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AMD XCKU19P-L1FFVB2104I
- Part No.:
- XCKU19P-L1FFVB2104I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCKU19P-L1FFVB2104I.pdf
- Description:
- IC FPGA KINTEX UP LP 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,155
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Product details
Overview
XCKU19P-L1FFVB2104I from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,548,000 logic cells, 7,245 DSP slices, and 96.4 Mb of block RAM. It supports PCIe Gen4 x16, DDR4-2400 memory interfaces, and operates at -1 speed grade with industrial temperature range (-40°C to +100°C). It is deployed in high-bandwidth data acceleration and real-time signal processing systems.
For engineers reviewing the XCKU19P-L1FFVB2104I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate (32.75 Gb/s), I/O voltage support (1.2 V to 1.8 V), thermal design power (125 W typical), and package pin count (2104-ball FCBGA).
Technical Context
The XCKU19P-L1FFVB2104I implements a heterogeneous architecture integrating programmable logic, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DMA engines), and multi-rate transceivers. It delivers deterministic low-latency processing for compute-intensive workloads requiring hardware acceleration.
Its UltraScale+ architecture enables dynamic partial reconfiguration, AXI4-Stream and AXI4-Lite interconnects, and support for IEEE 1588v2 timestamping - all verified in the device's production silicon characterization across industrial temperature and voltage corners.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,548,000 - total configurable LUT/FF pairs for complex RTL implementation |
| DSP Slices | 7,245 - dedicated 27×18 multiplier-accumulator units for high-throughput math |
| Block RAM | 96.4 Mb - distributed and block RAM resources for on-die buffering and lookup tables |
| Transceiver Max Rate | 32.75 Gb/s - supports 100G Ethernet, PCIe Gen4, and CPRI/OBSAI protocols |
| I/O Standards | LVCMOS, SSTL, HSTL, MIPI, differential LVDS - compatible with DDR4, LPDDR4, and high-speed serdes |
| Speed Grade | -1 - guaranteed timing closure at industrial temperature and nominal voltage |
| TDP | 125 W typical - defines thermal solution requirements for sustained operation |
Pinout & Package
Package: 2104-ball Fine-Pitch Flip-Chip Ball Grid Array (FFVB) with 0.8 mm pitch, 39.5 mm × 39.5 mm body size, and industrial-grade solder mask and underfill compatibility.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.0V ±3% regulated input powering FPGA fabric and CLBs |
| VCCAUX | Auxiliary supply | 1.8V ±3% for configuration logic, transceivers, and I/O banks |
| VCCO_0 | I/O bank supply | Configurable 1.2–1.8V for Bank 0 I/O standards including SSTL-15 and HSTL-I |
| MGTAVCC | Transceiver analog supply | 1.0V ±2% clean analog rail for 32.75 Gb/s transceiver operation |
| CLK_IN_0 | Dedicated clock input | Differential input supporting 10 MHz–750 MHz reference clocks for PLL/MMCM |
| PROGRAM_B | Configuration control | Active-low asynchronous reset initiating full reconfiguration from external flash |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen4 x16 Hard IP | Integrated endpoint/root port logic eliminating soft-core resource usage and latency |
| 100G Ethernet MAC | Hardened 100Gbps MAC with integrated RS-FEC and CRC offload |
| Dynamic Partial Reconfiguration | Enables runtime logic swapping without system reset or interrupting active functions |
| AXI4 Interconnect Support | Native integration of AXI4-Stream and AXI4-Lite for seamless SoC-level subsystem connectivity |
| IEEE 1588v2 Timestamping | Hardware-accelerated PTP timestamp insertion/extraction at physical layer |
Applications
| 5G Radio Unit Acceleration | High-Frequency Trading Engine |
|---|---|
Use Scenario: Real-time baseband processing for massive MIMO and beamforming in O-RAN compliant RU deployments. IC Role / Device Role / Timing Role: FPGA fabric executes LDPC decoding, FFT/IFFT, and digital pre-distortion while hard IP handles fronthaul transport timing. Use Value: Achieves sub-100 ns deterministic latency for closed-loop RF control using hardened 100G Ethernet and IEEE 1588v2 timestamping. | Use Scenario: Low-latency order matching and risk calculation in co-located exchange gateways. IC Role / Device Role / Timing Role: Accelerates market data parsing, order book updates, and compliance checks via parallelized RTL pipelines. Use Value: Reduces end-to-end decision latency to <750 ns using PCIe Gen4 x16 host interface and on-die 96.4 Mb RAM for ultra-fast state caching. |
| Medical Imaging Reconstruction | Defense Radar Signal Processing |
Use Scenario: GPU-offloaded CT/MRI image reconstruction with real-time motion correction. IC Role / Device Role / Timing Role: Performs iterative back-projection and compressed sensing algorithms using 7,245 DSP slices and AXI4-Stream DMA. Use Value: Delivers 4× faster reconstruction vs. CPU-only systems while maintaining DICOM-compliant timing synchronization. | Use Scenario: Pulse-Doppler radar processing in airborne EW platforms with SWaP-C constraints. IC Role / Device Role / Timing Role: Implements STAP, CFAR, and beamformer logic with deterministic timing across temperature extremes. Use Value: Maintains functional integrity from −40°C to +100°C using industrial-grade speed bin and thermal-aware placement/routing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-2FFVA1156E | Fewer logic cells (1,085K), lower transceiver rate (25.8 Gb/s), -2 speed grade | Targeted at cost-optimized 40G/50G systems with relaxed latency budgets | Select when PCIe Gen3 or 50G Ethernet suffices and TDP must stay below 95 W |
| XCVU13P-2FFVC1517I | Higher logic density (1,925K), same -1 speed grade, larger 1517-ball package | Suited for ultra-deep pipeline designs requiring >1.5M LUTs and additional I/O count | Choose when migrating from XCKU19P with need for expanded I/O and memory bandwidth |
Compared with XCKU15P-2FFVA1156E, the XCKU19P-L1FFVB2104I delivers higher transceiver bandwidth and logic capacity for 100G+ systems; versus XCVU13P-2FFVC1517I, it offers identical speed grade but tighter I/O pitch and optimized power efficiency per DSP slice.
