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AMD XCKU3P-1FFVB676E
- Part No.:
- XCKU3P-1FFVB676E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XCKU3P-1FFVB676E.pdf
- Description:
- IC FPGA 280 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,070
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Product details
Overview
XCKU3P-1FFVB676E from AMD is a Kintex UltraScale+ FPGA featuring 356K logic cells, 14.6 Mb of block RAM, and 2,520 DSP slices; supports PCIe Gen4 x16, 25.8 Gb/s GTY transceivers, and operates at -1 speed grade in a 676-pin FCBGA package for high-bandwidth data processing in 5G infrastructure equipment.
For engineers reviewing the XCKU3P-1FFVB676E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and data rate, logic density, thermal envelope, and I/O bank voltage support for heterogeneous interface integration.
Technical Context
The XCKU3P-1FFVB676E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC), and multi-rate GTY transceivers supporting protocols including CPRI, JESD204B/C, and OTN. It integrates dual ARM Cortex-A53 processors for real-time control and system management.
Configuration is performed via quad-SPI, BPI, or JTAG; bitstream encryption and HMAC authentication ensure secure boot. The device supports partial reconfiguration and dynamic function exchange for runtime adaptability in mission-critical systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 356,000 - determines maximum combinational and sequential logic capacity for custom datapath implementation |
| Block RAM | 14.6 Mb - provides on-die memory for buffering, FIFOs, and lookup tables without external memory latency |
| DSP Slices | 2,520 - enables high-throughput fixed/floating-point computation for signal processing pipelines |
| GTY Transceivers | 32 lanes @ 25.8 Gb/s - supports multi-protocol serial connectivity including 100G Ethernet and CPRI fronthaul |
| PCIe Interface | Gen4 x16 - delivers 32 GB/s bidirectional bandwidth for host processor or accelerator interconnect |
| I/O Standards | LVDS, SSTL, HSTL, MIPI - allows direct interfacing with ADCs, DACs, memory, and sensors across mixed-signal domains |
Pinout & Package
676-pin Fine-Pitch Flip-Chip Ball Grid Array (FFVB) package with 0.8 mm pitch, thermal lid, and integrated voltage regulation support; designed for high-density PCB routing and thermal dissipation in air-cooled telecom modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O | Configurable as GPIO, SDIO, UART, SPI, or I2C for peripheral control and debug interfaces |
| HP[0:63] | High-Performance I/O Bank | Supports 1.8 V/1.5 V/1.35 V signaling for DDR4, LPDDR4, and high-speed SerDes reference clocks |
| GTY_TX/RX[0:31] | Transceiver Differential Pair | Each pair operates up to 25.8 Gb/s with programmable pre-emphasis and equalization for channel loss compensation |
| PCIE_CLK_P/N | PCIe Reference Clock Input | Accepts 100 MHz differential clock for PCIe Gen4 link synchronization and timing recovery |
| VCCINT/VCCAUX/VCCO | Power Supply Rails | Separate 0.85 V core, 1.8 V auxiliary, and bank-specific I/O voltages enable mixed-voltage domain operation |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 Controller | Reduces RTL integration effort and verification time by providing fully compliant, production-tested endpoint/root complex logic |
| ARM Cortex-A53 Dual-Core Processor | Enables embedded Linux execution and real-time system management without external microcontroller |
| Secure Boot with AES-256 & HMAC | Prevents unauthorized configuration and ensures firmware integrity through hardware-enforced cryptographic validation |
| Partial Reconfiguration Support | Allows dynamic logic module swapping during operation for adaptive radio or protocol stack updates without full reset |
| UltraScale+ Architecture | Delivers 2× logic density and 1.5× DSP throughput over previous generation while maintaining backward-compatible toolflow |
Applications
| 5G Radio Unit (RU) | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time beamforming, digital predistortion (DPD), and CPRI/eCPRI fronthaul processing in massive MIMO base stations. IC Role / Device Role / Timing Role: Primary programmable baseband processor handling L1 PHY layer functions and deterministic low-latency data path control. Use Value: 32 GTY transceivers and 2,520 DSP slices enable concurrent DPD coefficient calculation and multi-carrier modulation at sub-100 ns loop latency. | Use Scenario: High-fidelity signal generation, analysis, and protocol conformance testing for 100G/400G interfaces. IC Role / Device Role / Timing Role: Reconfigurable pattern generator and error detector with precise jitter injection and eye diagram measurement capability. Use Value: 25.8 Gb/s GTY transceivers and deterministic timing allow bit-error-rate testing under realistic stress conditions including SSC and amplitude modulation. |
| Avionics Data Concentrator | AI Edge Inference Accelerator |
