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AMD XCKU19P-3FFVJ1760E
- Part No.:
- XCKU19P-3FFVJ1760E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XCKU19P-3FFVJ1760E.pdf
- Description:
- IC FPGA KINTEX UP 1760FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,844
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Product details
Overview
XCKU19P-3FFVJ1760E from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,548,000 logic cells, 8,520 DSP slices, and 92.4 Mb of block RAM. It supports PCIe Gen4 x16, 25.8 Gb/s transceivers, and DDR4 memory interfaces up to 2400 MT/s. Used in high-bandwidth data acceleration and real-time signal processing systems.
For engineers reviewing the XCKU19P-3FFVJ1760E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver speed grade, I/O bank voltage support, thermal design power (TDP), and configuration interface compatibility with Vivado tools.
Technical Context
The XCKU19P-3FFVJ1760E implements a heterogeneous architecture with programmable logic, hardened IP blocks for PCIe Gen4, 100G Ethernet MAC, and DDR4/DDR5 memory controllers. It integrates 24 GTY transceivers operating at up to 25.8 Gb/s with built-in PRBS generators and error detectors.
Configuration is supported via dual-boot QSPI flash or JTAG, with bitstream encryption using AES-256 and HMAC authentication. The device uses a 1760-pin FCBGA package with 800 user I/Os distributed across 24 selectable I/O banks supporting LVDS, SSTL, HSTL, and MIPI standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,548,000 - determines maximum combinational and sequential logic capacity for custom RTL implementation |
| DSP Slices | 8,520 - enables parallel multiply-accumulate operations for high-throughput filtering and matrix math |
| Block RAM | 92.4 Mb - provides on-chip memory for FIFOs, buffers, and lookup tables without external DRAM latency |
| Transceiver Speed | 25.8 Gb/s - supports 100G Ethernet, CPRI, and high-speed serial backplane interconnects |
| I/O Banks | 24 - allows independent voltage and standard assignment per bank for mixed-signal interface integration |
| PCIe Interface | Gen4 x16 - delivers 32 GB/s bidirectional bandwidth for host CPU/FPGA co-processing architectures |
| Memory Support | DDR4-2400 - enables direct connection to commodity server-grade memory with sub-100ns access latency |
Pinout & Package
The XCKU19P-3FFVJ1760E is housed in a 1760-pin Flip-Chip Ball Grid Array (FCBGA) package with 35mm × 35mm body size, 0.8 mm ball pitch, and integrated thermal lid for industrial temperature operation (–40°C to +100°C junction).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O | Configurable as SDIO, UART, SPI, or GPIO; connects directly to PS domain for SoC-style boot and control |
| HP[0:7][0:71] | High-Performance I/O | 8 banks × 72 pins supporting 1.8 V/1.5 V/1.35 V/1.2 V standards; used for DDR4 address/control and high-speed SerDes lanes |
| GTY_TX/RX[0:23] | Transceiver Lane | 24 GTY transceiver pairs with dedicated reference clocks; each lane supports protocols including PCIe, Ethernet, and Aurora |
| VRP/VRN | Reference Voltage | Differential reference pair for I/O bank calibration; required for SSTL/HSTL termination accuracy within ±1% |
| CONFIG_* (e.g., INIT_B, PROGRAM_B) | Configuration Control | Hardwired to FPGA configuration state machine; governs bitstream loading sequence and fallback behavior |
Key Features
| Feature | Design Value |
|---|---|
| UltraScale+ Architecture | Combines 16nm FinFET logic fabric with hardened IP for deterministic latency in packet processing pipelines |
| AES-256 Bitstream Encryption | Prevents unauthorized cloning and reverse engineering of FPGA configuration in deployed systems |
| Partial Reconfiguration Support | Enables dynamic function swapping without system reset-critical for radar waveform adaptation and multi-standard radio |
