AMD XCKU15P-L2FFVE1517E
- Part No.:
- XCKU15P-L2FFVE1517E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1517-BBGA, FCBGA
- Datasheet:
-
XCKU15P-L2FFVE1517E.pdf
- Description:
- IC FPGA 512 I/O 1517FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XCKU15P-L2FFVE1517E from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,024,000 logic cells, 6,480 DSP slices, and 96.4 Mb of block RAM. It integrates hardened PCIe Gen4 x16, 100G Ethernet MACs, and DDR4 memory controllers, targeting high-bandwidth data processing in 5G infrastructure and radar signal processing systems.
For engineers reviewing the XCKU15P-L2FFVE1517E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate (32.75 Gb/s), I/O voltage support (1.8 V / 1.2 V / 1.0 V), thermal design power (125 W), and package-specific ball map for FFVE1517.
Technical Context
The XCKU15P-L2FFVE1517E implements a heterogeneous architecture with programmable logic fabric, UltraScale+ DSP engines, and integrated hard IP including dual 100G Ethernet subsystems and quad 10G/25G/50G Ethernet PCS/PMA blocks. Its transceivers support PAM4 and NRZ modulation up to 32.75 Gb/s per lane.
It features a 16nm FinFET process, supports JTAG and ICAP configuration interfaces, and includes dedicated clock management tiles with MMCM and PLL resources capable of sub-100 fs jitter performance at 100 MHz output.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,024,000 - total configurable LUT-based resources for complex digital logic implementation |
| DSP Slices | 6,480 - fixed-point and floating-point arithmetic units optimized for high-throughput filtering and FFT |
| Block RAM | 96.4 Mb - distributed on-chip memory for buffering, FIFOs, and lookup tables without external memory latency |
| Transceiver Max Rate | 32.75 Gb/s - supports 100G Ethernet (4×25G), 200G (4×50G), and 400G (8×50G) optical interconnects |
| I/O Standards | LVDS, MIPI D-PHY, SSTL, HSTL, TMDS - enables direct interface to high-speed ADCs, DACs, and display controllers |
| TDP | 125 W - defines thermal envelope requiring active cooling and PCB copper pour planning |
| Configuration Interface | Quad-SPI, BPI, JTAG, ICAP - allows secure, field-upgradable bitstream loading and partial reconfiguration |
Pinout & Package
The XCKU15P-L2FFVE1517E is housed in a 1517-ball Flip-Chip Fine-Pitch Ball Grid Array (FFVBGA) package with 1.0 mm ball pitch and 35 × 35 mm body size. Thermal and mechanical design requires adherence to AMD's FFVE1517 footprint and solder mask specifications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O Bank | Configurable as PS peripherals (UART, SPI, I2C, SDIO) or PL I/O with 1.8 V/1.2 V support |
| GTYP[0:31] | UltraScale+ GTY Transceiver Lane | Each supports 32.75 Gb/s NRZ or 58 Gb/s PAM4; requires AC-coupled differential routing |
| VRP/VRN | Reference Voltage Pins | Provide precision reference for I/O banks; must be decoupled with 100 nF + 10 µF near each pair |
| VCCINT | Core Supply | 1.0 V ±3% supply for logic fabric and CLB; requires low-noise regulation and phase-aligned sequencing |
| INIT_B | Configuration Status | Open-drain active-low signal indicating bitstream load readiness or error condition |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 | Reduces soft logic resource usage by ~250K LUTs and eliminates PHY timing closure effort |
| Dual 100G Ethernet Subsystem | Integrates MAC, PCS, and PMA; supports IEEE 802.3bs with no external SerDes required |
| UltraRAM Blocks | 288 × 72 Kb deep memory blocks enable large on-die buffers without consuming BRAM |
| Partial Reconfiguration Support | Enables dynamic function swapping in operational systems-e.g., switching radar waveform modes without reset |
| Security Features | Includes AES-256 bitstream encryption, HMAC authentication, and tamper detection via eFUSE |
Applications
| 5G Massive MIMO Baseband Processing | Aerospace Radar Signal Processing |
|---|---|
Use Scenario: Real-time beamforming and channel estimation across 64–256 antenna elements in sub-6 GHz and mmWave bands. IC Role / Device Role / Timing Role: Primary baseband processor executing OFDM symbol generation, MIMO precoding, and LDPC decoding pipelines. Use Value: Delivers deterministic <10 µs latency for closed-loop feedback and supports 2×25 Gb/s CPRI/eCPRI fronthaul interface aggregation. | Use Scenario: Pulse-Doppler processing and synthetic aperture radar (SAR) image formation in airborne platforms. IC Role / Device Role / Timing Role: High-throughput digital receiver handling ADC sampling at 2.4 GS/s and real-time STAP filtering. Use Value: Enables >120 dB dynamic range via 6,480 DSP slices and 96.4 Mb on-chip memory for coherent integration windows. |
| High-Frequency Trading Acceleration | Test & Measurement Equipment |
Use Scenario: Low-latency order matching and market data parsing in FPGA-accelerated trading engines. IC Role / Device Role / Timing Role: Deterministic packet classifier and ultra-low-jitter timestamping engine synchronized to GPS-disciplined 10 MHz reference. Use Value: Achieves <50 ns packet-to-packet jitter and sub-200 ns end-to-end latency using hardened 10G Ethernet MACs and MMCM-based clock networks. | Use Scenario: Modular oscilloscope and protocol analyzer platforms requiring multi-channel synchronization and deep memory capture. IC Role / Device Role / Timing Role: Timebase controller and real-time trigger processor managing 16-channel 10 GS/s ADC acquisition and PCIe Gen4 streaming to host. Use Value: Supports 256 MS deep memory buffer with zero-gap capture via UltraRAM and deterministic DMA scheduling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-L1FFVE1517I | Lower speed grade (-1 vs -2): max transceiver rate 25.78 Gb/s; reduced static timing margin at 32.75 Gb/s | Suitable for 25G/50G Ethernet but not 100G/400G optical interconnects requiring full 32.75 Gb/s | Select when thermal budget is constrained and 100G line rate is not required. |
| XCKU19P-L2FFVE1760E | Higher density: 1,305,000 logic cells, 7,680 DSP slices, 115.2 Mb BRAM; same transceiver spec and package footprint | Supports larger algorithm partitioning and higher channel count in radar/5G systems | Choose for scalability headroom where future firmware upgrades demand additional logic or memory. |
Compared with XCKU15P-L2FFVE1517E, the -1 speed grade trades line-rate capability for lower power and cost, while the XCKU19P offers scalable logic and memory without changing board layout or transceiver interface design.
