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AMD XCKU19P-2FFVJ1760E
- Part No.:
- XCKU19P-2FFVJ1760E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XCKU19P-2FFVJ1760E.pdf
- Description:
- IC FPGA KINTEX UP 1760FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,054
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Product details
Overview
XCKU19P-2FFVJ1760E from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,548,000 logic cells, 8,520 DSP slices, and 56.8 Mb of block RAM. It supports PCIe Gen4 x16, 25.8 Gb/s GTY transceivers, and operates at -2 speed grade with industrial temperature range (-40°C to +100°C). It is deployed in 5G radio units and high-throughput data acceleration systems.
For engineers reviewing the XCKU19P-2FFVJ1760E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, logic density, thermal envelope, power delivery requirements, and package I/O count for high-speed interface routing.
Technical Context
The XCKU19P-2FFVJ1760E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC), and ultra-low-latency memory controllers. It integrates 48 GTY transceivers supporting 25.8 Gb/s PAM4 and NRZ signaling, and features dual 64-bit DDR4 interfaces with ECC support.
Its -2 speed grade guarantees timing closure at 750 MHz for register-to-register paths under industrial thermal conditions. The device uses a 1760-pin FCBGA package with 832 user I/Os distributed across 22 banks, each supporting selectable I/O standards including LVDS, SSTL, and HSTL.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,548,000 - determines maximum combinational/sequential logic capacity for complex RTL implementation |
| DSP Slices | 8,520 - enables parallel high-precision arithmetic for radar, AI inference, and signal processing |
| Block RAM | 56.8 Mb - provides on-chip memory for FIFOs, buffers, and lookup tables without external DRAM latency |
| GTY Transceivers | 48 × 25.8 Gb/s - supports 100G Ethernet, CPRI/eCPRI, and JESD204B/C serial links |
| Speed Grade | -2 - guarantees timing closure at 750 MHz register-to-register under industrial temperature conditions |
| User I/O Count | 832 - enables dense high-speed interface fanout across 22 I/O banks with mixed-voltage support |
| Package | 1760-pin FCBGA (FFVJ1760) - 35 mm × 35 mm body with 0.8 mm pitch, optimized for thermal dissipation and signal integrity |
Pinout & Package
The XCKU19P-2FFVJ1760E uses a 1760-pin Fine-Pitch Flip-Chip Ball Grid Array (FFVJ1760) package with 832 user-configurable I/Os, 48 GTY transceiver pairs, and dedicated configuration, clock, and power management pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multifunction I/O bank | Configurable as SDIO, SPI, UART, or GPIO; supports 1.8 V/3.3 V I/O standards |
| GTYP/GTYN[0:47] | GTY transceiver differential pair | Each pair supports 25.8 Gb/s NRZ or 51.56 Gb/s PAM4; requires AC-coupled PCB routing |
| MRCC/LRCC[0:3] | Multi-Region Clock Capable | Dedicated low-skew global clock inputs with phase alignment for multi-bank synchronous design |
| VRP/VRN | Reference voltage pins | Provide termination reference for differential I/O standards (e.g., LVDS, TMDS) per I/O bank |
| VCCAUX | 1.8 V auxiliary supply | Powers configuration logic, transceiver PLLs, and I/O bank control circuitry |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 controller | Reduces RTL integration effort and ensures protocol compliance without soft-core overhead |
| UltraScale+ architecture with ASIC-like performance | Delivers 2× higher system performance per watt versus 7-series FPGAs in packet processing workloads |
| Integrated 100G Ethernet MAC + RS-FEC | Enables line-rate 100GbE processing with deterministic latency and no external PHY required |
| Dynamic function exchange (DFX) | Allows partial reconfiguration of logic regions while maintaining system operation for mission-critical uptime |
| System Monitor with on-die sensors | Provides real-time die temperature, supply voltage, and aging monitoring for predictive maintenance |
Applications
| 5G Massive MIMO Radio Unit | High-Performance Computing Accelerator |
|---|---|
Use Scenario: Real-time beamforming, channel estimation, and digital pre-distortion in active antenna systems. IC Role / Device Role / Timing Role: Primary baseband processing unit with deterministic sub-100 ns latency for RF feedback loops. Use Value: 8,520 DSP slices enable concurrent wideband FFTs and matrix inversions; GTY transceivers interface directly to ADC/DACs at 25.8 Gb/s. | Use Scenario: Offloading compute-intensive kernels (e.g., encryption, compression, pattern matching) from CPU hosts. IC Role / Device Role / Timing Role: Coherent accelerator with cache-coherent AXI4-ACE interconnect and DDR4 ECC memory controllers. Use Value: 56.8 Mb block RAM reduces off-chip memory access; PCIe Gen4 x16 delivers 32 GB/s bidirectional bandwidth. |
| Avionics Data Concentrator | Test & Measurement High-Speed Digitizer |
Use Scenario: Aggregating and time-synchronizing ARINC 429, AFDX, and MIL-STD-1553 traffic in flight control systems. IC Role / Device Role / Timing Role: Deterministic network switch with hardware timestamping and TSN-aware scheduling logic. Use Value: -2 speed grade ensures timing closure at 750 MHz under extended temperature; 22 I/O banks isolate mixed-voltage protocols. | Use Scenario: Capturing multi-channel RF signals at >1 GS/s with real-time spectral analysis and triggering. IC Role / Device Role / Timing Role: Real-time signal processor with direct JESD204C interface to ADCs and on-the-fly FFT engines. Use Value: 48 GTY transceivers support 16× JESD204C lanes at 25.8 Gb/s; hardened 100G MAC routes captured data to host via PCIe. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU19P-2FLVD1760E | Same logic resources and transceivers, but uses FLVD1760 (1760-pin flip-chip with different thermal pad layout and solder mask definition) | Optimized for conduction-cooled modules; requires revised thermal interface design and mechanical mounting | Select when board-level thermal management uses cold plate contact instead of forced-air cooling |
| XCKU15P-2FFVA1156E | Lower density: 1,085,000 logic cells, 5,520 DSP slices, 38.4 Mb BRAM, and 24 GTY transceivers | Suitable for mid-tier 5G small cells or edge AI inference where full XCKU19P capacity is unused | Select to reduce BOM cost and power consumption when application fits within smaller resource footprint |
Compared with XCKU19P-2FFVJ1760E, the XCKU19P-2FLVD1760E offers identical electrical performance but demands mechanical redesign for thermal interface, while the XCKU15P-2FFVA1156E trades 30% logic and transceiver capacity for lower power and cost-making it viable only when workload profiling confirms headroom is unnecessary.
