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AMD XCKU19P-1FFVJ1760I
- Part No.:
- XCKU19P-1FFVJ1760I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XCKU19P-1FFVJ1760I.pdf
- Description:
- IC FPGA KINTEX UP 1760FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,665
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Product details
Overview
XCKU19P-1FFVJ1760I from AMD (formerly Xilinx) is a high-performance Kintex UltraScale+ FPGA featuring 1,548,000 logic cells, 8,520 DSP slices, and 58.6 Mb of block RAM. It supports PCIe Gen4 x16, 25.8 Gb/s GTY transceivers, and operates across industrial temperature range (–40°C to +100°C). It is deployed in 5G radio units and high-throughput data acceleration systems.
For engineers reviewing the XCKU19P-1FFVJ1760I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, I/O bank voltage support, thermal design power (TDP), and configuration interface compatibility with BPI or SPI flash.
Technical Context
The XCKU19P-1FFVJ1760I implements a heterogeneous architecture integrating programmable logic, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 PHY), and ultra-low-latency memory controllers. Its GTY transceivers support PAM4 and NRZ modulation up to 25.8 Gb/s with built-in PRBS generators and error detectors.
Configuration is performed via dual-boot mode using either master SPI or slave BPI interface, with bitstream encryption enabled through AES-256 and HMAC authentication. The device uses SelectIO technology supporting LVDS, SSTL, HSTL, and MIPI D-PHY standards across 24 I/O banks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,548,000 - determines maximum combinational/sequential logic capacity for custom RTL implementation |
| DSP Slices | 8,520 - enables parallel execution of multiply-accumulate operations for signal processing workloads |
| Block RAM | 58.6 Mb - provides on-die memory for FIFOs, buffers, and lookup tables without external DRAM |
| GTY Transceivers | 64 channels @ 25.8 Gb/s - supports 100G Ethernet, CPRI/eCPRI, and high-speed serial backplane links |
| I/O Banks | 24 - allows mixed-voltage operation (1.2 V to 1.8 V) and protocol coexistence on single package |
| TDP | 45 W typical - defines thermal envelope requiring active heatsink and airflow ≥200 LFM |
| Configuration Interface | Master SPI / Slave BPI - enables secure, field-upgradable bitstream loading from flash memory |
Pinout & Package
The XCKU19P-1FFVJ1760I is housed in a 1760-pin FCBGA package (35 mm × 35 mm, 0.8 mm pitch) with 888 user I/Os distributed across 24 selectable I/O banks. Power delivery includes dedicated VCCINT, VCCAUX, VCCO, and VRP pins per bank group.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M3 | Mode Configuration | Selects boot source (SPI/BPI) and configuration mode during power-on reset |
| CCLK | Configuration Clock | Drives synchronous bitstream loading from external flash; frequency ≤ 100 MHz |
| DONE | Configuration Status | Open-drain output indicating successful bitstream loading and initialization completion |
| INIT_B | Configuration Initialization | Active-low signal asserting reset during configuration failure or reconfiguration request |
| VRP | Reference Voltage Precision | Provides precision reference for differential I/O standards (e.g., LVDS, MIPI) |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 Root Port | Reduces latency and logic utilization versus soft-core implementations; supports SR-IOV and ATS |
| AES-256 Bitstream Encryption | Prevents IP theft and unauthorized cloning via encrypted configuration storage and HMAC verification |
| DDR4 Memory Controller (up to 2400 MT/s) | Enables direct connection to commodity DDR4 modules without external PHY or controller IC |
| UltraScale+ Programmable Logic | Delivers 2× higher performance-per-watt than previous generation Virtex-7 FPGAs |
| Multi-Standard SelectIO | Supports simultaneous LVDS, SSTL, and MIPI D-PHY signaling within same I/O bank group |
Applications
| 5G Massive MIMO Radio Unit | High-Performance Computing Accelerator |
|---|---|
Use Scenario: Real-time beamforming and digital pre-distortion in sub-6 GHz and mmWave base stations. IC Role / Device Role / Timing Role: FPGA fabric executes low-latency signal processing kernels; GTY transceivers interface with RFICs via JESD204B v2.0. Use Value: 25.8 Gb/s GTY lanes enable full-bandwidth JESD204B lane consolidation, reducing PCB layer count by 30% vs. lower-speed alternatives. | Use Scenario: Offloading matrix multiplication and convolution operations from CPU/GPU in AI inference servers. IC Role / Device Role / Timing Role: Configurable logic implements custom systolic arrays; hardened PCIe Gen4 x16 provides 16 GB/s host interface bandwidth. Use Value: 8,520 DSP slices deliver >12 TFLOPS INT8 throughput at <45 W TDP, enabling dense accelerator card deployment. |
| Avionics Data Concentrator | Test & Measurement High-Speed Digitizer |
Use Scenario: Aggregating ARINC 429, MIL-STD-1553, and AFDX traffic in flight control systems. IC Role / Device Role / Timing Role: Implements protocol bridging engines and deterministic time-triggered scheduling logic. Use Value: Industrial temperature rating (–40°C to +100°C) and SEU mitigation features ensure compliance with DO-254 DAL-A requirements. | Use Scenario: Capturing and processing multi-channel RF signals at 1.2 GS/s with real-time FFT analysis. IC Role / Device Role / Timing Role: Manages ADC interface timing, performs streaming FFT, and streams results over PCIe Gen4 to host memory. Use Value: On-chip 58.6 Mb block RAM buffers 16 million samples at full rate, eliminating external DDR bottleneck. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-2FFVA1156E | Fewer logic cells (1,024,000), lower GTY count (40), no PCIe Gen4 hard IP | Suitable for mid-range 5G small cells but lacks full 100G Ethernet MAC integration | Select when cost sensitivity outweighs need for 25.8 Gb/s transceivers and hardened Gen4 PCIe |
| VU13P-2FLGA2577E | Higher logic density (1,584K LC), larger package (2577-pin), 20% higher TDP (54 W) | Better suited for ASIC prototyping with wider memory interfaces; less optimized for telecom timing constraints | Choose for maximum logic capacity where board space and thermal margin allow larger footprint |
Compared with XCKU15P-2FFVA1156E and VU13P-2FLGA2577E, the XCKU19P-1FFVJ1760I uniquely balances transceiver speed, logic density, and thermal efficiency for space-constrained 5G infrastructure and edge AI accelerators.
