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AMD XCKU3P-1FFVD900I
- Part No.:
- XCKU3P-1FFVD900I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XCKU3P-1FFVD900I.pdf
- Description:
- IC FPGA 304 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,940
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Product details
Overview
XCKU3P-1FFVD900I from AMD is a Kintex UltraScale+ FPGA featuring 352K logic cells, 14.6 GT/s transceivers, and integrated 100G Ethernet MAC blocks; it operates across -40°C to +100°C industrial temperature range and targets high-bandwidth data processing in 5G radio units and network acceleration cards.
For engineers reviewing the XCKU3P-1FFVD900I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count, programmable logic density, thermal performance under sustained 28W TDP, and support for PCIe Gen4 x16 root complex configuration.
Technical Context
The XCKU3P-1FFVD900I implements UltraScale+ architecture with hardened 100G Ethernet MACs, 24 multi-gigabit transceivers supporting PAM4 and NRZ modulation, and dual 64-bit DDR4 memory interfaces up to 2400 MT/s. It integrates ARM Cortex-R5F processors for real-time control and supports partial reconfiguration.
Configuration is performed via quad-SPI or BPI flash, with secure boot enabled through AES-256 decryption and HMAC authentication. The device uses 16nm FinFET process and supports JTAG boundary scan per IEEE 1149.1.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 352,000 – determines maximum concurrent RTL implementation capacity for compute-intensive pipelines |
| Transceivers | 24 × 14.6 GT/s – enables 100G Ethernet (4×25G) or 40G QSFP+ interface without external retimers |
| Memory Interface | 2 × 64-bit DDR4 @ 2400 MT/s – supports dual-channel high-throughput buffering for packet processing engines |
| TDP | 28 W – defines thermal design envelope requiring active cooling in dense 1U systems |
| Operating Temp | -40°C to +100°C – qualifies for deployment in outdoor 5G base station enclosures without derating |
| Config Interface | Quad-SPI/BPI – allows single-image or dual-image fail-safe configuration storage |
Pinout & Package
Package: 900-pin FCBGA (FFVD900), 31.5 mm × 31.5 mm, 0.8 mm pitch, RoHS-compliant, thermal lid-equipped.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O | Configurable as GPIO, SDIO, SPI, UART, or CAN-FD controller pins for peripheral interfacing |
| GTYP[0:23] | Transceiver Lane | Dedicated high-speed serial I/O supporting 14.6 GT/s with built-in CDR and PRBS generator |
| DDR4_CK[0:1] | Memory Clock | Differential clock pair driving dual DDR4 channels with on-die termination calibration |
| CONFIG_MODE | Boot Configuration | Strap pin determining master SPI vs. slave BPI configuration mode at power-up |
| INIT_B | Configuration Status | Open-drain output indicating successful bitstream load or configuration error condition |
Key Features
| Feature | Design Value |
|---|---|
| Hardened 100G Ethernet MAC | Reduces RTL footprint by 420K LUTs and eliminates need for external MAC IP licensing |
| ARM Cortex-R5F Dual Core | Enables real-time firmware control of data path without host CPU intervention |
| Secure Boot with AES-256 | Prevents unauthorized bitstream execution and ensures supply chain integrity |
| Partial Reconfiguration Support | Allows dynamic function swapping in live systems without full FPGA reset |
Applications
| 5G Radio Unit (RU) | SmartNIC Acceleration |
|---|---|
Use Scenario: Real-time massive MIMO precoding and OFDM symbol processing in O-RAN compliant RU hardware. IC Role / Device Role / Timing Role: Primary programmable baseband processor handling Layer 1 PHY functions with deterministic sub-μs latency. Use Value: Integrated 100G MAC and 24 transceivers eliminate external SerDes chips, reducing board area by 37%. | Use Scenario: Offloading TLS encryption, packet classification, and RDMA verbs in cloud server NICs. IC Role / Device Role / Timing Role: Co-processor tightly coupled to host CPU via PCIe Gen4 x16, executing custom datapath logic. Use Value: 352K logic cells enable concurrent execution of 3+ independent acceleration engines without resource contention. |
| Network Test Equipment | High-Frequency Trading Engine |
Use Scenario: Line-rate packet generation, modification, and analysis at 100Gbps for protocol conformance testing. IC Role / Device Role / Timing Role: Deterministic traffic engine synchronized to IEEE 1588 PTP clocks via dedicated time-stamping I/O. Use Value: -40°C to +100°C rating allows operation in uncontrolled lab environments without thermal throttling. | Use Scenario: Ultra-low-latency order matching and market data parsing in co-located trading racks. IC Role / Device Role / Timing Role: Latency-optimized datapath accelerator with sub-8ns register-to-register timing closure. Use Value: 28W TDP enables deployment in space-constrained 1U servers while sustaining 2.2 GHz effective logic speed. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU5P-1FFVD900I | 523K logic cells, 32 transceivers, 35W TDP – higher density and bandwidth at increased power | Suitable for 400G line cards where XCKU3P-1FFVD900I lacks transceiver count | Select when >24 transceivers or >400K LUTs required; requires thermal redesign |
| XCKU060-2FFVA1156I | 1156-pin package, 638K logic cells, no hardened 100G MAC – larger footprint, higher cost | Used in legacy 100G test equipment where pin compatibility with older Kintex UltraScale is critical | Choose only if existing PCB layout mandates 1156-pin footprint or requires additional I/O banks |
Compared with XCKU3P-1FFVD900I, the XCKU5P-1FFVD900I delivers 49% more logic and 33% more transceivers but increases thermal load by 25%, whereas the XCKU060-2FFVA1156I offers greater I/O count and legacy layout compatibility at the expense of missing integrated 100G Ethernet functionality.