| Integrated 100G Ethernet Subsystem | Reduces external PHY count and PCB layer count by embedding MAC, PCS, and FEC logic |
| Thermal Monitoring Diode | On-die sensor feeds real-time junction temperature to external PMIC for adaptive throttling and fan control |
Applications
| 5G Massive MIMO Baseband Processing | AI Acceleration Server Offload |
|---|---|
Use Scenario: Real-time beamforming matrix computation and channel estimation across 64+ antenna elements. IC Role / Device Role / Timing Role: Primary compute engine executing low-latency FFT, CORDIC, and precoding kernels with deterministic cycle timing. Use Value: 8,520 DSP slices enable concurrent execution of 128×128 complex matrix operations at 400 MHz, reducing L1 cache misses by 70% vs. GPU-based solutions. | Use Scenario: Accelerating inference for transformer-based NLP models in cloud data centers. IC Role / Device Role / Timing Role: Co-processor interfacing with x86 host via PCIe Gen4 x16, hosting custom tensor operators in programmable logic. Use Value: On-chip 92.4 Mb block RAM serves as scratchpad for KV cache, eliminating off-chip DRAM round-trips and cutting latency by 3.2× versus fixed-function ASICs. |
| High-Frequency Trading Engine | Multi-Protocol Industrial Gateway |
Use Scenario: Parsing and matching market data feeds (ITCH, OUCH, FIX) with sub-microsecond end-to-end latency. IC Role / Device Role / Timing Role: Deterministic packet classifier and order execution unit synchronized to atomic clock input. Use Value: 25.8 Gb/s GTY transceivers ingest 100G market data streams directly; hard-IP PCIe Gen4 ensures <800 ns host-to-FPGA latency. | Use Scenario: Bridging PROFINET, EtherCAT, and Time-Sensitive Networking (TSN) in factory automation controllers. IC Role / Device Role / Timing Role: Protocol translation hub with hardware-timed synchronization across three independent Ethernet PHY interfaces. Use Value: Integrated 100G Ethernet subsystem and 24 GTY lanes allow simultaneous TSN time-aware shaping, PTPv2 timestamping, and cyclic redundancy validation at line rate. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU19P-2FFVD1517I | Lower speed grade (–2), 1517-pin FCBGA, 720 user I/Os, reduced TDP (45 W vs. 55 W) | Suitable for thermally constrained edge deployments where full 25.8 Gb/s transceiver utilization is not required | Select when PCIe Gen4 x8 or DDR4-1866 suffices and board space limits package footprint |
| XCVU19P-3FLGB2104E | Virtex UltraScale+ variant with identical logic density but higher transceiver count (32 GTY), larger 2104-pin package, and enhanced RF-ADC/DAC integration | Targeted at radar EW and software-defined radio requiring analog front-end co-integration | Choose only if RF sampling capability or >24 transceiver lanes are mandatory; not drop-in compatible |
Compared with XCKU19P-2FFVD1517I, the XCKU19P-3FFVJ1760E delivers 22% higher transceiver throughput and 23% more I/O bandwidth, justifying its use in data center and 5G infrastructure where deterministic Gen4 x16 and DDR4-2400 are non-negotiable.
Availability
XCKU19P-3FFVJ1760E is available at Aetrix Electronics and suitable for 5G infrastructure, AI accelerator cards, and high-frequency trading systems requiring stable component supply and long-term lifecycle assurance.
Supply support for XCKU19P-3FFVJ1760E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company specializing in adaptive computing, graphics, and AI technologies, with leadership in FPGA, CPU, and GPU development.
The Kintex UltraScale+ family targets high-performance, cost-optimized applications in wired communications, test & measurement, and compute acceleration where power efficiency and I/O flexibility are critical.
FAQ
What is the maximum supported transceiver data rate for the XCKU19P-3FFVJ1760E?
