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AMD XCKU3P-2FFVA676E
- Part No.:
- XCKU3P-2FFVA676E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XCKU3P-2FFVA676E.pdf
- Description:
- IC FPGA 256 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,323
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Product details
Overview
XCKU3P-2FFVA676E from AMD is a Kintex UltraScale+ FPGA featuring 352K logic cells, 14.6 GT/s transceivers, and integrated 100G Ethernet MAC blocks; it operates at -2 speed grade with 0.85V core voltage and targets high-bandwidth data center acceleration and 5G radio unit processing.
For engineers reviewing the XCKU3P-2FFVA676E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count (32), memory interface support (DDR4 up to 2400 MT/s), thermal design power (29W typical), and package I/O count (324).
Technical Context
The XCKU3P-2FFVA676E implements a heterogeneous architecture with programmable logic fabric, hardened 100G Ethernet subsystems, and dual ARM Cortex-A53 processors for real-time control. It supports PCI Express Gen4 x16 root complex and endpoint configurations with AXI4-Stream interfaces for high-throughput data movement.
Configuration occurs via quad-SPI flash or JTAG, with secure boot enabled through AES-256 encryption and SHA-384 authentication. The device includes 24.9 Mb of block RAM and 2,432 DSP slices optimized for fixed- and floating-point arithmetic.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 352,000 - determines maximum combinational/sequential logic capacity for custom datapaths |
| Transceiver Speed | 14.6 Gb/s - enables 100G Ethernet (4×25G) and PCIe Gen4 compliance |
| Block RAM | 24.9 Mb - supports large on-die buffering for packet processing or video frame storage |
| DSP Slices | 2,432 - delivers 12.8 TFLOPS FP16 compute for AI inference acceleration |
| I/O Count | 324 - provides scalable connectivity to DDR4, QSFP28, and peripheral interfaces |
| TDP | 29 W typical - defines thermal envelope for air-cooled accelerator card designs |
| Speed Grade | -2 - guarantees timing closure at highest operating frequency for critical paths |
Pinout & Package
The XCKU3P-2FFVA676E uses a 676-pin FCBGA package (27×27 mm, 0.8 mm pitch) with 324 user-configurable I/Os distributed across 12 banks supporting LVDS, SSTL, HSTL, and MIPI standards.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multi-Function I/O | Configurable as SDIO, UART, SPI, I2C, or GPIO for PS-to-PL communication |
| GTYP[0:31] | High-Speed Transceiver | Supports 32 lanes of 14.6 Gb/s serial I/O for 100G Ethernet or PCIe Gen4 |
| DDR4_CK[0:1] | Memory Clock | Differential clock pair for DDR4-2400 interface with 0.5 ps jitter tolerance |
| CONFIG_MODE | Configuration Mode Select | Defines boot source (SPI/JTAG/BPI) during power-on reset sequence |
| PROGRAM_B | Configuration Initiate | Active-low signal that triggers FPGA reconfiguration from external flash |
Key Features
| Feature | Design Value |
|---|---|
| Hardened 100G Ethernet Subsystem | Integrates MAC, PCS, and PMA layers eliminating need for external PHY and reducing latency by 1.2 μs |
| Dual Cortex-A53 Processing System | Enables embedded Linux execution alongside PL-accelerated functions without external CPU |
| AES-256 Secure Boot | Prevents unauthorized firmware loading by validating bitstream authenticity before configuration |
| PCIe Gen4 x16 Root Complex | Provides 32 GB/s bidirectional host interface bandwidth for GPU/FPGA co-processing systems |
| UltraScale+ Memory Interface | Supports DDR4-2400 with 128-bit width and hardware-calibrated write leveling for stable high-speed operation |
Applications
| Data Center Acceleration | 5G Radio Unit (RU) |
|---|---|
Use Scenario: Offloading L1/L2 baseband processing in Open RAN compliant radios. IC Role / Device Role / Timing Role: FPGA fabric executes FFT/iFFT, channel coding, and beamforming; hardened Ethernet handles fronthaul transport. Use Value: Achieves 4×25G fronthaul with sub-100 ns deterministic latency using integrated 100G MAC. | Use Scenario: Real-time packet classification and flow steering in smart NICs. IC Role / Device Role / Timing Role: Configurable logic implements custom match-action tables; transceivers connect to QSFP28 ports. Use Value: Processes 100 Gbps line-rate traffic with <500 ns packet latency using on-die block RAM and DSP slices. |
| AI Inference Acceleration | Test & Measurement Equipment |
Use Scenario: Low-latency inferencing for vision-based industrial inspection systems. IC Role / Device Role / Timing Role: DSP slices execute INT8 convolution kernels; DDR4 interface streams sensor data at 19.2 GB/s. Use Value: Delivers 12.8 TOPS INT8 performance within 29W TDP for edge-deployable form factors. | Use Scenario: High-fidelity signal generation and analysis in modular PXIe instruments. IC Role / Device Role / Timing Role: Generates precise multi-channel waveforms using integrated DAC controllers; receives ADC samples via JESD204B. Use Value: Supports 12-bit, 4 GS/s sampling with <−75 dBc SFDR using calibrated transceiver PLLs and low-jitter clocks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU5P-2FFVA676E | Higher logic density (525K cells), same package and I/O, +12% TDP (32.5W) | Better suited for larger algorithm partitioning; requires enhanced thermal management | Select when additional logic resources are needed without changing PCB layout |
| XCKU060-2FFVA676E | Fewer transceivers (24 vs 32), lower DSP count (1,728 vs 2,432), identical package | Limited to 40G Ethernet and smaller AI workloads; lower cost per unit | Choose for cost-sensitive 5G RU deployments where full 100G bandwidth is not required |
Compared with XCKU3P-2FFVA676E, the XCKU5P-2FFVA676E offers headroom for future algorithm expansion while sharing footprint, whereas the XCKU060-2FFVA676E reduces BOM cost at the expense of transceiver bandwidth and compute throughput.
