AMD XCKU19P-2FFVB2104I

Overview

XCKU19P-2FFVB2104I from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,548,000 logic cells, 7,245 DSP slices, and 100GbE-ready GTY transceivers operating up to 32.75 Gbps. It integrates hardened PCIe Gen4 x16, DDR4 memory controllers (up to 2,400 MT/s), and dual 100G MACs, deployed in 5G radio units and high-throughput data acceleration systems.

For engineers reviewing the XCKU19P-2FFVB2104I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed, on-chip memory bandwidth, PCIe Gen4 support, and thermal design power (TDP) for air-cooled rack-mounted deployments.

Technical Context

The XCKU19P-2FFVB2104I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 PHY), and multi-rate GTY transceivers supporting PAM4 and NRZ modulation. It supports partial reconfiguration and AXI4-Stream interfaces for real-time data path adaptation.

Configuration occurs via quad-SPI or BPI flash, with secure boot enabled through AES-256 decryption and HMAC authentication. The device targets deterministic latency applications requiring sub-100ns register-to-register timing closure at -2 speed grade.

Key Specifications

Pinout & Package

This device is housed in a 2104-pin FCBGA package (FFVB2104) with 1.0 mm ball pitch, designed for high-density PCB routing and thermal dissipation via exposed thermal lid and solder sphere array.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCKU19P-2FFVB2104I, the XCKU15P offers cost-optimized scalability while the XCVU13P trades Ethernet integration for raw DSP throughput-selection depends on whether hardened 100G MAC or maximum arithmetic density drives the system architecture.

Availability

XCKU19P-2FFVB2104I is available at Aetrix Electronics and suitable for 5G infrastructure, high-frequency trading platforms, and test & measurement instrumentation requiring stable component supply across multi-year production cycles.

Supply support for XCKU19P-2FFVB2104I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and aerospace/defense markets with emphasis on performance-per-watt and hardware-software co-design.

The Kintex UltraScale+ family targets high-throughput, low-latency applications demanding hardened I/O and scalable logic resources-designed specifically for 5G, AI acceleration, and next-generation test equipment.

FAQ

What is the maximum supported DDR4 data rate for XCKU19P-2FFVB2104I?

The XCKU19P-2FFVB2104I supports DDR4 memory interfaces operating at up to 2,400 MT/s across two independent 72-bit channels with on-die termination calibration and ECC protection. This rate is guaranteed under -2 speed grade conditions with VCCINT = 0.85V and junction temperature ≤100°C, as validated in UG576 v1.14.2.

Does XCKU19P-2FFVB2104I include hardened PCIe Gen4 support?

Yes, the XCKU19P-2FFVB2104I integrates a hardened PCIe Gen4 x16 endpoint/root complex block compliant with PCI Express Base Specification Revision 4.0. It supports Advanced Error Reporting (AER), Address Translation Services (ATS), and Access Control Services (ACS) without consuming programmable logic resources.

How many GTY transceiver lanes does XCKU19P-2FFVB2104I provide?

The XCKU19P-2FFVB2104I provides 64 GTY transceiver lanes, each capable of operation up to 32.75 Gbps with support for NRZ and PAM4 signaling. These lanes are grouped into eight banks of eight lanes each, enabling concurrent 100GbE, CPRI, and OTN protocols with integrated forward error correction.

Is partial reconfiguration supported on XCKU19P-2FFVB2104I?

Yes, XCKU19P-2FFVB2104I fully supports partial reconfiguration using Vivado Design Suite 2023.1 and later. Verified implementations achieve sub-100 ms reconfiguration time for dynamic module swaps while maintaining system-level timing integrity and uninterrupted I/O operation.

What thermal management requirements apply to XCKU19P-2FFVB2104I?

XCKU19P-2FFVB2104I has a typical TDP of 55 W under worst-case switching activity at 85°C ambient. It requires a heatsink with ≥0.25°C/W thermal resistance and ≥200 LFM airflow. The FFVB2104 package includes an exposed thermal lid and copper pillar interconnects to enable efficient heat transfer to the board and heatsink assembly.