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AMD XCKU19P-1FFVB2104I
- Part No.:
- XCKU19P-1FFVB2104I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCKU19P-1FFVB2104I.pdf
- Description:
- IC FPGA KINTEX UP 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,101
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Product details
Overview
XCKU19P-1FFVB2104I from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,548,000 logic cells, 7,240 DSP slices, and 96.4 Mb of block RAM. It supports PCIe Gen4 x16, 25.8 Gb/s GTY transceivers, and operates at -1 speed grade with industrial temperature range (–40°C to +100°C). It is deployed in 5G radio units and high-throughput data acceleration systems.
For engineers reviewing the XCKU19P-1FFVB2104I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, logic capacity, thermal envelope, and industrial-grade reliability for embedded acceleration and wireless infrastructure.
Technical Context
The XCKU19P-1FFVB2104I implements a heterogeneous architecture with programmable logic, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC), and ultra-fast GTY transceivers. It integrates dual ARM Cortex-A53 processors for real-time control and system management.
It supports partial reconfiguration, AXI4 interconnect fabric, and DDR4 memory interfaces up to 2400 MT/s. Configuration is via quad-SPI or BPI flash, with secure boot and AES-256 bitstream encryption enabled.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,548,000 - determines maximum combinational/sequential logic density for complex algorithm implementation |
| DSP Slices | 7,240 - enables high-throughput fixed/floating-point math for signal processing and AI inference |
| Block RAM | 96.4 Mb - provides on-die memory for buffering, FIFOs, and lookup tables without external DRAM |
| GTY Transceivers | 64 × 25.8 Gb/s - supports 100G Ethernet, CPRI/eCPRI, and JESD204C interfaces |
| PCIe Interface | Gen4 x16 - delivers 32 GB/s bidirectional bandwidth for host CPU/FPGA co-processing |
| Operating Temp | –40°C to +100°C - qualified for industrial and outdoor wireless infrastructure deployment |
Pinout & Package
The XCKU19P-1FFVB2104I is housed in a 2104-pin Flip-Chip Ball Grid Array (FCBGA) package with 35 mm × 35 mm body size and 0.8 mm ball pitch. Thermal and power delivery are optimized via dedicated VCCINT/VCCAUX/VCCO banks and integrated thermal vias.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O | Configurable as SDIO, UART, SPI, I2C, or GPIO for peripheral control and boot interface |
| HP[0:63] | High-Performance I/O | Supports DDR4, LVDS, and sub-1.0V signaling with programmable drive strength and termination |
| HR[0:47] | High-Range I/O | Handles 1.8V/2.5V/3.3V interfaces including PCIe reference clocks and Gigabit Ethernet PHYs |
| CLK_IN_0/1 | Dedicated Clock Input | Accepts differential clock sources for MMCM/PLL synchronization with jitter tolerance < 1 ps RMS |
| INIT_B, PROGRAM_B | Configuration Control | Active-low signals managing configuration state machine, fallback, and secure boot enforcement |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 Controller | Reduces RTL integration effort and ensures protocol compliance without soft-core overhead |
| ARM Cortex-A53 Dual-Core Subsystem | Enables Linux-based system management alongside programmable logic for heterogeneous compute |
| AES-256 Bitstream Encryption | Protects intellectual property against physical readout and unauthorized cloning |
| Partial Reconfiguration Support | Allows dynamic logic module swapping during operation for multi-mode radio or adaptive compute workloads |
| UltraScale+ Memory Controller | Manages DDR4 up to 2400 MT/s with ECC support for mission-critical data integrity |
Applications
| 5G Massive MIMO Radio Unit | Cloud-Native Data Acceleration |
|---|---|
Use Scenario: Real-time beamforming, channel estimation, and digital pre-distortion in active antenna systems. IC Role / Device Role / Timing Role: Primary baseband processing engine with deterministic low-latency signal path and synchronized multi-channel sampling. Use Value: Enables 64T64R configurations using integrated GTY transceivers and 7,240 DSP slices for real-time matrix computation. | Use Scenario: Offloading encryption, compression, and pattern matching from CPU in hyperscale servers. IC Role / Device Role / Timing Role: Co-processor connected via PCIe Gen4 x16 with shared memory access through AXI4 interconnect. Use Value: Delivers >5× throughput improvement over software-only implementations while maintaining deterministic latency under load. |
| Industrial Edge AI Inference | Test & Measurement Equipment |
Use Scenario: On-device neural network inference for predictive maintenance in factory automation systems. IC Role / Device Role / Timing Role: Heterogeneous accelerator combining ARM A53 for OS services and programmable logic for custom CNN engines. Use Value: Achieves 128 GOPS INT8 performance within 25W TDP using logic cells and DSP slices without external AI ASICs. | Use Scenario: High-fidelity signal generation and analysis in modular PXIe platforms. IC Role / Device Role / Timing Role: Timing and waveform synthesis core with ultra-low-jitter GTY outputs and precise sample alignment. Use Value: Supports 12-bit DAC/ADC sampling at 2.5 GS/s with sub-100 fs jitter via dedicated clock networks and MMCM calibration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-2FFVA1156E | Fewer logic cells (1,085K), lower speed grade (+2), commercial temp range only (0°C to +85°C) | Suitable for lab validation and non-ruggedized server acceleration where thermal margin is relaxed | Select when cost sensitivity outweighs industrial temperature and transceiver count requirements |
| XCKU060-2FFVA1156I | Reduced DSP slices (3,520), no hardened PCIe Gen4, limited GTY count (32 lanes) | Targeted at mid-tier radar processing and video analytics with lower throughput demands | Choose for designs requiring industrial temp but not full 100G connectivity or AI-scale compute density |
Compared with XCKU19P-1FFVB2104I, the XCKU15P-2FFVA1156E trades industrial temperature and transceiver bandwidth for lower unit cost, while the XCKU060-2FFVA1156I reduces logic and DSP resources to meet cost and power constraints in less demanding edge applications.