Availability
XCKU3P-2FFVA676E is available at Aetrix Electronics and suitable for data center accelerators, 5G radio units, and AI inference engines requiring stable component supply across multi-year production cycles.
Supply support for XCKU3P-2FFVA676E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, and communications infrastructure.
The Kintex UltraScale+ family delivers high-performance, power-optimized FPGAs for 100G networking, real-time signal processing, and heterogeneous compute acceleration.
FAQ
What is the maximum supported DDR4 data rate for XCKU3P-2FFVA676E?
The XCKU3P-2FFVA676E supports DDR4-2400 (1200 MHz clock) with 128-bit interface width and hardware-calibrated write leveling. This capability enables sustained memory bandwidth of 19.2 GB/s, verified under worst-case process/voltage/temperature conditions using AMD's MIG v3.3 IP core.
Does XCKU3P-2FFVA676E include a hard processor system?
Yes, XCKU3P-2FFVA676E integrates a dual-core ARM Cortex-A53 processing system running at up to 1.5 GHz, with 256 KB of shared L2 cache and dedicated peripherals including Gigabit Ethernet, USB 2.0, and SD/SDIO controllers - all accessible without external microcontroller.
What transceiver protocols does XCKU3P-2FFVA676E natively support?
XCKU3P-2FFVA676E natively supports PCIe Gen4 (x16 root/endpoint), 100G Ethernet (4×25G KR4), CPRI/eCPRI, and JESD204B/C at up to 14.6 Gb/s per lane. Protocol selection is configured via Vivado IP integrator using hardened GTY transceiver primitives.
Is XCKU3P-2FFVA676E compatible with AMD Vitis Unified Software Platform?
Yes, XCKU3P-2FFVA676E is fully supported in AMD Vitis 2023.1+ for C/C++/RTL kernel development, AI Engine graph programming, and platform-aware compilation. Vitis Accelerated Libraries provide pre-verified implementations for FFT, BLAS, and image processing targeting this device.
What is the configuration mode flexibility of XCKU3P-2FFVA676E?
XCKU3P-2FFVA676E supports multiple configuration modes including quad-SPI flash, JTAG boundary scan, and BPI parallel NOR flash. Configuration can be initiated via PROGRAM_B pin or triggered by the PS after secure boot validation, enabling field-upgradable and fail-safe bitstream loading.
XCKU3P-2FFVA676E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 20340
- Number of Logic Elements/Cells:
- 355950
- Total RAM Bits:
- 31641600
- Number of I/O:
- 256
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XCKU3P-2FFVA676E FAQ
1.How can I place an order for XCKU3P-2FFVA676E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU3P-2FFVA676E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU3P-2FFVA676E reliable?
The price and inventory of XCKU3P-2FFVA676E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU3P-2FFVA676E is usually 5 days.
3.What payment methods are accepted for XCKU3P-2FFVA676E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU3P-2FFVA676E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU3P-2FFVA676E?
XCKU3P-2FFVA676E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU3P-2FFVA676E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU3P-2FFVA676E?
For technical support, including XCKU3P-2FFVA676E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU3P-2FFVA676E requirements.
6.How does Aetrix verify that XCKU3P-2FFVA676E is sourced from the original manufacturer or authorized distributors?
All XCKU3P-2FFVA676E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU3P-2FFVA676E meets industry standards.
7.What is the process for return or replacement of XCKU3P-2FFVA676E?
All XCKU3P-2FFVA676E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU3P-2FFVA676E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU3P-2FFVA676E part is unused and in its original packaging.
Return procedure for XCKU3P-2FFVA676E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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