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AMD XCKU19P-L2FFVB2104E
- Part No.:
- XCKU19P-L2FFVB2104E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCKU19P-L2FFVB2104E.pdf
- Description:
- IC FPGA KINTEX UP LP 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,397
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Product details
Overview
XCKU19P-L2FFVB2104E from AMD is a high-performance Kintex UltraScale+ FPGA featuring 1,548,000 logic cells, 7,245 DSP slices, and 96.4 Mb of block RAM. It integrates hardened PCIe Gen4 x16, 100G Ethernet MACs, and DDR4 memory controllers, targeting high-bandwidth data processing in 5G infrastructure and radar signal processing systems.
For engineers reviewing the XCKU19P-L2FFVB2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate (32.75 Gb/s), I/O voltage support (1.8 V / 1.2 V / 1.0 V), thermal design power (125 W), and package-specific I/O count (832 user I/Os).
Technical Context
The XCKU19P-L2FFVB2104E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including dual 100G Ethernet MACs and quad 25G Ethernet PCS/PMA, and scalable memory interfaces supporting DDR4-2400 and RLDRAM3-2133. Its transceivers comply with IEEE 802.3bj and CEI-11G standards.
Configuration is supported via dual BPI NOR flash or JTAG, with bitstream encryption using AES-256 and HMAC-SHA-256. The device supports partial reconfiguration and dynamic function exchange for runtime hardware adaptation in mission-critical systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,548,000 - determines maximum combinational/sequential logic capacity for complex algorithm implementation |
| DSP Slices | 7,245 - enables parallel high-throughput arithmetic operations for FFT, filtering, and beamforming |
| Block RAM | 96.4 Mb - provides on-chip memory for buffering, FIFOs, and lookup tables without external latency |
| Transceiver Max Rate | 32.75 Gb/s - supports 100G Ethernet, CPRI/eCPRI, and JESD204C serial links |
| User I/O Count | 832 - enables high-density interface routing to ADCs, DACs, FPGAs, and processors |
| Memory Interface | DDR4-2400 - delivers 19.2 GB/s peak bandwidth for real-time data streaming applications |
| TDP | 125 W - defines thermal management requirements for air- or liquid-cooled enclosure design |
Pinout & Package
The XCKU19P-L2FFVB2104E is housed in a 2104-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVB) package with 1.0 mm ball pitch, designed for high-signal-integrity PCB layouts and thermal dissipation in multi-layer boards.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTAVCC / MGTVCCAUX | Analog & auxiliary supply for GTY transceivers | Requires independent low-noise regulation to meet jitter and BER specifications |
| VCCINT / VCCBRAM | Core & BRAM supply | Must be tightly regulated at 0.85 V ±3% to ensure timing closure and SRAM stability |
| VCCO_0 / VCCO_1 | I/O bank supplies | Configurable per bank (1.0 V–1.8 V) to interface with diverse voltage-domain peripherals |
| CONFIG_* / INIT_B | Configuration control | Directly manage startup sequence, fallback, and secure bitstream loading |
| CLK_IN / CLK_OUT | Global clock inputs/outputs | Route to dedicated clock networks with <150 ps skew across die |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen4 x16 Hard IP | Reduces RTL integration effort and guarantees compliance with ECN and LTSSM state machine behavior |
| 100G Ethernet MAC + RS-FEC | Offloads forward error correction and framing logic, enabling deterministic 100G packet processing |
| AES-256 + HMAC-SHA-256 Encryption | Enables secure bitstream authentication and confidentiality without external crypto controllers |
| Partial Reconfiguration Support | Allows runtime logic module swapping while maintaining active system operation and I/O continuity |
| UltraScale+ SelectIO Technology | Supports MIPI D-PHY, LVDS, SSTL, HSTL, and POD12 signaling within same I/O bank |
Applications
| 5G Massive MIMO Baseband Processing | Radar Signal Processing Unit |
|---|---|
Use Scenario: Real-time beamforming, channel estimation, and precoding for 64T64R antenna arrays. IC Role / Device Role / Timing Role: Primary baseband processor executing LTE/NR PHY layer functions with deterministic sub-microsecond latency. Use Value: 7,245 DSP slices and 32.75 Gb/s transceivers enable concurrent processing of 16 spatial streams and fronthaul interface to RU. | Use Scenario: Pulse-Doppler processing, CFAR detection, and SAR image formation in airborne radar systems. IC Role / Device Role / Timing Role: High-precision timing engine synchronizing ADC sampling, waveform generation, and FFT execution across multiple channels. Use Value: 96.4 Mb block RAM buffers full chirp sequences; hardened 100G MAC interfaces with high-speed data recorder subsystems. |
| High-Speed Test Equipment Controller | AI Accelerator Co-Processor |
Use Scenario: Pattern generation, response analysis, and protocol validation in ATE platforms for SoC testing. IC Role / Device Role / Timing Role: Deterministic I/O controller managing multi-gigabit parallel/serial test vectors with sub-nanosecond timing resolution. Use Value: 832 user I/Os support simultaneous connection to 32 DUTs; DDR4-2400 interface feeds pattern memory at 19.2 GB/s. | Use Scenario: Offloading convolution, activation, and quantization operations from host CPU/GPU in edge inference engines. IC Role / Device Role / Timing Role: Programmable accelerator executing custom neural network layers with configurable precision and sparsity handling. Use Value: 1,548,000 logic cells implement large-scale systolic arrays; PCIe Gen4 x16 enables 16 GT/s host coherency traffic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-2FFVA1156E | Fewer logic cells (1,085K), reduced DSP slices (5,400), lower TDP (95 W), and 520 user I/Os | Suitable for mid-tier 5G small cells and compact radar modules where size and power constrain full XCKU19P capability | Select when system-level throughput and I/O density requirements are ~30% lower than XCKU19P-L2FFVB2104E |
| XCKU060-2FFVA1156I | Lower speed grade (-2 vs -2L), industrial temperature range (–40°C to +100°C), and no hardened 100G Ethernet MAC | Targeted for ruggedized avionics and industrial control where extended temperature operation outweighs 100G bandwidth needs | Choose for environments requiring guaranteed operation at 100°C junction temperature, accepting trade-offs in transceiver performance |
Compared with XCKU15P-2FFVA1156E and XCKU060-2FFVA1156I, the XCKU19P-L2FFVB2104E delivers highest logic density, transceiver bandwidth, and memory bandwidth-making it optimal for full 5G macro base stations, phased-array radar, and AI training accelerators where raw compute and I/O scalability are primary constraints.
