AMD XCKU3P-2FFVB676E

Overview

XCKU3P-2FFVB676E from AMD is a Kintex UltraScale+ FPGA featuring 352K logic cells, 19.2 Mb of block RAM, 2,400 DSP slices, and support for PCIe Gen4 x16, DDR4-2400, and 25.8 Gb/s transceivers. It is used in high-bandwidth data acceleration and real-time signal processing systems requiring deterministic latency and hardware parallelism.

For engineers reviewing the XCKU3P-2FFVB676E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver speed grade, I/O bank voltage flexibility, thermal performance under sustained 25G transceiver operation, and configuration security options including AES-256 bitstream encryption.

Technical Context

The XCKU3P-2FFVB676E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 10/25G Ethernet MAC, memory controllers), and multi-rate transceivers supporting protocols up to 25.8 Gb/s. It uses 16nm FinFET process technology and supports dual-boot configuration with fallback capability.

Configuration occurs via quad-SPI, BPI, or JTAG; bitstream integrity is enforced through CRC checking and optional AES-256 decryption. I/O banks operate at 1.8 V, 1.5 V, 1.35 V, or 1.2 V, enabling direct interfacing with DDR4, LPDDR4, and MIPI PHYs without level shifters.

Key Specifications

Pinout & Package

The XCKU3P-2FFVB676E is housed in a 676-pin FCBGA package (27 mm × 27 mm, 1.0 mm pitch) with 452 user I/Os distributed across 22 selectable I/O banks. Thermal pad is exposed on underside for heatsink attachment.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XCKU5P-2FFVB676E and XCKU060-2FFVA1156I, the XCKU3P-2FFVB676E offers optimal balance of transceiver speed, logic density, and thermal envelope in the 676-pin form factor-making it preferred for space-constrained 25G accelerator modules where cost and power efficiency are critical.

Availability

XCKU3P-2FFVB676E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband units, and AI inference accelerators requiring stable component supply and long-term production continuity.

Supply support for XCKU3P-2FFVB676E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, networking, and embedded systems.

The Kintex UltraScale+ family targets high-throughput, low-latency applications in communications infrastructure and real-time processing where performance-per-watt and I/O flexibility are essential.

FAQ

What is the maximum supported transceiver data rate for XCKU3P-2FFVB676E?

The XCKU3P-2FFVB676E supports transceiver data rates up to 25.8 Gb/s per lane in NRZ mode and 25.8 Gb/s in PAM4 mode. This enables compliance with 25G Ethernet, CPRI Option 8, and JESD204C standards. The transceiver architecture includes built-in clock data recovery and adaptive equalization for reliable operation over PCB traces and cables.

Does XCKU3P-2FFVB676E support PCIe Gen4 x16 root complex functionality?

Yes, the XCKU3P-2FFVB676E integrates a hardened PCIe Gen4 x16 root complex controller compliant with PCI Express Base Specification Revision 4.0. It supports full-duplex 32 GB/s bandwidth, ASPM L1 substates, and AER reporting. The controller operates without soft IP overhead, ensuring deterministic latency and reduced integration effort for accelerator card designs.

What I/O standards are supported by XCKU3P-2FFVB676E HP banks?

XCKU3P-2FFVB676E HP I/O banks support LVCMOS, SSTL, HSTL, POD, and differential standards including LVDS, BLVDS, and RSDS. Each HP bank is independently configurable for 1.8 V, 1.5 V, 1.35 V, or 1.2 V VCCO, enabling direct interface with DDR4-2400, LPDDR4-4266, and MIPI D-PHY receivers without external level shifters.

Is AES-256 bitstream encryption available on XCKU3P-2FFVB676E?

Yes, XCKU3P-2FFVB676E supports AES-256 bitstream encryption with HMAC authentication using on-chip key storage. Bitstream decryption occurs during configuration, and keys can be fused into eFUSE or loaded via JTAG. This prevents unauthorized readback, cloning, or modification of the programmed logic design.

What is the thermal design power (TDP) range for XCKU3P-2FFVB676E under typical 25G transceiver usage?

The XCKU3P-2FFVB676E has a typical TDP range of 18–24 W depending on transceiver count active, logic utilization, and I/O switching activity. With all 24 transceivers operating at 25.8 Gb/s and 70% logic utilization, measured power consumption is ~22.3 W. The device includes thermal sensors and automatic shutdown at 125°C junction temperature.