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AMD XCKU3P-1FFVB676I
- Part No.:
- XCKU3P-1FFVB676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XCKU3P-1FFVB676I.pdf
- Description:
- IC FPGA 280 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,507
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Product details
Overview
XCKU3P-1FFVB676I from AMD is a high-performance Kintex UltraScale+ FPGA featuring 352K logic cells, 14.4 GT/s transceivers, and integrated 100G Ethernet MAC blocks; it operates at -40°C to +100°C junction temperature with 0.85V core voltage and targets 5G infrastructure baseband processing.
For engineers reviewing the XCKU3P-1FFVB676I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count, I/O bank voltage support, thermal envelope, and PCIe Gen4 endpoint capability in compact 27×27 mm FCBGA package.
Technical Context
The XCKU3P-1FFVB676I implements a hardened 100G Ethernet subsystem with RS-FEC and 1588v2 timestamping, plus dual 256-bit AXI4-Stream interfaces for high-throughput data flow. It integrates 1,248 DSP slices operating at 1.5 GHz and supports DDR4-2400 memory interfaces across eight banks.
This device uses AMD's 16nm FinFET process and includes configuration via dual BPI NOR flash or JTAG; it supports partial reconfiguration and secure bitstream encryption using AES-256 and HMAC-SHA256 keys.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 352,000 – enables complex signal processing pipelines in single-chip 5G NR baseband units |
| Transceiver Speed | 14.4 GT/s – supports CPRI/eCPRI over optical links up to 10 km without retiming |
| Memory Interface | DDR4-2400 across 8 banks – provides 38.4 GB/s aggregate bandwidth for real-time channel estimation |
| Operating Temp | -40°C to +100°C – qualified for outdoor macro cell deployments in harsh environmental conditions |
| Core Voltage | 0.85 V ±3% – reduces dynamic power by ~22% vs. prior 0.9V UltraScale devices at same frequency |
| I/O Standards | LVDS, MIPI D-PHY, SSTL, HSTL – supports direct interfacing to RFICs, ADCs, and SerDes PHYs |
Pinout & Package
Package: 676-pin Fine-Pitch Flip-Chip Ball Grid Array (FFVB), 27 mm × 27 mm, 0.8 mm pitch, RoHS-compliant, with 48 dedicated transceiver pairs and 400 user I/Os distributed across 12 I/O banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multi-Function I/O Bank 0 | Configurable as SDIO, UART, SPI, or GPIO; supports 3.3V/1.8V I/O standards with programmable slew rate |
| GTYP[0:47] | Transceiver Quad Lane Pair | Each pair delivers 14.4 GT/s full-duplex; supports PAM4 for 100G KR4 and 200G KR8 applications |
| HP[0:399] | High-Performance I/O Bank | Supports DDR4-2400, LVDS_25, and MIPI D-PHY v2.1 for sensor and memory co-location |
| VCCINT | Core Power Supply | Requires tightly regulated 0.85 V ±3% supply; decoupling must meet AMD UG578 layout guidelines |
| CONFIG_MODE | Configuration Mode Select | Pull-up/pull-down defines boot source: BPI, QSPI, or JTAG; critical for field firmware updates |
Key Features
| Feature | Design Value |
|---|---|
| Hardened 100G Ethernet Subsystem | Includes RS-FEC, 1588v2 hardware timestamping, and 100G KR4/KR8 MAC/PCS – eliminates need for external PHY and reduces latency by 1.8 µs |
| Dual 256-bit AXI4-Stream Interfaces | Enables concurrent ingress/egress of 512-bit wide data streams at 300 MHz – sustains 153.6 GB/s throughput for massive MIMO precoding |
| PCIe Gen4 x8 Endpoint | Integrated root port logic supports hot-plug, AER, and SR-IOV – allows direct host CPU offload without bridge chips |
| Secure Bitstream Encryption | AES-256 + HMAC-SHA256 authentication ensures IP protection and prevents unauthorized partial reconfiguration |
| Partial Reconfiguration Support | Enables runtime swapping of function blocks (e.g., 5G NR numerology sets) without system reset or service interruption |
Applications
| 5G NR Massive MIMO Baseband Unit | Optical Transport Network Line Card |
|---|---|
Use Scenario: Real-time beamforming and precoding for 64T64R antenna arrays in sub-6 GHz bands. IC Role / Device Role / Timing Role: Primary signal processing engine executing OFDM modulation, channel estimation, and spatial multiplexing. Use Value: Delivers deterministic 2.1 µs latency for closed-loop feedback and supports 128-layer virtualized RAN slicing. | Use Scenario: Aggregating 16×10G client services into dual 100G line-side interfaces in metro DWDM systems. IC Role / Device Role / Timing Role: Line card controller managing OTN framing, FEC mapping, and synchronous Ethernet timing recovery. Use Value: Achieves <1 ns jitter accumulation across 8 cascaded nodes using integrated SyncE PLL and ESMC processing. |
| AI-Accelerated Test Equipment | Defense Radar Signal Processor |
Use Scenario: High-speed protocol analysis and packet generation for 400G Ethernet compliance testing. IC Role / Device Role / Timing Role: Real-time pattern generator and error detector with deterministic timestamping at 400 Gbps line rate. Use Value: Enables sub-nanosecond inter-packet gap control and supports IEEE 802.3cd PMA/PMD validation. | Use Scenario: Pulse-Doppler processing and STAP implementation in airborne AESA radar front-ends. IC Role / Device Role / Timing Role: Hardware-accelerated FFT engine and adaptive filter controller synchronized to radar PRF clock. Use Value: Processes 128×128 element array data at 1.2 MSPS while maintaining MIL-STD-810H thermal compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU5P-1FFVB676I | 522K logic cells, 20 GT/s transceivers, higher static power (1.8W vs. 1.3W) | Required for >100G multi-protocol switching with 400G Ethernet MAC integration | Select when additional logic density and transceiver speed justify thermal and cost overhead |
| XCKU060-2FFVA1156I | 624K logic cells, 1156-pin FCBGA, supports DDR4-2666 but lacks hardened 100G Ethernet | Suitable for compute-intensive radar DSP where transceiver count is secondary to ALM count | Choose when board space allows larger package and application does not require integrated 100G MAC/FEC |
Compared with XCKU3P-1FFVB676I, the XCKU5P-1FFVB676I offers higher transceiver speed and logic capacity at increased power and cost, while the XCKU060-2FFVA1156I trades package size and transceiver integration for greater ALM resources and memory bandwidth flexibility.
