AMD XCKU3P-1FFVD900E

Overview

XCKU3P-1FFVD900E from AMD is a Kintex UltraScale+ FPGA featuring 352K logic cells, 14.6 Mb of block RAM, and 1,728 DSP slices, packaged in a 900-pin FCBGA with 0.8 mm pitch. It supports PCIe Gen4 x16, DDR4-2400 memory interfaces, and operates at -40°C to +100°C junction temperature for high-reliability industrial control and aerospace data processing.

For engineers reviewing the XCKU3P-1FFVD900E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2/1.35/1.8 V), transceiver line rates up to 32.75 Gb/s, and configuration via Quad-SPI or BPI flash.

Technical Context

The XCKU3P-1FFVD900E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including PCIe Gen4 root port and DMA engines, and multi-rate GTY transceivers. It integrates dual ARM Cortex-A53 application processors and dual RISC-V microcontrollers for real-time subsystem control.

Configuration uses 32-bit-wide parallel NOR flash or Quad-SPI flash with AES-256 bitstream encryption and HMAC authentication. Power management includes dynamic power gating per SLR and fine-grained clock gating across logic and I/O banks.

Key Specifications

Pinout & Package

Package: 900-pin Fine-Pitch Flip-Chip Ball Grid Array (FFVD900), 31×31 mm, 0.8 mm ball pitch, RoHS-compliant, thermal lid integrated.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XCKU3P-1FFVD900E, the XCKU5P-1FFVD900E offers greater logic density at higher power and cost, while the XCKU060-1FFVA1156I provides more I/O and logic but lacks ARM/RISC-V processors-making XCKU3P-1FFVD900E optimal for tightly integrated SoC-like embedded acceleration.

Availability

XCKU3P-1FFVD900E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband units, and avionics data concentrators requiring stable component supply across long-life industrial and defense programs.

Supply support for XCKU3P-1FFVD900E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, embedded systems, and intelligent edge devices.

The Kintex UltraScale+ family delivers optimized performance-per-watt for compute-intensive, low-latency applications such as wireless infrastructure, aerospace, and machine vision-designed around heterogeneous integration of FPGA fabric, hardened IP, and embedded processors.

FAQ

What is the maximum supported memory interface speed for XCKU3P-1FFVD900E?

XCKU3P-1FFVD900E supports DDR4-2400 (1200 MHz) and LPDDR4-4266 (2133 MHz) memory interfaces with dedicated PHY hard IP. These speeds are validated across the full industrial temperature range and require compliance with AMD UG576 and UG583 design guidelines for PCB layout and termination.

Does XCKU3P-1FFVD900E include integrated ARM processors?

Yes, XCKU3P-1FFVD900E integrates a dual-core ARM Cortex-A53 application processor subsystem and dual RISC-V microcontrollers within its processing system (PS). This enables concurrent real-time control and high-level OS execution alongside programmable logic acceleration in the same die.

What transceiver protocols does XCKU3P-1FFVD900E support at 32.75 Gb/s?

XCKU3P-1FFVD900E GTY transceivers support 32.75 Gb/s line rates for protocols including PCIe Gen4 x16, 100G Ethernet (CAUI-4), and CPRI Option 10. Protocol compliance is achieved using AMD's hardened transceiver controllers and verified reference designs in UG578 and UG576.

Is partial reconfiguration supported on XCKU3P-1FFVD900E?

Yes, XCKU3P-1FFVD900E supports Dynamic Function eXchange (DFX) for partial reconfiguration. This allows selective logic module updates during operation without resetting the entire device or disrupting active I/O or processing system functions.

What security features are implemented in XCKU3P-1FFVD900E configuration flow?

XCKU3P-1FFVD900E implements AES-256 bitstream encryption and HMAC-SHA256 authentication during configuration. These features are enforced in hardware and require matching keys stored in eFUSE or external secure storage to load and verify bitstreams.