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Home > Products > Integrated Circuits (ICs) > Embedded > FPGAs (Field Programmable Gate Array)

AMD XCKU19P-2FFVB2104E

Name: XCKU19P-2FFVB2104E
Brand: AMD
SKU: XCKU19P-2FFVB2104E
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: XCKU19P-2FFVB2104E

Manufacturer:: AMD

Category:: FPGAs (Field Programmable Gate Array)

Package:: 2104-BBGA, FCBGA

Datasheet:: XCKU19P-2FFVB2104E.pdf

Description:: IC FPGA KINTEX UP 2104FCBGA

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Product details

Overview

XCKU19P-2FFVB2104E from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,548,000 logic cells, 7,245 DSP slices, and 96.4 Mb of block RAM. It supports PCIe Gen4 x16, 25.8 Gb/s GTY transceivers, and operates at -2 speed grade with industrial temperature range (-40°C to +100°C). It is deployed in high-bandwidth data acceleration and real-time radar processing systems.

For engineers reviewing the XCKU19P-2FFVB2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, logic cell count, I/O voltage support (1.8 V / 1.2 V / 1.0 V), thermal performance in FFVB2104 package, and PCIe Gen4 compliance.

Technical Context

The XCKU19P-2FFVB2104E implements a heterogeneous architecture with programmable logic, hardened IP blocks for PCIe Gen4, DDR4 memory controllers, and GTY transceivers. It integrates dual ARM Cortex-A53 processors for system management and supports partial reconfiguration.

It targets applications requiring deterministic low-latency signal processing and hardware-accelerated compute offload. Configuration is performed via quad-SPI or BPI flash, JTAG, or SelectMAP interface, with bitstream encryption and HMAC authentication enabled.

Key Specifications

Parameter	Value and Actual Design Meaning
Logic Cells	1,548,000 - determines maximum combinational and sequential logic capacity for custom datapaths
DSP Slices	7,245 - enables parallel fixed/floating-point computation for radar FFTs or AI inference kernels
Block RAM	96.4 Mb - provides on-die memory for buffering high-throughput streaming data
GTY Transceivers	64 × 25.8 Gb/s - supports 100G Ethernet, CPRI, or JESD204C interfaces without external retimers
PCIe Interface	Gen4 x16 hard IP - delivers 32 GB/s bidirectional bandwidth with sub-100 ns transaction latency
I/O Standards	Supports 1.8 V, 1.2 V, 1.0 V - allows direct interfacing with DDR4, QSFP28, and low-voltage ASICs
Speed Grade	-2 - guarantees timing closure at highest operating frequency under industrial temperature conditions

Pinout & Package

The XCKU19P-2FFVB2104E is housed in a 2104-pin FCBGA package (FFVB2104) with 1.0 mm ball pitch, designed for high-density routing and thermal dissipation in air-cooled or conduction-cooled modules.

Pin/Terminal	Circuit Role	Design Meaning
MIO[0:15]	Multiplexed I/O	Configurable as SDIO, UART, SPI, I2C, or GPIO; connects to PS peripherals
HP[0:63]	High-Performance I/O Bank	Supports 1.8/1.2/1.0 V standards; used for DDR4, GTY transceiver reference clocks
GTY_TX_N/P[0:63]	Differential Transceiver Output	Drives 25.8 Gb/s serial lanes; requires controlled impedance PCB routing
GTY_RX_N/P[0:63]	Differential Transceiver Input	Receives 25.8 Gb/s serial data; includes CDR and equalization circuitry
PCIE_CLK_P/N	PCIe Reference Clock	Accepts 100 MHz differential clock for PCIe Gen4 hard IP synchronization
VCCINT	Core Supply	1.0 V supply for FPGA fabric; requires tight regulation (±3%) and low-noise filtering

Key Features

Feature	Design Value
Hardened PCIe Gen4 x16 Controller	Reduces RTL integration effort and ensures protocol compliance without soft-core overhead
64 GTY Transceivers @ 25.8 Gb/s	Enables single-chip 100G Ethernet or multi-channel JESD204C ADC/DAC interfacing
96.4 Mb On-Chip Block RAM	Eliminates need for external SRAM in real-time buffering applications like beamforming
ARM Cortex-A53 Dual-Core Processor Subsystem	Provides embedded Linux-capable processing for control plane, boot, and monitoring tasks
Bitstream Encryption & HMAC Authentication	Protects intellectual property and prevents unauthorized configuration or cloning

