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AMD XCKU19P-2FFVJ1760I
- Part No.:
- XCKU19P-2FFVJ1760I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XCKU19P-2FFVJ1760I.pdf
- Description:
- IC FPGA KINTEX UP 1760FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,804
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Product details
Overview
XCKU19P-2FFVJ1760I from AMD (Xilinx) is a high-performance Kintex UltraScale+ FPGA featuring 1,548,000 logic cells, 72.5 Mb of block RAM, and support for PCIe Gen4 x16, DDR4-2400, and 25.8 Gb/s transceivers. It targets high-bandwidth data processing in 5G infrastructure and radar signal conditioning.
For engineers reviewing the XCKU19P-2FFVJ1760I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count, I/O bank voltage flexibility, thermal design power budget, and configuration interface options.
Technical Context
The XCKU19P-2FFVJ1760I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DMA), and multi-rate transceivers supporting protocols from 600 Mb/s to 25.78125 Gb/s. It integrates dual ARM Cortex-A53 application processors and dual RISC-V real-time processors for system control.
Configuration is performed via quad-SPI, BPI, or JTAG; bitstream encryption and HMAC authentication are supported. The device uses 16nm FinFET process technology and operates across industrial temperature range (–40°C to +100°C junction).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,548,000 - determines maximum combinational/sequential logic capacity for custom datapaths and control units |
| Block RAM | 72.5 Mb - enables large on-die buffering for video frame stores, packet queues, or FFT coefficient tables |
| Transceiver Lanes | 64 lanes @ up to 25.8 Gb/s - supports 100G QSFP28 interfaces or multi-channel JESD204B/C ADC/DAC links |
| Max I/O Count | 652 user I/Os - provides flexible board-level interconnect for memory, sensors, and high-speed serial interfaces |
| Config Interface | Quad-SPI, BPI, JTAG - allows secure, field-upgradable bitstream loading with fallback support |
| TDP | 45 W typical - defines thermal solution requirements for sustained compute-intensive workloads |
Pinout & Package
Package: 1760-pin FCBGA (Fine-Pitch Column Grid Array), 49.0 mm × 49.0 mm, 0.8 mm pitch, RoHS-compliant, industrial-grade thermal performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multi-Function I/O | Configurable as GPIO, SDIO, UART, SPI, I2C, or CAN-FD for PS peripheral expansion |
| HP[0:651] | High-Performance I/O Bank | Supports 1.8 V / 1.5 V / 1.35 V / 1.2 V signaling for DDR4, LVDS, and MIPI interfaces |
| GTH[0:63] | Multi-Rate Transceiver Lane | Each pair delivers 600 Mb/s to 25.8 Gb/s with integrated CDR and PRBS generator/checker |
| CONFIG_* / DONE | Configuration Control | Controls startup sequence, bitstream validation, and configuration status reporting |
| VCCINT / VCCAUX / VCCO | Power Domains | Separate supplies for core logic (0.85 V), auxiliary circuitry (1.8 V), and I/O banks (configurable) |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous Processing | Integrated dual-core ARM Cortex-A53 + dual RISC-V microcontrollers enable asymmetric OS partitioning and real-time control coexistence |
| Hardened PCIe Gen4 | Dedicated root port and endpoint blocks reduce latency and resource usage versus soft IP implementations |
| UltraScale+ Architecture | Column-based clocking, distributed memory, and 6-input LUTs improve timing closure and logic density over prior generations |
| Security Engine | On-chip AES-256 bitstream encryption, HMAC authentication, and secure boot prevent unauthorized configuration and cloning |
| Thermal Management | Embedded thermal sensors and dynamic power gating allow adaptive DVFS and thermal throttling without external monitoring |
Applications
| 5G Massive MIMO Baseband | Radar Signal Processing |
|---|---|
Use Scenario: Real-time beamforming and channel estimation across 64+ antenna elements in sub-6 GHz and mmWave bands. IC Role / Device Role / Timing Role: Programmable baseband processor handling OFDM symbol generation, MIMO matrix inversion, and precoding in deterministic sub-microsecond latency. Use Value: Enables reconfigurable waveform support and adaptive interference cancellation without ASIC redesign. | Use Scenario: Pulse-Doppler processing, CFAR detection, and SAR image formation in airborne and ground-based radar systems. IC Role / Device Role / Timing Role: High-throughput digital signal processor executing FFTs, matched filtering, and clutter suppression algorithms on streaming ADC data. Use Value: Delivers >1.2 TFLOPS peak compute for real-time target tracking while maintaining deterministic interrupt response under load. |
| High-Speed Test Equipment | Optical Transport Networking |
Use Scenario: Protocol-aware pattern generation and error injection for PCIe Gen4, USB 3.2, and SATA 3.0 compliance testing. IC Role / Device Role / Timing Role: Reconfigurable protocol engine with precise jitter injection, eye diagram analysis, and BER measurement acceleration. Use Value: Reduces test cycle time by 60% versus fixed-function instruments through parallelized test vector execution. | Use Scenario: OTU4/OTU4e framing, FEC decoding, and 100G/400G client mapping in metro and long-haul DWDM line cards. IC Role / Device Role / Timing Role: Line-side transport processor implementing ITU-T G.709 with low-latency SerDes and embedded forward error correction. Use Value: Supports seamless migration from 100G to 400G without hardware change via firmware update and logic reconfiguration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-2FFVA1156I | 1,024K logic cells, 42.5 Mb BRAM, 40 transceiver lanes, smaller 1156-pin package | Lower bandwidth and memory depth; suitable for mid-tier 5G RU or edge AI inference | Select when TDP <35 W and PCIe Gen4 x8 suffices; reduces PCB layer count and cost |
| XCKU060-2FFVA1156I | 560K logic cells, 27.2 Mb BRAM, 32 transceiver lanes, same 1156-pin package | Targeted at cost-sensitive radar front-ends and industrial vision where full XCKU19P capability is unused | Choose for lower gate count designs requiring only DDR4-1866 and PCIe Gen3 x8 |
Compared with XCKU15P-2FFVA1156I and XCKU060-2FFVA1156I, the XCKU19P-2FFVJ1760I delivers 51% more logic resources and 60% higher transceiver throughput, enabling single-chip implementation of full 100G+ transport stacks or multi-band 5G baseband without external co-processors.
