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AMD XCKU3P-1SFVB784E
- Part No.:
- XCKU3P-1SFVB784E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 784-BFBGA, FCBGA
- Datasheet:
-
XCKU3P-1SFVB784E.pdf
- Description:
- IC FPGA 304 I/O 784FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,275
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Product details
Overview
XCKU3P-1SFVB784E from AMD is a Kintex UltraScale+ FPGA featuring 352K logic cells, 19.2 Mb of block RAM, 1248 DSP slices, and support for PCIe Gen4 x16, DDR4-2400, and 25.8 Gb/s transceivers. It is used in high-bandwidth data acceleration and low-latency networking systems.
For engineers reviewing the XCKU3P-1SFVB784E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage compatibility (1.2 V / 1.35 V / 1.8 V), transceiver lane count (32 GTY), thermal design power (24 W typical), and package footprint (784-pin FCBGA).
Technical Context
The XCKU3P-1SFVB784E implements a heterogeneous architecture with programmable logic, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, memory controllers), and adaptive compute resources. It supports partial reconfiguration and AXI4 interconnect for system-on-chip integration.
It targets applications requiring deterministic latency and high throughput, including 5G front-haul, computational storage, and real-time video processing. The device operates across industrial temperature range (–40°C to +100°C) and supports JTAG and SelectMAP configuration modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 352,000 – determines maximum combinational/sequential logic capacity for custom RTL implementation |
| Block RAM | 19.2 Mb – enables large on-die buffering and FIFOs without external memory |
| DSP Slices | 1,248 – supports parallel multiply-accumulate operations for signal processing workloads |
| GTY Transceivers | 32 lanes @ 25.8 Gb/s – provides native interface to 100G Ethernet, CPRI, and high-speed serial links |
| PCIe Interface | Gen4 x16 root port or endpoint – enables direct CPU/FPGA coherency and high-bandwidth host communication |
| I/O Standards | Supports LVCMOS, SSTL, HSTL, MIPI, and differential signaling up to 1.8 V – ensures interoperability with diverse peripheral interfaces |
| Configuration Mode | SelectMAP, JTAG, or QSPI – allows flexible boot options including remote update and dual-image fallback |
Pinout & Package
Package: 784-pin Fine-Pitch Flip-Chip Ball Grid Array (FCBGA), 23 mm × 23 mm, 0.8 mm pitch, RoHS-compliant, thermal lid-equipped.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.0 V ±3% input for FPGA fabric and CLBs; requires low-noise regulation |
| VCCAUX | Auxiliary supply | 1.8 V supply for configuration logic, clock management, and transceiver analog circuitry |
| VCCO_0 | I/O bank supply | Configurable 1.2/1.35/1.8 V output driver supply for Bank 0; sets I/O voltage level |
| MGTAVCC | Transceiver analog supply | 1.0 V analog supply for GTY transceiver PLLs and serializers; sensitive to ripple |
| CLK_IN_0 | Dedicated clock input | Differential input for primary system clock; connects to MMCM or PLL for internal clock generation |
| INIT_B | Configuration status | Open-drain output indicating configuration completion or error; pulled high externally |
| PROGRAM_B | Configuration reset | Active-low input that clears configuration memory and initiates reconfiguration sequence |
Key Features
| Feature | Design Value |
|---|---|
| UltraScale+ Architecture | Enables higher logic density and lower power per function vs. prior UltraScale generation |
| Hardened PCIe Gen4 Controller | Reduces RTL overhead and verification effort for host interface implementation |
| Integrated 100G Ethernet Subsystem | Provides production-ready MAC, PCS, and PMA layers for optical/PHY-agnostic deployment |
| Partial Reconfiguration Support | Allows dynamic logic swapping during operation without full device reset |
| AXI4 Interconnect Fabric | Standardizes on-chip communication between IP blocks and processor subsystems |
Applications
| 5G Radio Unit Acceleration | Computational Storage Offload |
|---|---|
Use Scenario: Real-time baseband processing and massive MIMO precoding in Open RAN radio units. IC Role / Device Role / Timing Role: Primary accelerator for L1 PHY layer functions with deterministic sub-microsecond latency. Use Value: Enables 5G NR compliance using hardened FFT/IFFT and channel estimation blocks, reducing FPGA resource usage by ~35% vs. soft IP. | Use Scenario: Inline encryption, compression, and deduplication in NVMe SSD controllers. IC Role / Device Role / Timing Role: Co-processor tightly coupled to SSD controller via AXI4-Stream, handling data-path acceleration. Use Value: Achieves >2 GB/s sustained throughput with <5 µs added latency using integrated DMA and scatter-gather engines. |
| Real-Time Video Analytics Edge Node | High-Frequency Trading Network Adapter |
Use Scenario: Multi-stream 4K video ingestion, object detection, and metadata tagging at network edge. IC Role / Device Role / Timing Role: Vision processing unit with parallel CNN inference pipelines and frame-synchronized I/O. Use Value: Processes 16 concurrent 4K@30fps streams using 1248 DSP slices and on-chip memory, eliminating external DRAM bottlenecks. | Use Scenario: Ultra-low-latency market data parsing, order routing, and risk checking in exchange co-location racks. IC Role / Device Role / Timing Role: Deterministic packet processing engine with hardware timestamping and zero-copy DMA. Use Value: Delivers sub-250 ns round-trip latency from NIC RX to TX using PCIe Gen4 x16 and hard MAC bypass logic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU5P-1FFVD900E | Higher logic capacity (525K LC), 24 GTY lanes, 28 W TDP, larger 900-pin FCBGA package | Better suited for multi-protocol 100G+ line cards requiring additional SerDes or memory bandwidth | Select when XCKU3P-1SFVB784E resources are insufficient and board layout accommodates larger footprint |
| XCKU035-1FBVA676E | Fewer logic cells (352K same), no GTY transceivers (only GTH), 16 Gb/s max rate, smaller 676-pin FCBGA | Targeted at cost-sensitive embedded vision or motor control where ultra-high-speed serial I/O is unnecessary | Choose when PCIe Gen4 and 25 Gb/s transceivers are not required and thermal/power budget is tighter |
Compared with XCKU5P-1FFVD900E and XCKU035-1FBVA676E, the XCKU3P-1SFVB784E delivers optimal balance of transceiver performance, logic density, and thermal envelope for mid-tier 5G and computational storage designs - avoiding overdesign while ensuring Gen4 and 25G capability.
