AMD XCKU19P-3FFVB2104E

Overview

XCKU19P-3FFVB2104E from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,548,000 logic cells, 7,245 DSP slices, and 104.5 Mb of block RAM. It supports PCIe Gen4 x16, 25.78 Gb/s transceivers, and DDR4 memory interfaces up to 2400 MHz. It is deployed in high-bandwidth data center acceleration and 5G radio unit processing.

For engineers reviewing the XCKU19P-3FFVB2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, DSP slice count, I/O voltage support (1.8 V / 1.2 V), and thermal design power (TDP) of 55 W under typical operation.

Technical Context

The XCKU19P-3FFVB2104E implements a heterogeneous architecture with programmable logic, hardened IP blocks for PCIe Gen4, Ethernet MACs, and memory controllers. Its transceivers support PAM4 and NRZ modulation with integrated clock data recovery (CDR) and adaptive equalization.

It integrates dual ARM Cortex-A53 application processors, 64-bit AXI interconnect, and configurable I/O banks supporting SSTL, HSTL, LVCMOS, and differential standards including LVDS and MIPI D-PHY. Configuration occurs via quad-SPI or JTAG.

Key Specifications

Pinout & Package

The XCKU19P-3FFVB2104E is housed in a 2104-pin Flip-Chip Ball Grid Array (FCBGA) package with 35 × 35 mm body size and 0.8 mm ball pitch. Thermal and power delivery are optimized via dedicated VCCINT, VCCAUX, and VRP/VRN balls distributed across the array.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCKU15P-2FFVA1156E and XCVU13P-2FLGA2577E, the XCKU19P-3FFVB2104E uniquely balances high transceiver density, embedded processing, and logic capacity-making it optimal for data center accelerators needing both software-defined control and hardware-accelerated datapaths.

Availability

XCKU19P-3FFVB2104E is available at Aetrix Electronics and suitable for data center acceleration, 5G radio unit development, and high-performance test equipment requiring stable component supply across multi-year production cycles.

Supply support for XCKU19P-3FFVB2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing high-performance computing, graphics, and adaptive SoC solutions for data centers, AI, and communications infrastructure.

The Kintex UltraScale+ product line delivers optimized cost-performance for high-throughput, low-latency applications such as 5G infrastructure, cloud acceleration, and advanced radar systems.

FAQ

What is the maximum supported DDR4 memory speed for the XCKU19P-3FFVB2104E?

The XCKU19P-3FFVB2104E supports DDR4 memory interfaces up to 2400 MHz. This speed is achieved using its HP I/O banks with calibrated output drive strength and dynamic on-die termination. The memory controller IP is hardened and verified for JEDEC-compliant operation at this rate, enabling high-bandwidth data movement between external memory and the FPGA fabric. XCKU19P-3FFVB2104E designs targeting 2400 MHz must adhere to PCB layout guidelines for signal integrity and power delivery.

Does the XCKU19P-3FFVB2104E include an integrated ARM processor subsystem?

Yes, the XCKU19P-3FFVB2104E integrates a dual-core ARM Cortex-A53 processor subsystem running at up to 1.5 GHz. This PS (Processing System) operates independently from the PL (Programmable Logic) and communicates via AXI-based interfaces. The XCKU19P-3FFVB2104E supports boot from QSPI flash or SD card, and enables Linux OS deployment alongside hardware-accelerated functions implemented in the FPGA fabric.

What transceiver protocols does the XCKU19P-3FFVB2104E natively support?

The XCKU19P-3FFVB2104E transceivers natively support PCIe Gen4 x16, 100G Ethernet (with RS-FEC), CPRI/eCPRI, and OTN. They also support SATA, SAS, and DisplayPort through configuration. Each GTY transceiver channel operates up to 25.78 Gb/s with built-in CDR, TX pre-emphasis, and RX equalization. Protocol support is enabled via hardened IP blocks-not soft logic-ensuring deterministic latency and compliance.

What is the thermal design power (TDP) of the XCKU19P-3FFVB2104E under typical operating conditions?

The XCKU19P-3FFVB2104E has a typical thermal design power (TDP) of 55 W, as specified in AMD's official documentation for standard operating conditions. This value assumes moderate logic utilization, transceiver activity, and memory interface loading. Actual power consumption varies with design implementation and clock frequencies. XCKU19P-3FFVB2104E deployments require a heatsink rated for ≥60 W dissipation and ≥200 LFM airflow for reliable long-term operation.

How many GTY transceiver quads does the XCKU19P-3FFVB2104E contain?

The XCKU19P-3FFVB2104E contains 64 GTY transceiver channels, organized into 16 quads (each quad comprises four transceivers). These are distributed across four transceiver banks (GTY0–GTY3), with each bank supporting independent reference clocks and power domains. All 64 channels are fully functional and accessible in the XCKU19P-3FFVB2104E, enabling configurations such as dual 100G Ethernet ports or 16-lane PCIe Gen4 x16 with bifurcation.