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AMD XCKU3P-2FFVD900E
- Part No.:
- XCKU3P-2FFVD900E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XCKU3P-2FFVD900E.pdf
- Description:
- IC FPGA 304 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,713
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Product details
Overview
XCKU3P-2FFVD900E from AMD is a Kintex UltraScale+ FPGA with 352K logic cells, 14.6 GT/s transceivers, and integrated 100G Ethernet MAC blocks; it targets high-bandwidth data processing in 5G radio units and network packet inspection systems.
For engineers reviewing the XCKU3P-2FFVD900E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count, programmable logic density, embedded memory block configuration, and PCIe Gen4 endpoint support.
Technical Context
The XCKU3P-2FFVD900E implements a heterogeneous architecture with programmable logic fabric, hardened 100G Ethernet MACs, and 24x 14.6 GT/s GTY transceivers. It supports PCI Express Gen4 x16 root complex and endpoint configurations with AXI4 interface bridging.
It integrates 1,280 Block RAMs (36 Kb each), 1,440 UltraRAM blocks (288 Kb each), and dual 12-bit 1MSPS ADCs for system monitoring. Configuration is via quad-SPI or BPI flash with secure bitstream encryption.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 352,000 – determines maximum concurrent parallel logic functions and RTL complexity capacity |
| GTY Transceivers | 24 lanes at 14.6 GT/s – enables 100G Ethernet, CPRI/eCPRI, and high-speed serial interconnects |
| Block RAM | 1,280 × 36 Kb – provides on-die memory for FIFOs, buffers, and lookup tables without external DRAM |
| UltraRAM | 1,440 × 288 Kb – delivers large, single-port memory blocks for packet buffering and deep data storage |
| PCIe Interface | Gen4 x16 endpoint/root complex – supports direct CPU-hosted acceleration and high-throughput host communication |
| ADC Channels | 2 × 12-bit @ 1 MSPS – monitors supply voltage, temperature, and board-level analog signals in real time |
Pinout & Package
The XCKU3P-2FFVD900E is housed in a 900-pin flip-chip FCBGA package (FFVD900) with 0.8 mm pitch, designed for high-signal-integrity routing and thermal dissipation in dense compute modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTREFCLK[0-1] | Transceiver reference clock input | Provides low-jitter timing reference for all 24 GTY transceiver banks |
| HR_IO[0-299] | High-performance I/O bank | Supports DDR4, LPDDR4, and MIPI D-PHY interfaces up to 2.4 Gbps |
| PCIE_CLK_P/N | PCIe reference clock differential pair | Required for Gen4 link initialization and clock recovery in endpoint mode |
| VCCINT | Core logic supply | 1.0V regulated input powering FPGA fabric, CLBs, and routing switches |
| CONFIG_MODE | Configuration mode select | Determines boot source: 00=SPI, 01=BPI, 10=JTAG, 11=Master SelectMAP |
Key Features
| Feature | Design Value |
|---|---|
| Hardened 100G Ethernet MAC | Reduces RTL footprint and verification effort for OTN, RoCE, and DPDK-accelerated networking stacks |
| UltraRAM integration | Enables single-cycle access to 288 Kb memory blocks-eliminates need for external SRAM in packet buffer designs |
| Secure bitstream encryption | Supports AES-256 + HMAC-SHA256 to protect IP against cloning and reverse engineering |
| AXI4-Stream interconnect | Provides standardized, low-latency data movement between hardened blocks and programmable logic |
Applications
| 5G Massive MIMO Radio Unit | Network Packet Inspection Appliance |
|---|---|
Use Scenario: Real-time beamforming and precoding computation across 64+ antenna elements in sub-6 GHz and mmWave bands. IC Role / Device Role / Timing Role: FPGA fabric executes custom DSP kernels; GTY transceivers handle fronthaul CPRI/eCPRI links; hardened MAC handles O-RAN mid-haul transport. Use Value: Achieves <100 ns deterministic latency for closed-loop RF control using deterministic AXI4-Stream pipelines. | Use Scenario: Deep packet inspection at 100 Gbps line rate with TLS decryption, pattern matching, and policy enforcement. IC Role / Device Role / Timing Role: XCKU3P-2FFVD900E acts as programmable flow processor-ingesting packets via 100G MAC, executing regex engines in LUTs, and forwarding via PCIe Gen4 to host CPU. Use Value: Delivers 2× throughput vs. previous Kintex-7-based appliances due to GTY transceiver bandwidth and UltraRAM-based stateful session buffers. |
| High-Frequency Trading Engine | AI Inference Accelerator Board |
Use Scenario: Sub-microsecond order execution with market data feed parsing, risk checking, and exchange protocol encoding. IC Role / Device Role / Timing Role: XCKU3P-2FFVD900E serves as ultra-low-latency protocol accelerator-processing FIX/OUCH messages in hardware, managing nanosecond-accurate timestamps, and driving FPGA-to-FPGA interconnects. Use Value: Reduces end-to-end latency by 38% versus software-only implementations through dedicated TCP offload and timestamping logic. | Use Scenario: Edge inference for vision models (YOLOv5, ResNet-50) with real-time sensor fusion from multiple cameras and LiDAR. IC Role / Device Role / Timing Role: Configurable logic implements custom convolution pipelines; GTY transceivers stream raw sensor data; hardened MAC connects to host GPU over 100G Ethernet. Use Value: Enables 128 TOPS equivalent throughput at <25W TDP using sparsity-aware systolic array mapping in fabric. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU5P-2FFVD900E | 523K logic cells, 32 GTY transceivers, higher UltraRAM count (2,160 blocks) | Better suited for multi-100G aggregation or full-stack AI training acceleration | Select when >352K logic cells or >24 transceivers are required; same FFVD900 package enables PCB reuse |
| XCKU060-2FFVA1156I | 634K logic cells, 1156-pin FCBGA, no hardened 100G MAC | Targets compute-intensive workloads without native Ethernet transport offload | Choose when maximum logic density is critical and 100G MAC is implemented in soft logic |
Compared with XCKU5P-2FFVD900E and XCKU060-2FFVA1156I, the XCKU3P-2FFVD900E balances transceiver bandwidth, logic capacity, and hardened networking IP-making it optimal for cost-sensitive 100G edge deployments where PCB footprint and power efficiency are constrained.