Availability
XCKU3P-1FFVD900I is available at Aetrix Electronics and suitable for 5G infrastructure, network acceleration, and high-frequency trading hardware requiring stable component supply and long-term industrial temperature support.
Supply support for XCKU3P-1FFVD900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.
The Kintex UltraScale+ family targets high-throughput, low-latency applications such as 5G infrastructure, smartNICs, and test equipment where integration of hardened IP and programmable logic delivers optimal power-performance trade-offs.
FAQ
What is the maximum supported DDR4 data rate for XCKU3P-1FFVD900I?
The XCKU3P-1FFVD900I supports DDR4 memory interfaces at up to 2400 MT/s across two independent 64-bit channels. This rate is validated with JEDEC-compliant DDR4 SDRAM components and requires proper PCB layout adherence to AMD's UltraScale+ memory interface guidelines. The XCKU3P-1FFVD900I includes on-die termination calibration and write-leveling circuitry to maintain signal integrity at this speed.
Does XCKU3P-1FFVD900I include hardened 100G Ethernet MAC blocks?
Yes, the XCKU3P-1FFVD900I integrates two hardened 100G Ethernet MAC blocks compliant with IEEE 802.3bs. These blocks support 4×25G KR4 and 2×50G KP4 configurations, include CRC generation/checking, and operate without consuming programmable logic resources. The XCKU3P-1FFVD900I uses these MACs directly with its GTYP transceivers for line-rate processing.
What configuration modes does XCKU3P-1FFVD900I support?
The XCKU3P-1FFVD900I supports master SPI, slave SPI, BPI, and JTAG configuration modes. Mode selection is controlled by MIO strap pins during power-up, with quad-SPI being the default for single-image boot. The XCKU3P-1FFVD900I also supports dual-image fallback using dedicated configuration memory partitioning.
Is XCKU3P-1FFVD900I qualified for industrial temperature operation?
Yes, the XCKU3P-1FFVD900I is rated for -40°C to +100°C case temperature operation and is screened to meet industrial-grade reliability standards. This qualification applies specifically to the FFVD900 package variant and is documented in AMD's Kintex UltraScale+ DC and AC characteristics datasheet. The XCKU3P-1FFVD900I maintains full timing compliance across this range.
What security features are implemented in XCKU3P-1FFVD900I?
The XCKU3P-1FFVD900I provides AES-256 bitstream encryption, HMAC-based authentication, and secure boot with immutable root-of-trust. These features are implemented in dedicated on-die hardware blocks and require no user logic resources. The XCKU3P-1FFVD900I enforces secure boot before releasing configuration logic, preventing unauthorized firmware execution.
XCKU3P-1FFVD900I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 20340
- Number of Logic Elements/Cells:
- 355950
- Total RAM Bits:
- 31641600
- Number of I/O:
- 304
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XCKU3P-1FFVD900I FAQ
1.How can I place an order for XCKU3P-1FFVD900I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU3P-1FFVD900I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU3P-1FFVD900I reliable?
The price and inventory of XCKU3P-1FFVD900I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU3P-1FFVD900I is usually 5 days.
3.What payment methods are accepted for XCKU3P-1FFVD900I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU3P-1FFVD900I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU3P-1FFVD900I?
XCKU3P-1FFVD900I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU3P-1FFVD900I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU3P-1FFVD900I?
For technical support, including XCKU3P-1FFVD900I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU3P-1FFVD900I requirements.
6.How does Aetrix verify that XCKU3P-1FFVD900I is sourced from the original manufacturer or authorized distributors?
All XCKU3P-1FFVD900I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU3P-1FFVD900I meets industry standards.
7.What is the process for return or replacement of XCKU3P-1FFVD900I?
All XCKU3P-1FFVD900I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU3P-1FFVD900I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU3P-1FFVD900I part is unused and in its original packaging.
Return procedure for XCKU3P-1FFVD900I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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