Availability
XCKU15P-L2FFVE1517E is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar, and high-frequency trading systems requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for XCKU15P-L2FFVE1517E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data center, AI, embedded, and client applications.
The Kintex UltraScale+ family delivers high-performance, cost-optimized FPGA solutions for bandwidth-intensive, low-latency applications including wireless infrastructure, defense electronics, and test equipment.
FAQ
What is the maximum transceiver line rate supported by the XCKU15P-L2FFVE1517E?
The XCKU15P-L2FFVE1517E supports a maximum transceiver line rate of 32.75 Gb/s using its GTY transceivers in NRZ mode. This enables compliance with IEEE 802.3bs for 100G Ethernet and supports 400G configurations using PAM4 signaling. The -2 speed grade guarantees this performance under industrial temperature conditions with appropriate power and thermal design for the XCKU15P-L2FFVE1517E.
Does the XCKU15P-L2FFVE1517E include hardened PCIe Gen4 support?
Yes, the XCKU15P-L2FFVE1517E integrates a hardened PCIe Gen4 x16 endpoint/root port block. This includes physical layer (PHY), data link layer (DLL), and transaction layer (TLP) logic, eliminating the need for soft IP implementation. The hardened block reduces logic utilization and ensures deterministic timing closure for the XCKU15P-L2FFVE1517E in high-speed host interface applications.
What I/O standards are supported by the XCKU15P-L2FFVE1517E?
The XCKU15P-L2FFVE1517E supports LVDS, MIPI D-PHY, SSTL, HSTL, and TMDS I/O standards across its 500+ user I/O pins. Each bank operates at selectable voltages (1.8 V, 1.2 V, or 1.0 V), enabling direct interfacing with high-speed ADCs, DDR4 memory, and display controllers without level-shifting circuitry for the XCKU15P-L2FFVE1517E.
How much block RAM is available in the XCKU15P-L2FFVE1517E?
The XCKU15P-L2FFVE1517E provides 96.4 Mb of total block RAM, implemented as 2,880 × 36 Kb BRAM primitives. These can be configured as true dual-port RAM, shift registers, or ROM. This capacity supports large on-chip buffers for radar pulse compression or 5G channel coding without external memory access latency in the XCKU15P-L2FFVE1517E.
Is partial reconfiguration supported on the XCKU15P-L2FFVE1517E?
Yes, the XCKU15P-L2FFVE1517E fully supports partial reconfiguration through ICAP and PCIe-based configuration ports. This allows dynamic swapping of functional modules-such as different radar waveform generators or 5G numerology sets-without resetting the entire device. Partial reconfiguration is production-ready and validated in AMD Vivado 2023.2 for the XCKU15P-L2FFVE1517E.
XCKU15P-L2FFVE1517E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 1517-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 65340
- Number of Logic Elements/Cells:
- 1143450
- Total RAM Bits:
- 82329600
- Number of I/O:
- 512
- Number of Gates:
- -
- Voltage - Supply:
- 0.698V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1517-FCBGA (40x40)
XCKU15P-L2FFVE1517E FAQ
1.How can I place an order for XCKU15P-L2FFVE1517E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU15P-L2FFVE1517E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU15P-L2FFVE1517E reliable?
The price and inventory of XCKU15P-L2FFVE1517E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU15P-L2FFVE1517E is usually 5 days.
3.What payment methods are accepted for XCKU15P-L2FFVE1517E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU15P-L2FFVE1517E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU15P-L2FFVE1517E?
XCKU15P-L2FFVE1517E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU15P-L2FFVE1517E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU15P-L2FFVE1517E?
For technical support, including XCKU15P-L2FFVE1517E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU15P-L2FFVE1517E requirements.
6.How does Aetrix verify that XCKU15P-L2FFVE1517E is sourced from the original manufacturer or authorized distributors?
All XCKU15P-L2FFVE1517E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU15P-L2FFVE1517E meets industry standards.
7.What is the process for return or replacement of XCKU15P-L2FFVE1517E?
All XCKU15P-L2FFVE1517E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU15P-L2FFVE1517E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU15P-L2FFVE1517E part is unused and in its original packaging.
Return procedure for XCKU15P-L2FFVE1517E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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