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AMD XCKU19P-1FFVJ1760E
- Part No.:
- XCKU19P-1FFVJ1760E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XCKU19P-1FFVJ1760E.pdf
- Description:
- IC FPGA KINTEX UP 1760FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,094
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Product details
Overview
XCKU19P-1FFVJ1760E from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,548,000 logic cells, 8,520 DSP slices, and 96.4 Mb of block RAM. It supports PCIe Gen4 x16, 25.8 Gb/s transceivers, and DDR4 memory interfaces up to 2400 Mbps. It is deployed in high-bandwidth data center acceleration and 5G radio unit baseband processing.
For engineers reviewing the XCKU19P-1FFVJ1760E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, on-chip memory capacity, I/O voltage support (1.8 V/1.2 V), and thermal design power (TDP) for air-cooled rack deployments.
Technical Context
The XCKU19P-1FFVJ1760E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks for PCIe Gen4, Ethernet MACs, and memory controllers, and scalable transceiver banks supporting PAM4 and NRZ signaling. It integrates UltraScale+ SelectIO technology with support for SSTL, HSTL, and MIPI D-PHY standards.
Configuration is performed via quad-SPI, BPI, or JTAG, with bitstream encryption using AES-256 and HMAC-SHA-256. The device includes dedicated clock management tiles with MMCM and PLL resources for low-jitter clock synthesis across multiple domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,548,000 - determines maximum combinational and sequential logic capacity for RTL implementation |
| DSP Slices | 8,520 - enables parallel fixed/floating-point computation for signal processing pipelines |
| Block RAM | 96.4 Mb - provides on-die memory for buffering, FIFOs, and lookup tables without external DRAM |
| Transceiver Max Rate | 25.8 Gb/s - supports 100G/200G Ethernet, CPRI/eCPRI, and JESD204C interfaces |
| I/O Standards | SSTL-18, HSTL-I, MIPI D-PHY - enables direct interfacing with DDR4, LPDDR4, and image sensors |
| TDP | 45 W - defines thermal envelope for passive or forced-air cooling in 1U server chassis |
Pinout & Package
Package: 1760-pin FCBGA (Fine-Pitch Column Grid Array), 49.5 mm × 49.5 mm, 0.8 mm pitch, RoHS-compliant, thermal lid integrated.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTREFCLK0 | Reference Clock Input | Provides clean 100–300 MHz reference for GTY transceiver banks |
| MRCC[0] | Multi-Rate Clock Capable | Primary single-ended clock input supporting 100–800 MHz operation |
| HRIO_BANK65 | High-Range I/O Bank | Supports 1.8 V/1.2 V I/O with programmable slew and drive strength |
| CONFIG_IO | Configuration I/O | Carries configuration data during master SPI or slave selectMAP mode |
| VCCAUX | Analog Auxiliary Supply | 1.8 V supply for PLLs, transceivers, and configuration circuitry |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen4 Hard IP | Dedicated root port and endpoint blocks enabling full x16 link without soft logic overhead |
| UltraScale+ Memory Controller | Integrated DDR4/LPDDR4 controller with ECC, 2400 Mbps data rate, and AXI4 interface |
| AES-256 Bitstream Encryption | Hardware-accelerated encryption preventing unauthorized configuration and IP theft |
| Partial Reconfiguration Support | Enables dynamic logic swapping in operational systems without full reconfiguration downtime |
| Thermal Monitoring Diode | On-die sensor providing real-time junction temperature feedback for fan control and throttling |
Applications
| 5G Massive MIMO Radio Unit | Data Center SmartNIC Acceleration |
|---|---|
Use Scenario: Real-time beamforming and channel estimation in sub-6 GHz and mmWave base stations. IC Role / Device Role / Timing Role: FPGA fabric executes custom OFDM symbol processing, while GTY transceivers handle eCPRI fronthaul at 25 Gb/s. Use Value: Enables deterministic latency under 5 µs and supports 64 antenna element concurrency per RU. | Use Scenario: Offloading TCP/IP stack, RDMA, and packet classification in cloud server NICs. IC Role / Device Role / Timing Role: Configurable datapath engine with PCIe Gen4 x16 host interface and dual 100G Ethernet MACs. Use Value: Reduces CPU utilization by >70% and delivers <800 ns packet processing latency. |
| Radar Signal Processing | High-Frequency Trading Platform |
Use Scenario: Pulse-Doppler processing and CFAR detection in automotive and defense radar systems. IC Role / Device Role / Timing Role: DSP-intensive kernel execution using 8,520 slices, synchronized to 122.88 MHz sampling clocks. Use Value: Achieves 128-point FFT in <12 ns with pipelined architecture and block RAM-based twiddle storage. | Use Scenario: Ultra-low-latency order matching and market data parsing in co-located trading engines. IC Role / Device Role / Timing Role: Deterministic time-stamping and protocol translation between FIX, FAST, and binary exchange feeds. Use Value: Guarantees sub-25 ns timestamp resolution and <150 ns end-to-end pipeline latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-2FFVA1156E | Fewer logic cells (1,085K), lower transceiver count (40 vs. 64), same 25.8 Gb/s rate | Targeted at mid-bandwidth 5G DU and edge AI inference where cost-per-Gbps matters | Select when full XCKU19P capacity is unused and BOM cost reduction is prioritized |
| XCVU13P-2FLGA2577E | Higher logic density (1,925K), larger package (2577-pin), higher TDP (55 W) | Suitable for multi-terabit optical transport and AI training accelerators requiring >128 GB/s memory bandwidth | Choose when scaling beyond XCKU19P's 96.4 Mb block RAM and PCIe Gen4 x16 bandwidth ceiling |
Compared with XCKU15P-2FFVA1156E and XCVU13P-2FLGA2577E, the XCKU19P-1FFVJ1760E delivers optimal balance of transceiver count, on-chip memory, and thermal envelope for air-cooled 5G RU and SmartNIC designs-avoiding overdesign while meeting deterministic latency SLAs.