Applications

Radar Signal Processing	5G Massive MIMO Baseband
Use Scenario: Real-time pulse-Doppler processing and digital beamforming for AESA radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFTs and CFAR detection; GTY transceivers interface with high-speed ADC/DACs. Use Value: 25.8 Gb/s transceivers enable direct JESD204C connection to 12-bit/4 GSPS converters, reducing latency by >300 ns vs. retimer-based solutions.	Use Scenario: Uplink/downlink baseband processing and precoding for 64T64R massive MIMO radios. IC Role / Device Role / Timing Role: Configurable logic implements OFDM modulation/demodulation and channel estimation; PCIe Gen4 x16 connects to host CPU for control and data exchange. Use Value: 1.5M logic cells support concurrent execution of 64 parallel FFTs and MIMO matrix inversion kernels at 200 MHz clock domain.
High-Frequency Trading Acceleration	AI Inference at the Edge
Use Scenario: Low-latency order matching and risk checking in financial exchanges. IC Role / Device Role / Timing Role: Hardened PCIe Gen4 x16 provides sub-100 ns round-trip latency to host server; logic fabric runs ultra-fast pattern-matching engines. Use Value: Deterministic timing closure at -2 speed grade ensures worst-case path delay remains below 8 ns, meeting <1 µs total system latency requirement.	Use Scenario: Real-time object detection and classification on video streams from autonomous mobile robots. IC Role / Device Role / Timing Role: DSP slices execute INT8 convolution layers; ARM A53 subsystem manages sensor I/O and OS services. Use Value: 7,245 DSP slices deliver >12 TOPS INT8 throughput while maintaining thermal envelope under 45 W TDP in fanless enclosures.

Radar Signal Processing

5G Massive MIMO Baseband

Use Scenario: Real-time pulse-Doppler processing and digital beamforming for AESA radar systems.

IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFTs and CFAR detection; GTY transceivers interface with high-speed ADC/DACs.

Use Value: 25.8 Gb/s transceivers enable direct JESD204C connection to 12-bit/4 GSPS converters, reducing latency by >300 ns vs. retimer-based solutions.

Use Scenario: Uplink/downlink baseband processing and precoding for 64T64R massive MIMO radios.

IC Role / Device Role / Timing Role: Configurable logic implements OFDM modulation/demodulation and channel estimation; PCIe Gen4 x16 connects to host CPU for control and data exchange.

Use Value: 1.5M logic cells support concurrent execution of 64 parallel FFTs and MIMO matrix inversion kernels at 200 MHz clock domain.

High-Frequency Trading Acceleration

AI Inference at the Edge

Use Scenario: Low-latency order matching and risk checking in financial exchanges.

IC Role / Device Role / Timing Role: Hardened PCIe Gen4 x16 provides sub-100 ns round-trip latency to host server; logic fabric runs ultra-fast pattern-matching engines.

Use Value: Deterministic timing closure at -2 speed grade ensures worst-case path delay remains below 8 ns, meeting <1 µs total system latency requirement.

Use Scenario: Real-time object detection and classification on video streams from autonomous mobile robots.

IC Role / Device Role / Timing Role: DSP slices execute INT8 convolution layers; ARM A53 subsystem manages sensor I/O and OS services.

Use Value: 7,245 DSP slices deliver >12 TOPS INT8 throughput while maintaining thermal envelope under 45 W TDP in fanless enclosures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
XCKU15P-2FFVA1156E	Fewer logic cells (1,024,000), 40 GTY transceivers, no integrated ARM cores	Suitable for cost-sensitive 40G Ethernet or mid-tier radar where embedded processing is handled externally	Select when PCIe Gen4 x8 and 16.3 Gb/s transceivers meet bandwidth needs and ARM subsystem is unnecessary
XCVU13P-2FFVC1760E	Higher logic density (1,929,000), 64 GTY transceivers at 32.75 Gb/s, same ARM A53 subsystem	Targeted at next-gen 400G optical transport and AI training accelerators requiring higher serial bandwidth	Choose when 32.75 Gb/s GTY lanes and additional 381K logic cells justify premium cost and larger package footprint

Compared with XCKU15P-2FFVA1156E, the XCKU19P-2FFVB2104E adds ARM processing, 524K more logic cells, and 24 extra GTY lanes-enabling tighter integration and higher throughput. Against XCVU13P-2FFVC1760E, it trades peak transceiver speed for lower power and mature 25.8 Gb/s ecosystem compatibility.

Availability

XCKU19P-2FFVB2104E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband acceleration, and high-frequency trading systems requiring stable component supply across extended product lifecycles.