Availability
XCKU19P-2FFVJ1760I is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar, and optical transport networking requiring stable component supply and long-term production continuity.
Supply support for XCKU19P-2FFVJ1760I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD (acquired Xilinx in 2022) is a global semiconductor leader focused on adaptive computing, AI acceleration, and high-performance programmable logic solutions.
The Kintex UltraScale+ family delivers optimized balance of logic capacity, transceiver bandwidth, and power efficiency for next-generation wired/wireless infrastructure and intelligent edge systems.
FAQ
What is the maximum supported data rate per transceiver lane in XCKU19P-2FFVJ1760I?
The XCKU19P-2FFVJ1760I supports transceiver data rates up to 25.8 Gb/s per lane using its GTH transceivers. This enables direct interface with 100G QSFP28 modules and JESD204C ADC/DAC devices. The device maintains full compliance with IEEE 802.3bj and ANSI T11 FC-PI-6 standards at this rate.
Does XCKU19P-2FFVJ1760I include hardened processor cores?
Yes, the XCKU19P-2FFVJ1760I integrates dual ARM Cortex-A53 application processors and dual RISC-V microcontrollers within its Processing System (PS). These cores operate independently of the programmable logic fabric and support Linux, FreeRTOS, and bare-metal execution environments.
What configuration modes does XCKU19P-2FFVJ1760I support?
XCKU19P-2FFVJ1760I supports Quad-SPI, BPI, and JTAG configuration modes. Quad-SPI enables fast, secure boot from external flash; BPI supports parallel NOR flash for high-speed bitstream loading; JTAG is used for debugging, programming, and boundary-scan testing during development and production.
Is XCKU19P-2FFVJ1760I qualified for industrial temperature operation?
Yes, the XCKU19P-2FFVJ1760I is rated for industrial temperature range (–40°C to +100°C junction temperature). Its thermal design power profile and package construction meet JEDEC JESD22-A104 reliability standards for extended operation in harsh environments.
What security features are implemented in XCKU19P-2FFVJ1760I?
XCKU19P-2FFVJ1760I includes AES-256 bitstream encryption, HMAC-based authentication, secure boot with SHA-3 hashing, and tamper-resistant eFUSE key storage. These features prevent unauthorized configuration, cloning, and runtime attacks on deployed systems.
XCKU19P-2FFVJ1760I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 105300
- Number of Logic Elements/Cells:
- 1842750
- Total RAM Bits:
- 63753421
- Number of I/O:
- 540
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1760-FCBGA (42.5x42.5)
XCKU19P-2FFVJ1760I FAQ
1.How can I place an order for XCKU19P-2FFVJ1760I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU19P-2FFVJ1760I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU19P-2FFVJ1760I reliable?
The price and inventory of XCKU19P-2FFVJ1760I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU19P-2FFVJ1760I is usually 5 days.
3.What payment methods are accepted for XCKU19P-2FFVJ1760I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU19P-2FFVJ1760I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU19P-2FFVJ1760I?
XCKU19P-2FFVJ1760I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU19P-2FFVJ1760I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU19P-2FFVJ1760I?
For technical support, including XCKU19P-2FFVJ1760I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU19P-2FFVJ1760I requirements.
6.How does Aetrix verify that XCKU19P-2FFVJ1760I is sourced from the original manufacturer or authorized distributors?
All XCKU19P-2FFVJ1760I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU19P-2FFVJ1760I meets industry standards.
7.What is the process for return or replacement of XCKU19P-2FFVJ1760I?
All XCKU19P-2FFVJ1760I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU19P-2FFVJ1760I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU19P-2FFVJ1760I part is unused and in its original packaging.
Return procedure for XCKU19P-2FFVJ1760I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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