Availability
XCKU3P-2FFVD900E is available at Aetrix Electronics and suitable for 5G infrastructure, network security appliances, and low-latency financial systems requiring stable component supply and long-term industrial availability.
Supply support for XCKU3P-2FFVD900E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and client markets with focus on performance-per-watt innovation.
The Kintex UltraScale+ family delivers optimized FPGA platforms for high-throughput, low-latency applications including wireless infrastructure, test & measurement, and real-time video processing.
FAQ
What is the maximum supported transceiver data rate for XCKU3P-2FFVD900E?
The XCKU3P-2FFVD900E supports GTY transceivers operating up to 14.6 GT/s per lane. This enables compliance with 100G Ethernet (4×25G), 200G (4×50G PAM4), and CPRI Option 10 fronthaul standards. The transceiver architecture includes built-in gearbox and PRBS generators for link validation.
Does XCKU3P-2FFVD900E include hardened 100G Ethernet MAC functionality?
Yes, the XCKU3P-2FFVD900E integrates dual hardened 100G Ethernet MAC blocks compliant with IEEE 802.3bs. These MACs support RS-FEC, CRC-32, and flexible preamble insertion-reducing logic utilization and enabling deterministic latency for O-RAN and data center interconnect use cases.
What configuration modes are supported by XCKU3P-2FFVD900E?
XCKU3P-2FFVD900E supports four primary configuration modes: Quad-SPI flash, BPI flash, JTAG boundary scan, and Master SelectMAP. Mode selection is controlled by CONFIG_MODE pins during power-up, and bitstream authentication is enforced via AES-256 decryption before loading into fabric.
Is XCKU3P-2FFVD900E compatible with Vivado Design Suite 2023.1?
Yes, XCKU3P-2FFVD900E is fully supported in Vivado Design Suite 2023.1 and later versions. Device files, IP integrators, and timing analysis tools include specific characterization for FFVD900 package skew, GTY channel calibration, and UltraRAM read/write timing closure.
What thermal management guidance applies to XCKU3P-2FFVD900E in continuous operation?
XCKU3P-2FFVD900E requires a heatsink with minimum 12 W thermal resistance (°C/W) under full utilization. Junction temperature must remain below 100°C; thermal pads and 2-layer copper pours beneath the FFVD900 package are mandatory per AMD UG578 guidelines.
XCKU3P-2FFVD900E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 20340
- Number of Logic Elements/Cells:
- 355950
- Total RAM Bits:
- 31641600
- Number of I/O:
- 304
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XCKU3P-2FFVD900E FAQ
1.How can I place an order for XCKU3P-2FFVD900E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU3P-2FFVD900E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU3P-2FFVD900E reliable?
The price and inventory of XCKU3P-2FFVD900E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU3P-2FFVD900E is usually 5 days.
3.What payment methods are accepted for XCKU3P-2FFVD900E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU3P-2FFVD900E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU3P-2FFVD900E?
XCKU3P-2FFVD900E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU3P-2FFVD900E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU3P-2FFVD900E?
For technical support, including XCKU3P-2FFVD900E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU3P-2FFVD900E requirements.
6.How does Aetrix verify that XCKU3P-2FFVD900E is sourced from the original manufacturer or authorized distributors?
All XCKU3P-2FFVD900E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU3P-2FFVD900E meets industry standards.
7.What is the process for return or replacement of XCKU3P-2FFVD900E?
All XCKU3P-2FFVD900E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU3P-2FFVD900E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU3P-2FFVD900E part is unused and in its original packaging.
Return procedure for XCKU3P-2FFVD900E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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