Availability
XCKU3P-1SFVB784E is available at Aetrix Electronics and suitable for 5G infrastructure, computational storage, and real-time video analytics requiring stable component supply and long-term industrial lifecycle support.
Supply support for XCKU3P-1SFVB784E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, AI, embedded, and client markets.
The Kintex UltraScale+ family is designed for applications demanding high throughput, low latency, and power efficiency - especially in communications infrastructure, test & measurement, and compute acceleration.
FAQ
What is the maximum supported data rate for transceivers on the XCKU3P-1SFVB784E?
The XCKU3P-1SFVB784E integrates GTY transceivers supporting up to 25.8 Gb/s per lane. This enables native 100G Ethernet (4×25G), CPRI, and high-speed serial protocols without gearbox logic. The XCKU3P-1SFVB784E transceiver specification is validated per IEEE 802.3bj and AMBA AXI4-Stream timing constraints.
Does the XCKU3P-1SFVB784E support PCIe Gen4 x16 in endpoint mode?
Yes, the XCKU3P-1SFVB784E includes a hardened PCIe Gen4 x16 endpoint block compliant with PCI Express Base Specification Revision 4.0. It supports both root port and endpoint configurations, with AXI4 interface and MSI/MSI-X interrupt delivery. The XCKU3P-1SFVB784E achieves full Gen4 link training and LTSSM compliance under industrial temperature conditions.
What configuration modes are supported by the XCKU3P-1SFVB784E?
The XCKU3P-1SFVB784E supports JTAG, SelectMAP, and QSPI master/slave configuration modes. Configuration bitstream can be loaded from external flash via QSPI or streamed from a processor over parallel bus. The XCKU3P-1SFVB784E also supports secure configuration with AES-256 decryption and HMAC authentication.
What is the operating temperature range for the XCKU3P-1SFVB784E?
The XCKU3P-1SFVB784E is rated for industrial temperature operation from –40°C to +100°C (junction). Thermal design must maintain junction temperature within this range using the specified thermal lid and recommended PCB copper pour. The XCKU3P-1SFVB784E thermal characteristics are defined in AMD's UG578 and DS925 documentation.
Is partial reconfiguration supported on the XCKU3P-1SFVB784E?
Yes, the XCKU3P-1SFVB784E fully supports dynamic partial reconfiguration (PR) using Vivado Design Suite. Reconfigurable partitions can be swapped at runtime without affecting other logic regions. The XCKU3P-1SFVB784E PR implementation meets timing closure requirements for both static and reconfigurable regions per UG909 guidelines.
XCKU3P-1SFVB784E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 784-BFBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 20340
- Number of Logic Elements/Cells:
- 355950
- Total RAM Bits:
- 31641600
- Number of I/O:
- 304
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 784-FCBGA (23x23)
XCKU3P-1SFVB784E FAQ
1.How can I place an order for XCKU3P-1SFVB784E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU3P-1SFVB784E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU3P-1SFVB784E reliable?
The price and inventory of XCKU3P-1SFVB784E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU3P-1SFVB784E is usually 5 days.
3.What payment methods are accepted for XCKU3P-1SFVB784E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU3P-1SFVB784E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU3P-1SFVB784E?
XCKU3P-1SFVB784E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU3P-1SFVB784E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU3P-1SFVB784E?
For technical support, including XCKU3P-1SFVB784E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU3P-1SFVB784E requirements.
6.How does Aetrix verify that XCKU3P-1SFVB784E is sourced from the original manufacturer or authorized distributors?
All XCKU3P-1SFVB784E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU3P-1SFVB784E meets industry standards.
7.What is the process for return or replacement of XCKU3P-1SFVB784E?
All XCKU3P-1SFVB784E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU3P-1SFVB784E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU3P-1SFVB784E part is unused and in its original packaging.
Return procedure for XCKU3P-1SFVB784E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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