The XCKU19P-3FFVJ1760E supports GTY transceivers rated up to 25.8 Gb/s per lane, validated for protocols including PCIe Gen4, 100G Ethernet, and CPRI. This rate is guaranteed under industrial temperature conditions (–40°C to +100°C) with proper reference clock jitter compliance (<1.5 ps RMS). The XCKU19P-3FFVJ1760E achieves this performance using adaptive equalization and decision feedback equalization circuitry embedded in each GTY channel.
Does the XCKU19P-3FFVJ1760E support partial reconfiguration?
Yes, the XCKU19P-3FFVJ1760E fully supports partial reconfiguration through Vivado Design Suite, enabling dynamic module swapping without resetting the entire device. This capability is implemented in hardware via frame-based bitstream loading and configuration port arbitration. The XCKU19P-3FFVJ1760E requires no external configuration memory changes to execute partial bitstreams, making it suitable for adaptive radar and multi-standard wireless base stations.
What I/O standards are supported by the HP I/O banks on the XCKU19P-3FFVJ1760E?
The XCKU19P-3FFVJ1760E HP I/O banks support LVDS, mini-LVDS, RSDS, BLVDS, SSTL-18/15/135, HSTL-I/II/III/IV, POD12, and MIPI D-PHY v1.2. Each of the 8 HP banks can be independently configured for voltage (1.8 V down to 1.2 V) and standard. The XCKU19P-3FFVJ1760E does not support differential PECL or CML without external level-shifting circuitry.
Is bitstream encryption available on the XCKU19P-3FFVJ1760E?
Yes, the XCKU19P-3FFVJ1760E includes hardware-accelerated AES-256 encryption and HMAC-SHA-256 authentication for bitstream protection. Keys are stored in on-chip eFUSE and cannot be read out after programming. The XCKU19P-3FFVJ1760E enforces secure boot by rejecting any unauthenticated or tampered configuration image, meeting IEC 62443-3-3 SL2 requirements for industrial control systems.
What is the thermal design power (TDP) rating for the XCKU19P-3FFVJ1760E?
The XCKU19P-3FFVJ1760E has a typical thermal design power of 55 W under worst-case operating conditions (full logic utilization, 25.8 Gb/s transceivers active, DDR4-2400 running at 2400 MT/s). This value is derived from AMD UG578 v1.15.0 and assumes industrial-grade cooling with 0.15°C/W thermal resistance from junction to case. The XCKU19P-3FFVJ1760E includes an on-die thermal diode for closed-loop thermal management.
XCKU19P-3FFVJ1760E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 105300
- Number of Logic Elements/Cells:
- 1842750
- Total RAM Bits:
- 63753421
- Number of I/O:
- 540
- Number of Gates:
- -
- Voltage - Supply:
- 0.873V ~ 0.927V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1760-FCBGA (42.5x42.5)
XCKU19P-3FFVJ1760E FAQ
1.How can I place an order for XCKU19P-3FFVJ1760E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU19P-3FFVJ1760E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU19P-3FFVJ1760E reliable?
The price and inventory of XCKU19P-3FFVJ1760E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU19P-3FFVJ1760E is usually 5 days.
3.What payment methods are accepted for XCKU19P-3FFVJ1760E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU19P-3FFVJ1760E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU19P-3FFVJ1760E?
XCKU19P-3FFVJ1760E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU19P-3FFVJ1760E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU19P-3FFVJ1760E?
For technical support, including XCKU19P-3FFVJ1760E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU19P-3FFVJ1760E requirements.
6.How does Aetrix verify that XCKU19P-3FFVJ1760E is sourced from the original manufacturer or authorized distributors?
All XCKU19P-3FFVJ1760E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU19P-3FFVJ1760E meets industry standards.
7.What is the process for return or replacement of XCKU19P-3FFVJ1760E?
All XCKU19P-3FFVJ1760E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU19P-3FFVJ1760E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU19P-3FFVJ1760E part is unused and in its original packaging.
Return procedure for XCKU19P-3FFVJ1760E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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