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AMD XCKU3P-2FFVA676I
- Part No.:
- XCKU3P-2FFVA676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XCKU3P-2FFVA676I.pdf
- Description:
- IC FPGA 256 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,558
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Product details
Overview
XCKU3P-2FFVA676I from AMD is a high-performance Kintex UltraScale+ FPGA featuring 350K logic cells, 18.9 Mb of block RAM, and support for up to 42.5 Gbps PAM4 transceivers. It integrates hardened PCIe Gen4 x16, 100G Ethernet MAC, and DDR4 memory controllers, targeting high-bandwidth data acceleration in AI inference edge servers.
For engineers reviewing the XCKU3P-2FFVA676I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver speed grade, I/O bank voltage flexibility (1.2 V to 1.8 V), thermal performance under sustained 28 W TDP, and configuration interface options (JTAG, Quad-SPI, BPI).
Technical Context
The XCKU3P-2FFVA676I implements a heterogeneous architecture with programmable logic fabric, UltraScale+ DSP slices (2,520 units), and integrated hard IP including dual 100G Ethernet MACs and a 16-lane PCIe Gen4 root port. Its transceivers support both NRZ and PAM4 modulation with built-in FEC.
Configuration is performed via Master SPI or SelectMAP mode using 32-bit parallel interface; bitstream encryption uses AES-256 with HMAC authentication. The device supports partial reconfiguration and dynamic function exchange for runtime adaptation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 350,000 - determines maximum combinational/sequential logic capacity for custom datapaths |
| Block RAM | 18.9 Mb - supports large on-die buffering for streaming data pipelines |
| Transceiver Speed | 42.5 Gbps PAM4 - enables single-lane 100G Ethernet without gearbox logic |
| PCIe Interface | Gen4 x16 - provides 32 GB/s bidirectional host interconnect bandwidth |
| DDR4 Support | 2400 Mbps × 72-bit - drives high-throughput memory subsystems with ECC |
| TDP | 28 W - defines thermal solution requirements for sustained compute workloads |
| I/O Standards | LVCMOS, SSTL, HSTL, MIPI - allows direct interfacing with diverse peripheral families |
Pinout & Package
Package: 676-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVA) with 0.8 mm pitch, thermally enhanced with exposed thermal pad. Compatible with standard reflow profiles for RoHS-compliant assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multi-Function I/O Bank 65 | Configurable as SDIO, UART, SPI, I2C, or GPIO with 1.8 V tolerance |
| GTYP[0:31] | Quad GTY Transceiver Lane | Each pair supports 42.5 Gbps PAM4 or 25.78 Gbps NRZ with internal clocking |
| HP[0:63] | High-Performance I/O Bank | Supports 1.2–1.8 V signaling, source-synchronous interfaces up to 1.6 Gbps |
| VRP/VRN | Reference Voltage Pins | Provide precision termination reference for differential I/O standards (e.g., LVDS) |
| CONFIG_IO | Configuration Input/Output | Drives JTAG TDO or receives Quad-SPI DQ signals depending on boot mode |
Key Features
| Feature | Design Value |
|---|---|
| Hardened 100G Ethernet MAC | Reduces RTL integration effort by eliminating need for external MAC IP or glue logic |
| AES-256 Bitstream Encryption | Enables secure field updates and protects proprietary algorithm implementation |
| Partial Reconfiguration Support | Allows dynamic swapping of functional modules without full system reset |
| Dual 16-lane PCIe Gen4 Controllers | Permits concurrent host communication and accelerator-to-accelerator peer-to-peer traffic |
| UltraScale+ DSP Slices | Delivers 10.9 TMAC/s peak compute for fixed-point convolution and filtering kernels |
Applications
| AI Inference Acceleration | 5G Radio Unit (RU) |
|---|---|
Use Scenario: Real-time low-latency inference on vision models at network edge with <100 µs response time. IC Role / Device Role / Timing Role: Configurable hardware accelerator executing quantized CNN layers with on-chip memory buffering. Use Value: Achieves 128 TOPS/W efficiency using hardened DSP slices and PAM4 transceivers for fronthaul offload. | Use Scenario: Massive MIMO beamforming and Layer 1 processing in Open RAN compliant radio units. IC Role / Device Role / Timing Role: Baseband processor implementing FFT, channel estimation, and precoding with deterministic sub-µs latency. Use Value: Leverages 100G Ethernet MAC and 42.5 Gbps transceivers to meet CPRI/eCPRI fronthaul bandwidth requirements. |
| SmartNIC Offload | Test & Measurement Equipment |
Use Scenario: Hardware-accelerated packet classification, TLS termination, and RDMA steering in cloud server NICs. IC Role / Device Role / Timing Role: PCIe-attached co-processor managing network stack bypass and stateful flow inspection. Use Value: Delivers line-rate 100G packet processing using hardened PCIe Gen4 x16 and DDR4 memory controller. | Use Scenario: High-resolution signal generation and analysis in modular PXIe instruments. IC Role / Device Role / Timing Role: Real-time waveform synthesis engine synchronized to ultra-low-jitter system clock. Use Value: Uses integrated PLLs with <150 fs RMS jitter and multi-bank I/O for precise timing alignment across analog front-ends. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU5P-2FFVA676I | Higher logic density (505K cells), same package and pinout, +12% TDP | Better suited for larger algorithm partitions requiring >350K LUTs | Select when design requires additional logic resources without changing PCB layout |
| XCKU3P-1FFVA676I | Same logic count but lower transceiver speed (32.75 Gbps NRZ only), -20% TDP | Targeted at cost-sensitive 25G/50G systems where PAM4 is unnecessary | Choose for thermal-constrained deployments where 42.5 Gbps PAM4 is not required |
Compared with XCKU3P-2FFVA676I, the XCKU5P-2FFVA676I offers higher logic capacity within identical mechanical and electrical footprint, while the XCKU3P-1FFVA676I trades transceiver performance for reduced power and cost-enabling tiered product variants from a single board design.
