AMD XCKU19P-1FFVB2104E

Overview

XCKU19P-1FFVB2104E from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,548,000 logic cells, 7,245 DSP slices, and 56.8 Mb of block RAM. It supports PCIe Gen4 x16, 32 GTY transceivers (up to 32.75 Gb/s), and DDR4 memory interfaces up to 2400 Mbps - deployed in 5G wireless infrastructure baseband processing.

For engineers reviewing the XCKU19P-1FFVB2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver count and speed, DSP slice density, I/O voltage support (1.2 V/1.35 V/1.8 V), and thermal design power (TDP) for air-cooled 2104-pin flip-chip BGA systems.

Technical Context

The XCKU19P-1FFVB2104E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DMA), and multi-rate transceivers. It integrates dual ARM Cortex-A53 application processors and dual RISC-V microcontrollers for real-time control and system management.

Configuration occurs via quad-SPI, BPI, or JTAG; bitstream encryption and HMAC authentication are supported. The device targets high-throughput, low-latency signal processing where deterministic timing closure and partial reconfiguration are required.

Key Specifications

Pinout & Package

Package: 2104-pin Flip-Chip BGA (FFVB2104), 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant, thermal lid integrated.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCKU15P-2FFVA1156E and XCKU060-2FFVA1517I, the XCKU19P-1FFVB2104E delivers highest logic density and transceiver count in the Kintex UltraScale+ family, enabling full 5G NR baseband and AI accelerator implementations without external co-processors.

Availability

XCKU19P-1FFVB2104E is available at Aetrix Electronics and suitable for 5G infrastructure, high-performance computing accelerators, and defense radar systems requiring stable component supply across multi-year production cycles.

Supply support for XCKU19P-1FFVB2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.

The Kintex UltraScale+ family targets high-throughput, low-latency applications such as wireless infrastructure, test & measurement, and aerospace systems where performance-per-watt and integration density are critical.

FAQ

What is the maximum data rate supported by the GTY transceivers on the XCKU19P-1FFVB2104E?

The XCKU19P-1FFVB2104E features 32 GTY transceivers each supporting up to 32.75 Gb/s. This enables protocols including 100G Ethernet (4×25G), 200G (8×25G), and eCPRI at 24.33 Gb/s. The actual achievable rate depends on PCB stack-up, reference clock quality, and equalization settings configured in Vivado.

Does the XCKU19P-1FFVB2104E include a hard processor system?

Yes, the XCKU19P-1FFVB2104E integrates a dual-core ARM Cortex-A53 application processor and dual RISC-V microcontrollers. These are part of the hardened subsystem and operate independently of the programmable logic fabric, enabling concurrent real-time control and high-level OS execution alongside FPGA-accelerated functions.

What I/O voltage standards does the XCKU19P-1FFVB2104E support?

The XCKU19P-1FFVB2104E supports multiple I/O standards including LVCMOS (1.2 V/1.35 V/1.8 V), SSTL, HSTL, MIPI D-PHY, and differential LVDS. Each I/O bank is independently configurable, allowing mixed-voltage interfaces on a single device - essential for interfacing with DDR4, sensors, and legacy peripherals simultaneously.

Is partial reconfiguration supported on the XCKU19P-1FFVB2104E?

Yes, the XCKU19P-1FFVB2104E fully supports partial reconfiguration through Vivado Design Suite. This allows dynamic replacement of logic modules during operation without resetting the entire device - critical for applications like adaptive radio protocols or field-upgradable AI models where continuous uptime is mandatory.

What is the thermal design power (TDP) of the XCKU19P-1FFVB2104E?

The XCKU19P-1FFVB2104E has a typical thermal design power (TDP) of 45 W under representative high-activity workloads. This value guides heatsink selection and airflow requirements for convection-cooled systems. Actual power varies based on logic utilization, transceiver activity, and I/O switching rates, and must be validated using Xilinx Power Estimator (XPE).