Availability
XCKU19P-1FFVJ1760E is available at Aetrix Electronics and suitable for 5G infrastructure, data center acceleration, and radar signal processing requiring stable component supply across multi-year production cycles.
Supply support for XCKU19P-1FFVJ1760E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, AI, and embedded systems.
The Kintex UltraScale+ family targets high-throughput, low-latency applications including wireless infrastructure, compute acceleration, and real-time signal processing.
FAQ
What is the maximum supported memory interface speed for XCKU19P-1FFVJ1760E?
The XCKU19P-1FFVJ1760E supports DDR4 memory interfaces up to 2400 Mbps data rate with integrated memory controller and hardware ECC. This capability is verified in UG576 v1.14 and applies directly to the XCKU19P-1FFVJ1760E package and speed grade -1.
Does XCKU19P-1FFVJ1760E include hardened PCIe Gen4 IP?
Yes, the XCKU19P-1FFVJ1760E integrates dedicated hard IP blocks for PCIe Gen4 root port and endpoint functionality, supporting full x16 lane width and 16 GT/s per lane. This eliminates soft logic resource usage and guarantees timing closure per UG578.
What is the thermal design power (TDP) of XCKU19P-1FFVJ1760E?
The XCKU19P-1FFVJ1760E has a typical thermal design power of 45 W under worst-case operating conditions defined in DS925. This value guides heatsink sizing and airflow requirements for 1U server and outdoor RU enclosures.
Can XCKU19P-1FFVJ1760E support partial reconfiguration?
Yes, the XCKU19P-1FFVJ1760E supports runtime partial reconfiguration through Vivado Design Suite v2022.2+, enabling dynamic logic module swaps without system reset. This feature is documented in UG909 and confirmed for the XCKU19P-1FFVJ1760E speed grade -1.
What transceiver protocols does XCKU19P-1FFVJ1760E support at 25.8 Gb/s?
The XCKU19P-1FFVJ1760E GTY transceivers support 25.8 Gb/s operation for 100G Ethernet (4×25G), eCPRI, JESD204C, and CPRI over optical or copper interconnects. Protocol compliance is validated per UG578 and applies to all 64 transceiver quads in the XCKU19P-1FFVJ1760E.
XCKU19P-1FFVJ1760E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 105300
- Number of Logic Elements/Cells:
- 1842750
- Total RAM Bits:
- 63753421
- Number of I/O:
- 540
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1760-FCBGA (42.5x42.5)
XCKU19P-1FFVJ1760E FAQ
1.How can I place an order for XCKU19P-1FFVJ1760E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU19P-1FFVJ1760E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU19P-1FFVJ1760E reliable?
The price and inventory of XCKU19P-1FFVJ1760E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU19P-1FFVJ1760E is usually 5 days.
3.What payment methods are accepted for XCKU19P-1FFVJ1760E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU19P-1FFVJ1760E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU19P-1FFVJ1760E?
XCKU19P-1FFVJ1760E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU19P-1FFVJ1760E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU19P-1FFVJ1760E?
For technical support, including XCKU19P-1FFVJ1760E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU19P-1FFVJ1760E requirements.
6.How does Aetrix verify that XCKU19P-1FFVJ1760E is sourced from the original manufacturer or authorized distributors?
All XCKU19P-1FFVJ1760E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU19P-1FFVJ1760E meets industry standards.
7.What is the process for return or replacement of XCKU19P-1FFVJ1760E?
All XCKU19P-1FFVJ1760E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU19P-1FFVJ1760E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU19P-1FFVJ1760E part is unused and in its original packaging.
Return procedure for XCKU19P-1FFVJ1760E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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