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AMD XCKU19P-L2FFVJ1760E
- Part No.:
- XCKU19P-L2FFVJ1760E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XCKU19P-L2FFVJ1760E.pdf
- Description:
- IC FPGA KINTEX UP LP 1760FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,572
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Product details
Overview
XCKU19P-L2FFVJ1760E from AMD (formerly Xilinx) is a high-performance Kintex UltraScale+ FPGA featuring 1,548,000 logic cells, 72.5 Mb of block RAM, and support for PCIe Gen4 x16, DDR4-2400, and 25.78 Gb/s transceivers. It targets high-bandwidth data processing in 5G radio units and radar signal conditioning.
For engineers reviewing the XCKU19P-L2FFVJ1760E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver speed grade, I/O bank voltage flexibility, thermal performance in air-cooled 1760-pin FCBGA packages, and configuration security options.
Technical Context
The XCKU19P-L2FFVJ1760E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DMA), and UltraScale+ DSP slices optimized for fixed-point and floating-point matrix operations. It supports partial reconfiguration and AXI4-Stream interfaces for real-time data flow control.
Configuration occurs via dual-boot QSPI flash or JTAG, with AES-256 bitstream encryption and HMAC authentication. The device operates across -40°C to +100°C junction temperature with 0.85 V core supply and configurable I/O banks supporting 1.8 V, 1.5 V, 1.35 V, and 1.2 V standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,548,000 - Enables large-scale digital signal processing pipelines without external ASIC offload. |
| Block RAM | 72.5 Mb - Supports multi-channel buffering for 5G massive MIMO beamforming engines. |
| Transceiver Speed | 25.78 Gb/s - Meets CPRI/eCPRI fronthaul interface requirements for sub-6 GHz 5G base stations. |
| PCIe Interface | Gen4 x16 - Provides 32 GB/s host interface bandwidth for AI inference accelerator co-processing. |
| I/O Standards | LVDS, SSTL, HSTL, MIPI - Allows direct connection to high-speed ADCs, DACs, and memory without level-shifting circuitry. |
| Configuration Security | AES-256 + HMAC - Prevents unauthorized bitstream cloning in deployed telecom infrastructure equipment. |
Pinout & Package
This device uses a 1760-pin Flip-Chip Ball Grid Array (FCBGA) package with 35 mm × 35 mm body size, 0.8 mm ball pitch, and thermal lid for conduction cooling in high-power applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTAVCC / MGTVCCAUX | Analog transceiver power | Separate 1.0 V and 1.8 V supplies required for stable 25.78 Gb/s SerDes operation. |
| VCCINT | Core logic supply | 0.85 V ±3% regulated input essential for timing closure at maximum frequency. |
| VCCO_XX | I/O bank supply | Configurable per-bank voltage (1.2–1.8 V) enables mixed-voltage system interfacing. |
| PROGRAM_B | Configuration reset | Active-low asynchronous reset that clears configuration memory and initiates reload sequence. |
| INIT_B | Configuration status | Open-drain output indicating successful bitstream loading or CRC error detection. |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous compute fabric | Combines programmable logic, hardened PCIe Gen4, and 100G Ethernet MAC for low-latency packet processing. |
| Partial reconfiguration | Enables dynamic function swapping in radar waveform generators without full-system reboot. |
| DSP slice precision | 27 × 18-bit multiplier + 48-bit accumulator supports IEEE 754 half-precision floating-point acceleration. |
| AXI4-Stream interface | Native streaming protocol integration eliminates glue logic for sensor data ingestion into FPGA fabric. |
| Thermal management | Integrated on-die temperature sensors feed closed-loop fan control in air-cooled 5G remote radio heads. |
Applications
| 5G Massive MIMO Radio Unit | Radar Signal Conditioning |
|---|---|
Use Scenario: Real-time beamforming weight calculation and RF channel calibration across 64+ antenna elements. IC Role / Device Role / Timing Role: Primary baseband processor executing adaptive filtering and precoding algorithms in deterministic sub-microsecond latency. Use Value: 1,548,000 logic cells and 25.78 Gb/s transceivers enable concurrent processing of 8x CPRI lanes while maintaining <100 ns jitter budget. | Use Scenario: Pulse-Doppler processing and clutter suppression in airborne synthetic aperture radar systems. IC Role / Device Role / Timing Role: High-throughput FFT engine and CFAR detector with deterministic timing for SAR image reconstruction. Use Value: 72.5 Mb block RAM provides sufficient on-chip storage for 4K×4K range-Doppler maps without external memory bottlenecks. |
| High-Speed Test Equipment | AI Accelerator Co-Processor |
Use Scenario: Multi-channel digital pattern generation and real-time response analysis for semiconductor ATE platforms. IC Role / Device Role / Timing Role: Synchronized I/O controller managing 512+ parallel test vectors with sub-nanosecond skew control. Use Value: Configurable I/O banks support simultaneous LVDS, HSTL, and SSTL signaling for legacy and next-gen DUT interfaces. | Use Scenario: Low-latency inference offload for vision analytics in edge servers with PCIe Gen4 host interconnect. IC Role / Device Role / Timing Role: Dedicated matrix multiplication accelerator using DSP slices and AXI4-Stream dataflow. Use Value: PCIe Gen4 x16 interface delivers 32 GB/s bidirectional bandwidth to sustain >128 TOPS INT8 throughput. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-L2FFVA1156E | Fewer logic cells (1,085,000), lower transceiver speed (16.3 Gb/s), smaller 1156-pin FCBGA package. | Suitable for mid-tier 5G small cells but lacks bandwidth for macro base station fronthaul aggregation. | Select when thermal envelope and PCB layer count constrain use of 1760-pin package. |
| XCKU060-L2FFVA1156E | Lower density (745,000 logic cells), no PCIe Gen4 hard IP, 12.5 Gb/s transceivers only. | Targeted at cost-sensitive radar front-ends where full 25.78 Gb/s is unnecessary. | Choose for applications requiring functional equivalence at reduced power and bill-of-materials cost. |
Compared with XCKU15P-L2FFVA1156E and XCKU060-L2FFVA1156E, the XCKU19P-L2FFVJ1760E delivers higher transceiver bandwidth and logic capacity essential for fronthaul aggregation and real-time SAR processing, while requiring more robust thermal management and larger PCB footprint.