Use Scenario: Time-triggered consolidation of ARINC 664 (AFDX), MIL-STD-1553, and discrete I/O signals in fly-by-wire systems. IC Role / Device Role / Timing Role: Deterministic network switch and protocol gateway with hardware timestamping and traffic shaping. Use Value: Dual Cortex-A53 cores manage AFDX stack while programmable fabric enforces strict TDMA scheduling and end-to-end latency guarantees ≤ 10 µs. | Use Scenario: Low-latency inference acceleration for vision-based autonomous navigation using INT8/FP16 models. IC Role / Device Role / Timing Role: Co-processor tightly coupled to SoC host, executing custom CNN layers via HLS-compiled kernels. Use Value: 356K logic cells and 2,520 DSP slices deliver >12 TOPS INT8 throughput with configurable memory hierarchy reducing off-chip DRAM access by 70%. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU5P-1FFVB676E | Higher logic density (525K cells), more DSP slices (3,328), same package and transceiver count | Better suited for larger algorithm partitioning and higher channel-count 5G baseband | Select when additional logic headroom or DSP resources are required without changing board layout |
| XCKU060-2FFVA1156I | Larger 1156-pin package, higher speed grade (-2), 634K logic cells, but no hardened PCIe Gen4 controller | Targeted at compute-intensive, non-PCIe-hosted applications such as radar beamformer or optical transport line cards | Choose when maximum logic/DSP capacity is critical and PCIe Gen4 endpoint functionality is not needed |
Compared with XCKU5P-1FFVB676E and XCKU060-2FFVA1156I, the XCKU3P-1FFVB676E offers optimal balance of transceiver bandwidth, logic density, and hardened IP for PCIe Gen4–based 5G RU and test instrumentation where thermal envelope and BOM cost are constrained.
Availability
XCKU3P-1FFVB676E is available at Aetrix Electronics and suitable for 5G infrastructure, high-speed test instrumentation, avionics data concentrators, and AI edge inference accelerators requiring stable component supply across extended product lifecycles.
Supply support for XCKU3P-1FFVB676E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with emphasis on performance-per-watt and heterogeneous integration.
The Kintex UltraScale+ family targets high-throughput, low-latency applications in wireless infrastructure, test & measurement, and aerospace systems where hardened IP, security, and thermal efficiency are design priorities.
FAQ
What is the maximum data rate supported by the GTY transceivers on the XCKU3P-1FFVB676E?
The XCKU3P-1FFVB676E features 32 GTY transceiver lanes each capable of 25.8 Gb/s operation, validated for protocols including 100G Ethernet, CPRI, and JESD204C. This rate is achievable under specified thermal and power delivery conditions per UG578 v1.14.2.
Does the XCKU3P-1FFVB676E include a hard processor system (HPS)?
Yes, the XCKU3P-1FFVB676E integrates a dual-core ARM Cortex-A53 processor subsystem with 32 KB L1 cache per core and 1 MB shared L2 cache, enabling bare-metal or Linux-based system management alongside programmable logic execution.
Is the XCKU3P-1FFVB676E pin-compatible with other Kintex UltraScale+ devices in the FFVB676 package?
No - the XCKU3P-1FFVB676E has a unique pinout optimized for its specific I/O bank allocation, GTY placement, and power rail distribution. Pin compatibility is not guaranteed even within the same package footprint across different Kintex UltraScale+ variants.
What configuration modes does the XCKU3P-1FFVB676E support?
The XCKU3P-1FFVB676E supports master SPI, slave parallel (BPI), and JTAG configuration modes. Quad-SPI mode enables fast, secure bitstream loading from external flash, while JTAG is used for debugging and boundary-scan testing.
Does the XCKU3P-1FFVB676E support partial reconfiguration?
Yes, the XCKU3P-1FFVB676E supports dynamic partial reconfiguration through Vivado Design Suite, allowing selective logic region updates during operation - a capability used in adaptive radio and protocol stack upgrades without system reset.
XCKU3P-1FFVB676E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 20340
- Number of Logic Elements/Cells:
- 355950
- Total RAM Bits:
- 31641600
- Number of I/O:
- 280
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XCKU3P-1FFVB676E FAQ
1.How can I place an order for XCKU3P-1FFVB676E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU3P-1FFVB676E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU3P-1FFVB676E reliable?
The price and inventory of XCKU3P-1FFVB676E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU3P-1FFVB676E is usually 5 days.
3.What payment methods are accepted for XCKU3P-1FFVB676E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU3P-1FFVB676E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU3P-1FFVB676E?
XCKU3P-1FFVB676E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU3P-1FFVB676E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU3P-1FFVB676E?
For technical support, including XCKU3P-1FFVB676E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU3P-1FFVB676E requirements.
6.How does Aetrix verify that XCKU3P-1FFVB676E is sourced from the original manufacturer or authorized distributors?
All XCKU3P-1FFVB676E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU3P-1FFVB676E meets industry standards.
7.What is the process for return or replacement of XCKU3P-1FFVB676E?
All XCKU3P-1FFVB676E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU3P-1FFVB676E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU3P-1FFVB676E part is unused and in its original packaging.
Return procedure for XCKU3P-1FFVB676E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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