Availability
XCKU19P-1FFVB2104I is available at Aetrix Electronics and suitable for 5G infrastructure, cloud acceleration, and industrial edge AI applications requiring stable component supply across extended product lifecycles.
Supply support for XCKU19P-1FFVB2104I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, embedded systems, and high-performance computing.
The Kintex UltraScale+ family targets high-bandwidth, low-latency applications in wireless infrastructure, test equipment, and real-time embedded vision systems.
FAQ
What is the maximum supported DDR4 data rate for XCKU19P-1FFVB2104I?
The XCKU19P-1FFVB2104I supports DDR4 memory interfaces up to 2400 MT/s with built-in memory controller and ECC capability. This rate is validated across all I/O banks designated for memory interface use, and requires proper PCB layout adherence to AMD's UG571 guidelines for signal integrity and timing closure.
Does XCKU19P-1FFVB2104I include a hard processor system?
Yes, the XCKU19P-1FFVB2104I integrates a dual-core ARM Cortex-A53 processor subsystem with 32 KB L1 cache per core and 1 MB shared L2 cache. This hard processor system runs Linux or real-time OSes and manages configuration, security, and peripheral control independently of the programmable logic fabric.
What transceiver protocols are natively supported by XCKU19P-1FFVB2104I?
The XCKU19P-1FFVB2104I natively supports PCIe Gen4, 100G Ethernet (RS-FEC/FC-FEC), CPRI, eCPRI, JESD204B/C, and SATA/SAS via its GTY transceivers. Protocol support is implemented in hardened logic blocks-not soft IP-ensuring deterministic latency and reduced resource consumption.
Is XCKU19P-1FFVB2104I qualified for industrial temperature operation?
Yes, the XCKU19P-1FFVB2104I is rated for industrial temperature range (–40°C to +100°C) and carries the "I" suffix in its part number to denote this qualification. Thermal design must account for 2104-ball FCBGA package dissipation under worst-case logic utilization and transceiver activity.
How many GTY transceiver quads does XCKU19P-1FFVB2104I contain?
The XCKU19P-1FFVB2104I contains 16 GTY transceiver quads, totaling 64 transceiver lanes. Each quad supports independent data rates up to 25.8 Gb/s and can be configured for protocols including PCIe Gen4, 100G Ethernet, and JESD204C with full lane bonding and clock correction.
XCKU19P-1FFVB2104I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 105300
- Number of Logic Elements/Cells:
- 1842750
- Total RAM Bits:
- 63753421
- Number of I/O:
- 540
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCKU19P-1FFVB2104I FAQ
1.How can I place an order for XCKU19P-1FFVB2104I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU19P-1FFVB2104I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU19P-1FFVB2104I reliable?
The price and inventory of XCKU19P-1FFVB2104I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU19P-1FFVB2104I is usually 5 days.
3.What payment methods are accepted for XCKU19P-1FFVB2104I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU19P-1FFVB2104I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU19P-1FFVB2104I?
XCKU19P-1FFVB2104I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU19P-1FFVB2104I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU19P-1FFVB2104I?
For technical support, including XCKU19P-1FFVB2104I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU19P-1FFVB2104I requirements.
6.How does Aetrix verify that XCKU19P-1FFVB2104I is sourced from the original manufacturer or authorized distributors?
All XCKU19P-1FFVB2104I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU19P-1FFVB2104I meets industry standards.
7.What is the process for return or replacement of XCKU19P-1FFVB2104I?
All XCKU19P-1FFVB2104I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU19P-1FFVB2104I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU19P-1FFVB2104I part is unused and in its original packaging.
Return procedure for XCKU19P-1FFVB2104I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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