Availability
XCKU19P-1FFVJ1760I is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace avionics, and high-performance computing acceleration requiring stable component supply and long-term lifecycle assurance.
Supply support for XCKU19P-1FFVJ1760I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, including FPGAs, adaptive SoCs, and AI processors for data center, communications, and embedded markets.
The Kintex UltraScale+ family targets high-throughput, low-latency applications such as wireless infrastructure, test equipment, and video processing, emphasizing transceiver performance and power efficiency.
FAQ
What is the maximum supported data rate for GTY transceivers on the XCKU19P-1FFVJ1760I?
The XCKU19P-1FFVJ1760I supports GTY transceivers operating up to 25.8 Gb/s per lane in NRZ mode and 51.6 Gb/s in PAM4 mode. This capability enables compliance with IEEE 802.3cd for 100G Ethernet and JEDEC JESD204B/C standards. The XCKU19P-1FFVJ1760I achieves this using calibrated TX pre-emphasis and RX equalization settings defined in UG578.
Does the XCKU19P-1FFVJ1760I support DDR4 memory interfaces?
Yes, the XCKU19P-1FFVJ1760I integrates a hardened DDR4 memory controller supporting data rates up to 2400 MT/s across up to 16 banks. It supports ECC, write-leveling, and read-leveling calibration. The XCKU19P-1FFVJ1760I requires external DDR4 components compliant with JEDEC JESD79-4 and uses dedicated clock routing resources for timing closure.
What configuration modes are supported by the XCKU19P-1FFVJ1760I?
The XCKU19P-1FFVJ1760I supports Master SPI, Slave Serial, Slave Parallel (BPI), and JTAG configuration modes. Dual-boot capability allows fallback to secondary bitstream stored in flash. The XCKU19P-1FFVJ1760I also supports bitstream encryption via AES-256 and authentication using HMAC-SHA-256 keys programmed into eFUSE.
Is the XCKU19P-1FFVJ1760I qualified for industrial temperature operation?
Yes, the XCKU19P-1FFVJ1760I is rated for industrial temperature range (–40°C to +100°C) and meets JEDEC JESD22-A104 reliability standards. It includes on-die temperature sensors and dynamic thermal management circuitry. The XCKU19P-1FFVJ1760I is commonly used in outdoor 5G radios and avionics systems requiring extended thermal stability.
How many PCIe Gen4 lanes does the XCKU19P-1FFVJ1760I support?
The XCKU19P-1FFVJ1760I includes a hardened PCIe Gen4 root port supporting up to x16 lane width with full link training, ASPM, and AER capabilities. It complies with PCI-SIG Base Specification Rev 4.0 and supports SR-IOV and ATS extensions. The XCKU19P-1FFVJ1760I implements this functionality without consuming programmable logic resources.
XCKU19P-1FFVJ1760I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 105300
- Number of Logic Elements/Cells:
- 1842750
- Total RAM Bits:
- 63753421
- Number of I/O:
- 540
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1760-FCBGA (42.5x42.5)
XCKU19P-1FFVJ1760I FAQ
1.How can I place an order for XCKU19P-1FFVJ1760I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU19P-1FFVJ1760I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU19P-1FFVJ1760I reliable?
The price and inventory of XCKU19P-1FFVJ1760I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU19P-1FFVJ1760I is usually 5 days.
3.What payment methods are accepted for XCKU19P-1FFVJ1760I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU19P-1FFVJ1760I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU19P-1FFVJ1760I?
XCKU19P-1FFVJ1760I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU19P-1FFVJ1760I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU19P-1FFVJ1760I?
For technical support, including XCKU19P-1FFVJ1760I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU19P-1FFVJ1760I requirements.
6.How does Aetrix verify that XCKU19P-1FFVJ1760I is sourced from the original manufacturer or authorized distributors?
All XCKU19P-1FFVJ1760I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU19P-1FFVJ1760I meets industry standards.
7.What is the process for return or replacement of XCKU19P-1FFVJ1760I?
All XCKU19P-1FFVJ1760I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU19P-1FFVJ1760I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU19P-1FFVJ1760I part is unused and in its original packaging.
Return procedure for XCKU19P-1FFVJ1760I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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