Supply support for XCKU19P-2FFVB2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on adaptive computing, graphics, and AI technologies, delivering high-performance and adaptive SoC solutions.

The Kintex UltraScale+ family targets high-throughput, low-latency applications including wired/wireless infrastructure, aerospace, and defense systems where reconfigurable compute and hardened I/O are critical.

FAQ

What is the maximum supported data rate for GTY transceivers on the XCKU19P-2FFVB2104E?

The XCKU19P-2FFVB2104E supports GTY transceivers up to 25.8 Gb/s per lane. This rate is validated for protocols including 100G Ethernet (4×25G), CPRI Option 10, and JESD204C. The XCKU19P-2FFVB2104E achieves this with built-in CDR, TX pre-emphasis, and RX equalization, eliminating need for external signal conditioning in most board designs.

Does the XCKU19P-2FFVB2104E include a processor subsystem?

Yes, the XCKU19P-2FFVB2104E integrates a dual-core ARM Cortex-A53 processor subsystem running at up to 1.5 GHz. This subsystem supports full Linux operation and handles boot, configuration, and real-time monitoring tasks independently of the programmable logic fabric. The XCKU19P-2FFVB2104E uses this for secure bitstream loading and runtime health checks.

What I/O voltage standards does the XCKU19P-2FFVB2104E support?

The XCKU19P-2FFVB2104E supports 1.8 V, 1.2 V, and 1.0 V I/O standards across its HP and HR banks. This enables direct interfacing with DDR4 memory (1.2 V), QSFP28 modules (1.8 V), and advanced ASICs (1.0 V). The XCKU19P-2FFVB2104E maintains signal integrity through bank-specific VCCO supplies and programmable output drive strength.

Is PCIe Gen4 support on the XCKU19P-2FFVB2104E implemented in hard IP or soft logic?

The XCKU19P-2FFVB2104E implements PCIe Gen4 x16 in hardened silicon IP, not soft logic. This ensures full protocol compliance, deterministic latency (<100 ns), and reduced power consumption versus soft implementations. The XCKU19P-2FFVB2104E's hard IP includes integrated DMA engines and MSI-X interrupt support, simplifying driver development.

What thermal and packaging specifications apply to the XCKU19P-2FFVB2104E?

The XCKU19P-2FFVB2104E uses a 2104-ball FCBGA package (FFVB2104) with 1.0 mm pitch and thermal characteristics rated for industrial temperature range (-40°C to +100°C case temperature). Its thermal design power is specified at 45 W typical. The XCKU19P-2FFVB2104E requires a 6-layer PCB with dedicated thermal vias and copper pour under the package for reliable operation.

XCKU19P-2FFVB2104E Specifications

Product attributes: Attribute value

Manufacturer:: AMD

Series:: Virtex® UltraScale+™

Package/Case:: 2104-BBGA, FCBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Number of LABs/CLBs:: 105300

Number of Logic Elements/Cells:: 1842750

Total RAM Bits:: 63753421

Number of I/O:: 540

Number of Gates:: -

Voltage - Supply:: 0.825V ~ 0.876V

Mounting Type:: Surface Mount

Operating Temperature:: 0°C ~ 100°C (TJ)

Grade:: -

Qualification:: -

Supplier Device Package:: 2104-FCBGA (47.5x47.5)

XCKU19P-2FFVB2104E FAQ

1.How can I place an order for XCKU19P-2FFVB2104E through Aetrix?

Please submit a Request for Quotation (RFQ) for XCKU19P-2FFVB2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCKU19P-2FFVB2104E reliable?

The price and inventory of XCKU19P-2FFVB2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU19P-2FFVB2104E is usually 5 days.

3.What payment methods are accepted for XCKU19P-2FFVB2104E?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU19P-2FFVB2104E transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCKU19P-2FFVB2104E?

XCKU19P-2FFVB2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCKU19P-2FFVB2104E order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCKU19P-2FFVB2104E?

For technical support, including XCKU19P-2FFVB2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU19P-2FFVB2104E requirements.

6.How does Aetrix verify that XCKU19P-2FFVB2104E is sourced from the original manufacturer or authorized distributors?

All XCKU19P-2FFVB2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU19P-2FFVB2104E meets industry standards.

7.What is the process for return or replacement of XCKU19P-2FFVB2104E?

All XCKU19P-2FFVB2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU19P-2FFVB2104E, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCKU19P-2FFVB2104E part is unused and in its original packaging.

Return procedure for XCKU19P-2FFVB2104E:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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