AMD XCKU3P-1SFVB784I

Overview

XCKU3P-1SFVB784I from AMD is a Kintex UltraScale+ FPGA featuring 352K logic cells, 19.2 Mb of block RAM, 2,520 DSP slices, and support for up to 28.8 Gbps GTY transceivers. It is housed in a 784-pin flip-chip ball grid array (FCBGA) package with industrial temperature rating (–40°C to +100°C), and targets high-bandwidth data processing in radar signal conditioning systems.

For engineers reviewing the XCKU3P-1SFVB784I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver speed grade, I/O bank voltage flexibility (1.2 V / 1.35 V / 1.8 V), thermal performance under sustained 25 W typical power draw, and compatibility with Vivado Design Suite 2023.1+ for partial reconfiguration workflows.

Technical Context

The XCKU3P-1SFVB784I implements a heterogeneous architecture integrating programmable logic, hardened IP blocks (PCIe Gen3 x8, 10/25G Ethernet MAC), and multi-rate transceivers. Its UltraScale+ architecture uses 16 nm FinFET process technology and supports dynamic function exchange (DFX) for runtime partial reconfiguration.

It provides 528 user I/Os across 22 selectable I/O banks, each configurable for LVDS, SSTL, HSTL, or MIPI signaling. Configuration is performed via quad-SPI, BPI, or JTAG, with bitstream encryption enabled through AES-256 and HMAC authentication.

Key Specifications

Pinout & Package

Package: 784-pin Flip-Chip Ball Grid Array (FCBGA), 23 mm × 23 mm, 0.8 mm pitch, RoHS-compliant, with thermal lid.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XCKU3P-1SFVB784I, the XCKU5P-1FFVD900I offers greater scalability at the cost of layout and thermal redesign, while the XCKU3P-2SFVA784I provides tighter timing margins within identical mechanical and I/O constraints-enabling drop-in replacement only when timing closure fails at -1 grade.

Availability

XCKU3P-1SFVB784I is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband acceleration, and medical imaging data aggregation requiring stable component supply across extended product lifecycles.

Supply support for XCKU3P-1SFVB784I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance and adaptive computing solutions, with leadership in FPGA, CPU, GPU, and adaptive SoC technologies.

The Kintex UltraScale+ family delivers optimized performance-per-watt for compute-intensive, I/O-rich applications including wired/wireless infrastructure, aerospace, and medical imaging systems.

FAQ

What is the maximum supported data rate for GTY transceivers on the XCKU3P-1SFVB784I?

The XCKU3P-1SFVB784I supports GTY transceivers operating up to 28.8 Gbps per lane. This rate is validated under industrial temperature conditions with proper PCB stackup and AC coupling. The XCKU3P-1SFVB784I transceiver architecture allows independent rate configuration per channel, enabling mixed-rate operation across the 24 GTY lanes without shared PLL constraints.

Does the XCKU3P-1SFVB784I include hardened PCIe Gen3 controller logic?

Yes, the XCKU3P-1SFVB784I integrates a hardened PCIe Gen3 x8 endpoint/root port controller. This IP block is implemented in dedicated silicon, eliminating the need for RTL synthesis and reducing timing closure risk. The XCKU3P-1SFVB784I PCIe controller supports AXI4 streaming interfaces and full power management (ASPM L0s/L1).

What I/O standards are supported by the HP I/O banks of the XCKU3P-1SFVB784I?

The HP I/O banks of the XCKU3P-1SFVB784I support LVDS, SSTL-18, SSTL-15, HSTL-I, HSTL-II, and MIPI D-PHY v1.2. Each bank is independently configurable for 1.2 V, 1.35 V, or 1.8 V VCCO. The XCKU3P-1SFVB784I does not support RSDS or BLVDS in HP banks-those standards are limited to HR banks not present in this device variant.

Is partial reconfiguration supported on the XCKU3P-1SFVB784I, and what tools are required?

Yes, the XCKU3P-1SFVB784I fully supports dynamic partial reconfiguration using Vivado Design Suite 2022.2 or later. Reconfiguration is performed through ICAP or PCIe-based DMA. The XCKU3P-1SFVB784I requires bitstream partitioning, checkpointed implementation, and secure update signing via HMAC keys stored in eFUSE.

What is the thermal design power (TDP) specification for the XCKU3P-1SFVB784I under typical operating conditions?

The XCKU3P-1SFVB784I has a typical power consumption of 25 W under representative high-activity workloads (e.g., 75% logic utilization, 12 GTY lanes active at 25.78125 Gbps). Its industrial-grade thermal rating (–40°C to +100°C case temperature) is validated with 2-layer thermal vias and 1 oz copper planes. The XCKU3P-1SFVB784I thermal solution must dissipate ≥30 W to maintain reliability over 10-year field life.