AMD XCKU3P-1FFVA676E

Overview

XCKU3P-1FFVA676E from AMD is a Kintex UltraScale+ FPGA with 352K logic cells, 14.6 Mb of block RAM, and 2,520 DSP slices, configured in a 676-pin FCBGA package with 0.8 mm pitch and 2.8 mm × 2.8 mm die size; it supports PCIe Gen4 x16, DDR4-2400 memory interfaces, and operates at -40°C to +100°C junction temperature for high-bandwidth data processing in reconfigurable acceleration platforms.

For engineers reviewing the XCKU3P-1FFVA676E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V/1.35 V/1.8 V), transceiver line rates up to 32.75 Gb/s, and configuration via Quad-SPI or BPI, all critical for embedded vision, 5G baseband, and real-time signal processing designs.

Technical Context

The XCKU3P-1FFVA676E implements a heterogeneous architecture integrating programmable logic, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 PHY), and multi-rate transceivers with PMA/PMA calibration. It uses 16 nm FinFET process technology and supports partial reconfiguration for dynamic function swapping.

Configuration is performed through Master SPI, Slave SelectMAP, or JTAG; bitstream encryption and HMAC authentication are supported for secure boot. The device includes dedicated clock management tiles (CMT) with MMCM and PLL for jitter reduction and frequency synthesis across multiple domains.

Key Specifications

Pinout & Package

Package: 676-pin Fine-Pitch Flip-Chip Ball Grid Array (FFVA), 27 × 27 array, 0.8 mm pitch, 29 mm × 29 mm body size, RoHS-compliant, lead-free solder finish.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance reconfigurable logic applications.

Compared with XCKU3P-1FFVA676E, the XCKU5P-1FFVA676E offers scalable logic headroom in identical form factor, while the XCKU060-2FFVA1156I trades Gen4 capability for raw I/O and thermal robustness-making XCKU3P-1FFVA676E optimal for balanced Gen4-connected edge acceleration.

Availability

XCKU3P-1FFVA676E is available at Aetrix Electronics and suitable for 5G infrastructure, AI edge inference, and medical imaging systems requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for XCKU3P-1FFVA676E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance and adaptive computing solutions, with leadership in CPUs, GPUs, and adaptive SoCs for datacenter, client, and embedded markets.

The Kintex UltraScale+ family targets high-throughput, low-latency reconfigurable systems in communications, test & measurement, and aerospace applications where Gen4 connectivity and hardened IP reduce time-to-market.

FAQ

What is the maximum transceiver line rate supported by the XCKU3P-1FFVA676E?

The XCKU3P-1FFVA676E supports a maximum transceiver line rate of 32.75 Gb/s per lane. This enables direct interface with 100G Ethernet optical modules and high-speed serial protocols such as CEI-28G-VSR. The transceiver architecture includes built-in clock data recovery (CDR), equalization, and pre-emphasis tuning, all configurable via the Xilinx Vivado toolchain. XCKU3P-1FFVA676E achieves this performance within its specified -40°C to +100°C operating range.

Does the XCKU3P-1FFVA676E include a hardened PCIe Gen4 controller?

Yes, the XCKU3P-1FFVA676E integrates a hardened PCIe Gen4 x16 root port or endpoint controller. It supports link training, power management states (L0–L2), and Advanced Error Reporting (AER). The controller is fully compliant with PCI-SIG specifications and eliminates the need for soft IP implementation. XCKU3P-1FFVA676E also supports AXI4 streaming interfaces for seamless integration with user logic and DMA engines.

What configuration modes are supported by the XCKU3P-1FFVA676E?

The XCKU3P-1FFVA676E supports Master SPI, Slave SelectMAP, and JTAG configuration modes. Quad-SPI mode enables fast, secure bitstream loading from serial flash; BPI mode supports parallel NOR flash for high-speed programming; JTAG is used for debugging and boundary-scan testing. All modes support AES-256 bitstream encryption and HMAC-SHA256 authentication. XCKU3P-1FFVA676E requires proper power sequencing and INIT_B deassertion before configuration begins.

What is the I/O voltage range supported per bank on the XCKU3P-1FFVA676E?

The XCKU3P-1FFVA676E supports per-bank I/O voltages of 1.2 V, 1.35 V, and 1.8 V, with selectable standards including LVDS, SSTL, HSTL, and MIPI D-PHY. Each I/O bank has independent VCCO supply, enabling mixed-voltage operation across interfaces-for example, DDR4 memory at 1.2 V and camera sensor at 1.8 V simultaneously. XCKU3P-1FFVA676E requires strict adherence to bank-specific voltage and termination rules defined in UG570.

Is partial reconfiguration supported on the XCKU3P-1FFVA676E?

Yes, the XCKU3P-1FFVA676E supports dynamic partial reconfiguration (PR) through the Vivado Design Suite. PR allows runtime swapping of logical partitions without resetting the entire device-enabling adaptive functions like protocol switching or algorithm updates. XCKU3P-1FFVA676E requires dedicated configuration logic, frame-based bitstream partitioning, and careful floorplanning. Secure PR is supported with authenticated bitstream segments.