Availability
XCKU19P-L2FFVB2104E is available at Aetrix Electronics and suitable for 5G infrastructure, defense radar systems, and high-speed test equipment requiring stable component supply across long production lifecycles.
Supply support for XCKU19P-L2FFVB2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and client markets through its FPGA, adaptive SoC, and AI processor portfolios.
The XCKU19P-L2FFVB2104E belongs to the Kintex UltraScale+ family, engineered for high-throughput, low-latency signal and packet processing in communications infrastructure and aerospace systems.
FAQ
What is the maximum transceiver line rate supported by the XCKU19P-L2FFVB2104E?
The XCKU19P-L2FFVB2104E supports a maximum transceiver line rate of 32.75 Gb/s using its GTY transceivers. This enables compliance with 100G Ethernet (IEEE 802.3bj), CPRI Option 10, and JESD204C standards. The XCKU19P-L2FFVB2104E achieves this rate with integrated clock data recovery and adaptive equalization, ensuring robust operation over backplanes and cables.
Does the XCKU19P-L2FFVB2104E include hardened PCIe Gen4 support?
Yes, the XCKU19P-L2FFVB2104E integrates a hardened PCIe Gen4 x16 endpoint/root port controller. It supports link training, power management states (L0s/L1), and advanced error reporting without consuming programmable logic resources. The XCKU19P-L2FFVB2104E's PCIe hard IP is verified against PCI-SIG compliance tests and operates at 16 GT/s per lane.
What memory interfaces are supported by the XCKU19P-L2FFVB2104E?
The XCKU19P-L2FFVB2104E supports DDR4-2400 (19.2 GB/s), RLDRAM3-2133, and LPDDR4-4266 memory interfaces with dedicated PHYs and controller IP. These interfaces are implemented as hardened blocks with calibration engines and built-in self-test. The XCKU19P-L2FFVB2104E does not support DDR5 or GDDR6.
Is partial reconfiguration supported on the XCKU19P-L2FFVB2104E?
Yes, the XCKU19P-L2FFVB2104E fully supports partial reconfiguration through Vivado Design Suite tools and runtime configuration ports. This allows dynamic swapping of logic modules while preserving configuration state in other regions. The XCKU19P-L2FFVB2104E uses frame-based bitstream addressing and CRC-protected configuration frames to ensure safe, deterministic updates.
What is the operating temperature range for the XCKU19P-L2FFVB2104E?
The XCKU19P-L2FFVB2104E is specified for commercial operation from 0°C to +85°C ambient temperature, with junction temperature limited to +100°C under defined airflow and thermal interface conditions. It is not rated for industrial or extended temperature grades. The XCKU19P-L2FFVB2104E requires active thermal management due to its 125 W TDP.
XCKU19P-L2FFVB2104E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 105300
- Number of Logic Elements/Cells:
- 1842750
- Total RAM Bits:
- 63753421
- Number of I/O:
- 540
- Number of Gates:
- -
- Voltage - Supply:
- 0.698V ~ 0.742V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 110°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCKU19P-L2FFVB2104E FAQ
1.How can I place an order for XCKU19P-L2FFVB2104E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU19P-L2FFVB2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU19P-L2FFVB2104E reliable?
The price and inventory of XCKU19P-L2FFVB2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU19P-L2FFVB2104E is usually 5 days.
3.What payment methods are accepted for XCKU19P-L2FFVB2104E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU19P-L2FFVB2104E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU19P-L2FFVB2104E?
XCKU19P-L2FFVB2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU19P-L2FFVB2104E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU19P-L2FFVB2104E?
For technical support, including XCKU19P-L2FFVB2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU19P-L2FFVB2104E requirements.
6.How does Aetrix verify that XCKU19P-L2FFVB2104E is sourced from the original manufacturer or authorized distributors?
All XCKU19P-L2FFVB2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU19P-L2FFVB2104E meets industry standards.
7.What is the process for return or replacement of XCKU19P-L2FFVB2104E?
All XCKU19P-L2FFVB2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU19P-L2FFVB2104E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU19P-L2FFVB2104E part is unused and in its original packaging.
Return procedure for XCKU19P-L2FFVB2104E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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