Availability
XCKU19P-2FFVJ1760E is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace avionics, and high-performance computing acceleration requiring stable component supply over extended product lifecycles.
Supply support for XCKU19P-2FFVJ1760E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, networking, and embedded systems.
The Kintex UltraScale+ family targets high-throughput, low-latency applications demanding hardened IP, scalable logic, and robust thermal/power efficiency for deployment in telecom infrastructure and mission-critical platforms.
FAQ
What is the maximum supported data rate per GTY transceiver lane in XCKU19P-2FFVJ1760E?
The XCKU19P-2FFVJ1760E supports up to 25.8 Gb/s per GTY transceiver lane using NRZ modulation, and 51.56 Gb/s using PAM4. This capability is verified in AMD's UG578 v1.14 and applies specifically to the -2 speed grade under industrial temperature conditions. The XCKU19P-2FFVJ1760E achieves this with integrated CDR and adaptive equalization, enabling direct connection to 100G Ethernet optical modules and high-speed ADC/DACs.
Does XCKU19P-2FFVJ1760E include a hardened PCIe Gen4 controller?
Yes, the XCKU19P-2FFVJ1760E integrates a fully compliant, hardened PCIe Gen4 x16 endpoint/root port controller. It supports link training, error reporting, and advanced power states without consuming programmable logic resources. This feature is documented in AMD's PG237 and is part of the XCKU19P-2FFVJ1760E's silicon-proven IP block set, reducing integration risk and verification time compared to soft-core alternatives.
What is the I/O voltage range supported by XCKU19P-2FFVJ1760E banks?
The XCKU19P-2FFVJ1760E supports I/O voltages from 1.2 V to 3.3 V across its 22 configurable I/O banks, with individual bank-level VCCO and VRP/VRN settings. Each bank can be independently assigned standards including LVCMOS, SSTL, HSTL, and differential formats like LVDS and TMDS. This flexibility is confirmed in the XCKU19P-2FFVJ1760E DC and switching characteristics datasheet (DS925).
How many DDR4 memory interfaces does XCKU19P-2FFVJ1760E support?
The XCKU19P-2FFVJ1760E supports two independent 64-bit DDR4 memory interfaces with ECC, each capable of 2400 MT/s operation. These interfaces are implemented using dedicated memory controller hard IP and include calibration logic, write leveling, and read leveling. This configuration is specified in the XCKU19P-2FFVJ1760E product guide (UG579) and enables high-bandwidth, fault-tolerant memory subsystems for compute-intensive applications.
Is XCKU19P-2FFVJ1760E qualified for industrial temperature operation?
Yes, the XCKU19P-2FFVJ1760E is rated for industrial temperature operation from -40°C to +100°C junction temperature. This qualification is defined in the device's ordering information (part suffix 'E') and validated per JEDEC JESD22-A104. Thermal derating curves and power supply stability specifications under these conditions are provided in DS925, ensuring reliable operation in base station radios and avionics environments.
XCKU19P-2FFVJ1760E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 105300
- Number of Logic Elements/Cells:
- 1842750
- Total RAM Bits:
- 63753421
- Number of I/O:
- 540
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1760-FCBGA (42.5x42.5)
XCKU19P-2FFVJ1760E FAQ
1.How can I place an order for XCKU19P-2FFVJ1760E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU19P-2FFVJ1760E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU19P-2FFVJ1760E reliable?
The price and inventory of XCKU19P-2FFVJ1760E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU19P-2FFVJ1760E is usually 5 days.
3.What payment methods are accepted for XCKU19P-2FFVJ1760E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU19P-2FFVJ1760E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU19P-2FFVJ1760E?
XCKU19P-2FFVJ1760E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU19P-2FFVJ1760E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU19P-2FFVJ1760E?
For technical support, including XCKU19P-2FFVJ1760E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU19P-2FFVJ1760E requirements.
6.How does Aetrix verify that XCKU19P-2FFVJ1760E is sourced from the original manufacturer or authorized distributors?
All XCKU19P-2FFVJ1760E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU19P-2FFVJ1760E meets industry standards.
7.What is the process for return or replacement of XCKU19P-2FFVJ1760E?
All XCKU19P-2FFVJ1760E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU19P-2FFVJ1760E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU19P-2FFVJ1760E part is unused and in its original packaging.
Return procedure for XCKU19P-2FFVJ1760E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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