resources and lacks integrated PCIe Gen4, making it less optimal for host-connected acceleration.
Availability
XCKU15P-L1FFVE1517I is available at Aetrix Electronics and suitable for 5G infrastructure, financial data processing, and medical imaging systems requiring stable component supply and long-term lifecycle support.
Supply support for XCKU15P-L1FFVE1517I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data centers, AI, embedded, and client markets through FPGA, adaptive SoC, and software-defined platforms.
The Kintex UltraScale+ family targets high-performance, cost-optimized applications demanding balanced logic, memory, and I/O resources - especially in communications, test equipment, and real-time processing systems.
FAQ
What is the maximum supported data rate for GTY transceivers on the XCKU15P-L1FFVE1517I?
The XCKU15P-L1FFVE1517I supports GTY transceivers up to 32.75 Gb/s per lane. This rate is achievable under specified thermal conditions (junction temperature ≤ 100°C) and requires proper PCB layout, reference clock jitter < 500 fs RMS, and appropriate equalization settings. The XCKU15P-L1FFVE1517I datasheet defines valid PMA configurations for this speed grade.
Does the XCKU15P-L1FFVE1517I include a built-in processor subsystem?
Yes, the XCKU15P-L1FFVE1517I integrates dual ARM Cortex-R5F processors operating at up to 600 MHz. These processors run independently of the programmable logic and support lockstep or split-mode operation. They manage configuration, monitoring, and real-time control tasks, and are accessible via the XCKU15P-L1FFVE1517I's dedicated AXI interface.
Can the XCKU15P-L1FFVE1517I be configured via PCIe without external flash memory?
Yes, the XCKU15P-L1FFVE1517I supports PCIe-based configuration through its integrated Configuration Access Port (CAP). This allows host CPU to load partial or full bitstreams directly over PCIe Gen4 without relying on external SPI flash. The XCKU15P-L1FFVE1517I must be powered and held in reset until the host initiates configuration via CAP.
What I/O voltage standards does the XCKU15P-L1FFVE1517I support in HP banks?
The XCKU15P-L1FFVE1517I HP I/O banks support 1.8 V, 1.5 V, 1.35 V, and 1.2 V standards, including SSTL18_I, SSTL15, HSTL_I_15, and POD12. Each bank is independently configurable, enabling mixed-voltage interfaces to DDR4 memory, high-speed ADCs, and SerDes PHYs within a single device.
Is partial reconfiguration supported on the XCKU15P-L1FFVE1517I, and what are the requirements?
Yes, partial reconfiguration is fully supported on the XCKU15P-L1FFVE1517I. It requires Vivado Design Suite 2022.1 or later, properly constrained modular design partitions, and use of the PR_RST_B pin for safe region reset. The XCKU15P-L1FFVE1517I's configuration logic enables dynamic loading of encrypted bitstreams into designated reconfigurable partitions without disrupting static logic or I/O states.
XCKU15P-L1FFVE1517I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 1517-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 65340
- Number of Logic Elements/Cells:
- 1143450
- Total RAM Bits:
- 82329600
- Number of I/O:
- 512
- Number of Gates:
- -
- Voltage - Supply:
- 0.698V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1517-FCBGA (40x40)
XCKU15P-L1FFVE1517I FAQ
1.How can I place an order for XCKU15P-L1FFVE1517I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU15P-L1FFVE1517I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU15P-L1FFVE1517I reliable?
The price and inventory of XCKU15P-L1FFVE1517I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU15P-L1FFVE1517I is usually 5 days.
3.What payment methods are accepted for XCKU15P-L1FFVE1517I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU15P-L1FFVE1517I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU15P-L1FFVE1517I?
XCKU15P-L1FFVE1517I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU15P-L1FFVE1517I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU15P-L1FFVE1517I?
For technical support, including XCKU15P-L1FFVE1517I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU15P-L1FFVE1517I requirements.
6.How does Aetrix verify that XCKU15P-L1FFVE1517I is sourced from the original manufacturer or authorized distributors?
All XCKU15P-L1FFVE1517I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU15P-L1FFVE1517I meets industry standards.
7.What is the process for return or replacement of XCKU15P-L1FFVE1517I?
All XCKU15P-L1FFVE1517I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU15P-L1FFVE1517I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU15P-L1FFVE1517I part is unused and in its original packaging.
Return procedure for XCKU15P-L1FFVE1517I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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