Availability
XCKU19P-L2FFVJ1760E is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar, and high-speed test equipment requiring stable component supply and long-term production continuity.
Supply support for XCKU19P-L2FFVJ1760E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions through its acquisition of Xilinx, focusing on high-performance FPGAs, adaptive SoCs, and AI acceleration platforms.
The Kintex UltraScale+ family, including XCKU19P-L2FFVJ1760E, was designed for high-bandwidth, low-latency signal processing in wireless infrastructure, defense radar, and automated test equipment.
FAQ
What is the maximum supported transceiver data rate for XCKU19P-L2FFVJ1760E?
The XCKU19P-L2FFVJ1760E supports transceiver speeds up to 25.78 Gb/s per lane, validated for CPRI/eCPRI and 100G Ethernet applications. This rating applies specifically to the -2 speed grade and requires proper power sequencing and thermal management per UG578.
Does XCKU19P-L2FFVJ1760E include hardened PCIe Gen4 IP?
Yes, XCKU19P-L2FFVJ1760E integrates hardened PCIe Gen4 x16 root port and endpoint controllers, eliminating the need for soft IP implementation and reducing latency by up to 40% compared to programmable alternatives.
What I/O standards are supported by XCKU19P-L2FFVJ1760E?
XCKU19P-L2FFVJ1760E supports LVDS, SSTL, HSTL, MIPI D-PHY, and differential signaling standards across its 500+ user I/O pins. Each I/O bank is independently configurable for 1.2 V to 1.8 V operation.
Is XCKU19P-L2FFVJ1760E suitable for automotive applications?
No, XCKU19P-L2FFVJ1760E is not qualified to AEC-Q100 standards and lacks extended temperature screening. Its industrial temperature range (-40°C to +100°C) supports telecom and defense applications but not automotive under-hood deployment.
How is configuration security implemented in XCKU19P-L2FFVJ1760E?
XCKU19P-L2FFVJ1760E implements AES-256 bitstream encryption with HMAC authentication using on-chip eFUSE keys. Configuration integrity is verified before execution, preventing unauthorized firmware modification in field-deployed infrastructure.
XCKU19P-L2FFVJ1760E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 105300
- Number of Logic Elements/Cells:
- 1842750
- Total RAM Bits:
- 63753421
- Number of I/O:
- 540
- Number of Gates:
- -
- Voltage - Supply:
- 0.698V ~ 0.742V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 110°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1760-FCBGA (42.5x42.5)
XCKU19P-L2FFVJ1760E FAQ
1.How can I place an order for XCKU19P-L2FFVJ1760E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU19P-L2FFVJ1760E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU19P-L2FFVJ1760E reliable?
The price and inventory of XCKU19P-L2FFVJ1760E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU19P-L2FFVJ1760E is usually 5 days.
3.What payment methods are accepted for XCKU19P-L2FFVJ1760E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU19P-L2FFVJ1760E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU19P-L2FFVJ1760E?
XCKU19P-L2FFVJ1760E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU19P-L2FFVJ1760E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU19P-L2FFVJ1760E?
For technical support, including XCKU19P-L2FFVJ1760E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU19P-L2FFVJ1760E requirements.
6.How does Aetrix verify that XCKU19P-L2FFVJ1760E is sourced from the original manufacturer or authorized distributors?
All XCKU19P-L2FFVJ1760E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU19P-L2FFVJ1760E meets industry standards.
7.What is the process for return or replacement of XCKU19P-L2FFVJ1760E?
All XCKU19P-L2FFVJ1760E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU19P-L2FFVJ1760E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU19P-L2FFVJ1760E part is unused and in its original packaging.
Return procedure for XCKU19P-L2FFVJ1760E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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