Availability
XCKU3P-2FFVA676I is available at Aetrix Electronics and suitable for AI inference acceleration, 5G radio unit development, and SmartNIC offload applications requiring stable component supply across multi-year production cycles.
Supply support for XCKU3P-2FFVA676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data center, AI, embedded, and client applications.
The Kintex UltraScale+ family delivers optimized balance of logic, memory, and I/O for high-throughput, low-latency acceleration in networking, test equipment, and edge AI systems.
FAQ
What is the maximum supported transceiver data rate for XCKU3P-2FFVA676I?
The XCKU3P-2FFVA676I supports up to 42.5 Gbps using PAM4 modulation per transceiver lane. This enables single-lane 100G Ethernet connectivity without external gearboxing. NRZ operation is rated up to 25.78 Gbps per lane. Both modes are fully specified in the UltraScale+ transceiver user guide and validated across temperature and voltage corners.
Does XCKU3P-2FFVA676I support partial reconfiguration?
Yes, XCKU3P-2FFVA676I supports partial reconfiguration through Vivado Design Suite tools. This capability allows dynamic replacement of logical modules during operation without resetting the entire device. The feature relies on dedicated configuration logic and frame-based bitstream addressing, and is documented in UG570 and UG909.
What configuration modes are supported by XCKU3P-2FFVA676I?
XCKU3P-2FFVA676I supports Master SPI, Slave SelectMAP, and JTAG configuration modes. Quad-SPI flash is commonly used for production boot; JTAG is reserved for debug and programming. Configuration security features include AES-256 encryption and HMAC authentication, enforced at power-on.
Is XCKU3P-2FFVA676I pin-compatible with other Kintex UltraScale+ devices in FFVA676 package?
XCKU3P-2FFVA676I shares the same 676-ball FFVA package footprint with XCKU5P-2FFVA676I and XCKU3P-1FFVA676I, enabling mechanical compatibility. However, I/O bank assignments and transceiver lane mappings differ between speed grades and logic densities-requiring careful review of the pinout files before substitution.
What is the thermal design power (TDP) rating for XCKU3P-2FFVA676I?
The XCKU3P-2FFVA676I has a typical TDP of 28 W under worst-case operating conditions (100% logic utilization, 42.5 Gbps transceivers active, DDR4 interface running at 2400 Mbps). Thermal solution sizing must account for junction-to-case resistance of 0.39°C/W and recommended airflow of ≥300 LFM for convection cooling.
XCKU3P-2FFVA676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 20340
- Number of Logic Elements/Cells:
- 355950
- Total RAM Bits:
- 31641600
- Number of I/O:
- 256
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XCKU3P-2FFVA676I FAQ
1.How can I place an order for XCKU3P-2FFVA676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU3P-2FFVA676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU3P-2FFVA676I reliable?
The price and inventory of XCKU3P-2FFVA676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU3P-2FFVA676I is usually 5 days.
3.What payment methods are accepted for XCKU3P-2FFVA676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU3P-2FFVA676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU3P-2FFVA676I?
XCKU3P-2FFVA676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU3P-2FFVA676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU3P-2FFVA676I?
For technical support, including XCKU3P-2FFVA676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU3P-2FFVA676I requirements.
6.How does Aetrix verify that XCKU3P-2FFVA676I is sourced from the original manufacturer or authorized distributors?
All XCKU3P-2FFVA676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU3P-2FFVA676I meets industry standards.
7.What is the process for return or replacement of XCKU3P-2FFVA676I?
All XCKU3P-2FFVA676I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU3P-2FFVA676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU3P-2FFVA676I part is unused and in its original packaging.
Return procedure for XCKU3P-2FFVA676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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