AMD XCKU3P-2FFVB676I

Overview

XCKU3P-2FFVB676I from AMD is a high-performance Kintex UltraScale+ FPGA featuring 352K logic cells, 14.8 Mb of block RAM, and support for up to 32 GTY transceivers operating at 32.75 Gb/s. It integrates hardened PCIe Gen4 x16, 100G Ethernet MAC, and DDR4 memory controller IP, targeting high-bandwidth data processing in 5G infrastructure and radar systems.

For engineers reviewing the XCKU3P-2FFVB676I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver count and speed, on-die memory bandwidth, PCIe Gen4 integration, and thermal performance in air-cooled 676-pin FCBGA packaging.

Technical Context

The XCKU3P-2FFVB676I implements a heterogeneous architecture with programmable logic fabric, UltraScale+ DSP slices (2,520 units), and hardened IP blocks including dual 100G Ethernet MACs and a quad-core ARM Cortex-R5F processor subsystem. It supports AXI4-Stream and AXI4-Full interconnects for high-throughput data movement.

Its GTY transceivers comply with IEEE 802.3bj/ck for 100G KR4/KR2 and support PAM4 signaling. The device uses 16nm FinFET process technology and operates across Industrial temperature grade (-40°C to +100°C junction).

Key Specifications

Pinout & Package

This device is packaged in a 676-pin Fine-Pitch Flip-Chip Ball Grid Array (FFVB676) with 0.8 mm pitch, designed for high-density PCB layouts and thermal dissipation via solder-ball thermal vias and exposed thermal pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCKU3P-2FFVB676I, the XCKU5P offers scalable logic and I/O headroom for future upgrades, while the XCKU15P delivers higher clock stability under thermal load-both retain identical pinout and package, enabling board-level reuse where performance margins allow.

Availability

XCKU3P-2FFVB676I is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar, and high-speed test equipment requiring stable component supply across extended product lifecycles.

Supply support for XCKU3P-2FFVB676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded systems, and client devices through its Adaptive SoC and FPGA portfolio.

The Kintex UltraScale+ family targets high-throughput, low-latency applications in communications, defense, and instrumentation where hardened IP, transceiver performance, and thermal efficiency are critical design constraints.

FAQ

What is the maximum supported data rate for GTY transceivers on the XCKU3P-2FFVB676I?

The XCKU3P-2FFVB676I supports GTY transceivers up to 32.75 Gb/s per lane using PAM4 or NRZ signaling. This enables compliance with IEEE 802.3ck for 100G Ethernet KR4 and supports JESD204C subclass 1 in high-speed data converter interfaces. The XCKU3P-2FFVB676I achieves this rate with built-in equalization and clock-data recovery circuitry.

Does the XCKU3P-2FFVB676I include a hard processor system?

Yes, the XCKU3P-2FFVB676I integrates a dual-core ARM Cortex-R5F processor subsystem with 256 KB of tightly coupled memory (TCM), supporting real-time control tasks such as RF calibration and power sequencing. This hard processor system is independent of the programmable logic fabric and is accessible via AXI interfaces within the XCKU3P-2FFVB676I architecture.

What memory interfaces does the XCKU3P-2FFVB676I support natively?

The XCKU3P-2FFVB676I includes a hardened DDR4 memory controller supporting x72 data width at up to 2400 MT/s, plus native support for LPDDR4, RLDRAM3, and QDR-IV SRAM via programmable I/O banks. These interfaces are implemented in dedicated hardware blocks outside the PL fabric, ensuring deterministic timing and reduced resource utilization in the XCKU3P-2FFVB676I.

Is the XCKU3P-2FFVB676I pin-compatible with other Kintex UltraScale+ devices in the FFVB676 package?

Yes, the XCKU3P-2FFVB676I shares identical pinout and package dimensions with other Kintex UltraScale+ FPGAs in the 676-pin FFVB676 variant, including XCKU5P-2FFVB676I and XCKU15P-2FFVB676I. Power, ground, configuration, and I/O bank assignments are consistent across this package family, enabling footprint reuse in the XCKU3P-2FFVB676I design ecosystem.

What is the industrial temperature rating for the XCKU3P-2FFVB676I?

The XCKU3P-2FFVB676I is rated for Industrial temperature operation with a junction temperature range of -40°C to +100°C. It meets JEDEC JESD22-A104 reliability standards for thermal cycling and is qualified for use in outdoor 5G base stations and avionics systems where passive cooling and wide ambient variation are design constraints for the XCKU3P-2FFVB676I.