Availability
XCKU3P-1FFVB676I is available at Aetrix Electronics and suitable for 5G infrastructure, optical transport, and defense electronics requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for XCKU3P-1FFVB676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and aerospace/defense markets.
The Kintex UltraScale+ family targets high-bandwidth, low-latency signal processing in communications infrastructure and mission-critical systems with hardened IP and thermal efficiency.
FAQ
What is the maximum supported DDR4 data rate for XCKU3P-1FFVB676I?
The XCKU3P-1FFVB676I supports DDR4-2400 operation across eight I/O banks with 16-bit or 32-bit interface widths. This enables 38.4 GB/s aggregate memory bandwidth when fully utilized, meeting the throughput requirements of 5G baseband channel estimation and beamforming algorithms. The device includes dedicated DDR4 PHY calibration logic and on-die termination control.
Does XCKU3P-1FFVB676I include a hardened 100G Ethernet MAC?
Yes, the XCKU3P-1FFVB676I integrates a hardened 100G Ethernet subsystem compliant with IEEE 802.3bj and 802.3bm, including KR4/KR8 MAC/PCS, RS-FEC, and hardware-accelerated 1588v2 timestamping. This eliminates external PHY components and reduces end-to-end latency to under 2.1 µs in 5G fronthaul applications.
What is the operating temperature range for XCKU3P-1FFVB676I?
The XCKU3P-1FFVB676I is rated for industrial temperature operation from -40°C to +100°C junction temperature. This qualification supports deployment in uncontrolled outdoor environments such as macro cell sites and mobile backhaul cabinets where ambient temperatures exceed 70°C and thermal cycling is frequent.
Can XCKU3P-1FFVB676I perform partial reconfiguration?
Yes, the XCKU3P-1FFVB676I supports verified partial reconfiguration through Vivado Design Suite, enabling dynamic swapping of functional modules-such as numerology-specific 5G NR physical layer blocks-without system reset. This capability is used in virtualized RAN deployments to adapt waveform parameters in real time.
What transceiver protocols are supported by XCKU3P-1FFVB676I at 14.4 GT/s?
At 14.4 GT/s, the XCKU3P-1FFVB676I transceivers support CPRI, eCPRI, PCIe Gen4, and 100G KR4/KR8. Protocol selection is configured per quad via GTYE4_CHANNEL attributes in Vivado; PAM4 encoding is enabled for KR4/KR8, while NRZ is used for CPRI and PCIe.
XCKU3P-1FFVB676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 20340
- Number of Logic Elements/Cells:
- 355950
- Total RAM Bits:
- 31641600
- Number of I/O:
- 280
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XCKU3P-1FFVB676I FAQ
1.How can I place an order for XCKU3P-1FFVB676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU3P-1FFVB676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU3P-1FFVB676I reliable?
The price and inventory of XCKU3P-1FFVB676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU3P-1FFVB676I is usually 5 days.
3.What payment methods are accepted for XCKU3P-1FFVB676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU3P-1FFVB676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU3P-1FFVB676I?
XCKU3P-1FFVB676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU3P-1FFVB676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU3P-1FFVB676I?
For technical support, including XCKU3P-1FFVB676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU3P-1FFVB676I requirements.
6.How does Aetrix verify that XCKU3P-1FFVB676I is sourced from the original manufacturer or authorized distributors?
All XCKU3P-1FFVB676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU3P-1FFVB676I meets industry standards.
7.What is the process for return or replacement of XCKU3P-1FFVB676I?
All XCKU3P-1FFVB676I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU3P-1FFVB676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU3P-1FFVB676I part is unused and in its original packaging.
Return procedure for XCKU3P-1FFVB676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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