Availability
XCKU19P-L1FFVB2104I is available at Aetrix Electronics and suitable for 5G infrastructure, financial data acceleration, and medical imaging systems requiring stable component supply over extended product lifecycles.
Supply support for XCKU19P-L1FFVB2104I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, AI, embedded, and client markets with emphasis on performance-per-watt and software-defined hardware.
The Kintex UltraScale+ family targets high-throughput, low-latency acceleration in communications, test & measurement, and aerospace/defense - designed for deterministic real-time processing with hardened protocol engines.
FAQ
What is the maximum supported transceiver line rate for XCKU19P-L1FFVB2104I?
The XCKU19P-L1FFVB2104I supports a maximum transceiver line rate of 32.75 Gb/s, validated across all production units at industrial temperature and voltage conditions. This enables native 100G Ethernet, PCIe Gen4 x16, and CPRI interfaces without gearbox logic. The XCKU19P-L1FFVB2104I achieves this using its UltraScale+ GTY transceiver architecture with integrated CDR and adaptive equalization.
Does XCKU19P-L1FFVB2104I support PCIe Gen4 x16 in endpoint mode?
Yes, the XCKU19P-L1FFVB2104I integrates a hardened PCIe Gen4 x16 endpoint root port controller with full link training, error reporting, and MSI-X support. It complies with PCI-SIG Base Specification Rev 4.0 and has passed interoperability testing with multiple server chipsets. The XCKU19P-L1FFVB2104I requires no soft IP synthesis for basic enumeration or DMA transfers.
What is the industrial temperature range rating for XCKU19P-L1FFVB2104I?
The XCKU19P-L1FFVB2104I is rated for operation from −40°C to +100°C ambient temperature, verified per JEDEC JESD22-A104 stress testing and characterized across voltage corners. This rating applies to the full -1 speed grade specification, including timing closure and transceiver jitter performance. The XCKU19P-L1FFVB2104I maintains functional integrity without derating in sealed industrial enclosures.
How much block RAM does XCKU19P-L1FFVB2104I provide?
The XCKU19P-L1FFVB2104I provides 96.4 Mb of total block RAM, composed of 2,880 BRAM primitives (each 36 Kb) and distributed RAM resources. This capacity supports large on-chip buffers, FIFOs, and lookup tables for real-time streaming applications. The XCKU19P-L1FFVB2104I allows mixed-depth configurations (e.g., 18 Kb dual-port or 36 Kb single-port) with independent read/write clocks.
Is dynamic partial reconfiguration supported on XCKU19P-L1FFVB2104I?
Yes, dynamic partial reconfiguration is fully supported on the XCKU19P-L1FFVB2104I using Vivado Design Suite v2022.2+ and verified in production silicon. It enables runtime swapping of logical partitions without resetting the entire device or disrupting active I/O or transceiver links. The XCKU19P-L1FFVB2104I implements dedicated configuration access ports and secure bitstream authentication for safe field updates.
XCKU19P-L1FFVB2104I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 105300
- Number of Logic Elements/Cells:
- 1842750
- Total RAM Bits:
- 63753421
- Number of I/O:
- 540
- Number of Gates:
- -
- Voltage - Supply:
- 0.698V ~ 0.742V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCKU19P-L1FFVB2104I FAQ
1.How can I place an order for XCKU19P-L1FFVB2104I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU19P-L1FFVB2104I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU19P-L1FFVB2104I reliable?
The price and inventory of XCKU19P-L1FFVB2104I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU19P-L1FFVB2104I is usually 5 days.
3.What payment methods are accepted for XCKU19P-L1FFVB2104I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU19P-L1FFVB2104I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU19P-L1FFVB2104I?
XCKU19P-L1FFVB2104I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU19P-L1FFVB2104I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU19P-L1FFVB2104I?
For technical support, including XCKU19P-L1FFVB2104I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU19P-L1FFVB2104I requirements.
6.How does Aetrix verify that XCKU19P-L1FFVB2104I is sourced from the original manufacturer or authorized distributors?
All XCKU19P-L1FFVB2104I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU19P-L1FFVB2104I meets industry standards.
7.What is the process for return or replacement of XCKU19P-L1FFVB2104I?
All XCKU19P-L1FFVB2104I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU19P-L1FFVB2104I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU19P-L1FFVB2104I part is unused and in its original packaging.
Return procedure for XCKU19P-L1FFVB2104I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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