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AMD XCKU3P-2FFVD900I
- Part No.:
- XCKU3P-2FFVD900I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XCKU3P-2FFVD900I.pdf
- Description:
- IC FPGA 304 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,918
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Product details
Overview
XCKU3P-2FFVD900I from AMD is a Kintex UltraScale+ FPGA with 352K logic cells, 14.6 GT/s transceivers, and integrated 100G Ethernet MAC blocks, configured in a 900-pin flip-chip FCBGA package for high-bandwidth data plane acceleration in 5G radio units.
For engineers reviewing the XCKU3P-2FFVD900I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count, programmable I/O voltage support (1.8 V/1.5 V/1.35 V), and hardened IP availability for CPRI/eCPRI and IEEE 1588 timestamping.
Technical Context
The XCKU3P-2FFVD900I implements UltraScale+ architecture with 352,000 system logic cells, 1,440 DSP slices, and 32.1 Mb of block RAM. It supports up to 48 GTYP transceivers operating at 14.6 Gb/s with PMA-level PRBS pattern generation and error detection.
It integrates hardened 100G Ethernet MACs compliant with IEEE 802.3bj, supports IEEE 1588-2008 hardware timestamping with sub-10 ns precision, and includes AXI4-Stream interfaces for direct connection to RF front-end ADC/DAC cores.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 352,000 - determines maximum concurrent parallel processing capacity for baseband signal chain functions |
| GTYP Transceivers | 48 lanes @ 14.6 Gb/s - enables full-duplex 100G Ethernet and multi-lane CPRI/eCPRI fronthaul links |
| Block RAM | 32.1 Mb - supports deep buffering for OFDM symbol alignment and channel estimation pipelines |
| I/O Standards | LVDS, SSTL, HSTL, MIPI D-PHY - allows direct interface to RFICs, memory, and sensor subsystems |
| Hardened IP | 100G Ethernet MAC + IEEE 1588 v2 timestamping - eliminates soft-core latency and resource overhead for time-sensitive radio control |
| Package | 900-pin FCBGA (FFVD900) - provides thermal and signal integrity for sustained 2W/mm² power density in compact RU modules |
Pinout & Package
Package: 900-pin Flip-Chip Ball Grid Array (FFVD900), 31.0 mm × 31.0 mm, 0.8 mm pitch, RoHS-compliant, with dedicated VCCINT/VCCAUX/VCCO banks and differential clock inputs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M17 | MRCC_N | Dedicated multi-gigabit clock input pair for transceiver reference clocks |
| A12 | IO_L1P_T0_0 | Programmable I/O bank 0, supports 1.8 V/1.5 V/1.35 V signaling for memory or sensor interface |
| R15 | GTYE4_RXN_0 | Transceiver receive differential pair for lane 0, supports 14.6 Gb/s PAM4/CPRi |
| T14 | GTYE4_TXP_0 | Transceiver transmit differential pair for lane 0, matched length to RX for deterministic skew |
| K18 | VCCINT | Core logic supply (0.85 V), routed on inner layers with dedicated decoupling pad array |
Key Features
| Feature | Design Value |
|---|---|
| UltraScale+ Architecture | Enables concurrent execution of FFT, filter, and MIMO precoding kernels without external co-processors |
| Hardened 100G Ethernet MAC | Reduces RTL integration effort by 3–4 weeks and eliminates PHY-level timing closure risk |
| IEEE 1588 v2 Hardware Timestamping | Delivers ±5 ns timestamp accuracy for synchronized TDD frame alignment across distributed radios |
| AXI4-Stream Interconnect | Provides zero-latency, flow-controlled data path between RF sampling cores and packet processing engines |
| Multi-Voltage I/O Banks | Allows simultaneous interfacing to 1.8 V ADCs, 1.35 V FPGAs, and 3.3 V backplane controllers |
Applications
| 5G Massive MIMO Radio Unit | Open RAN Distributed Unit (O-DU) |
|---|---|
Use Scenario: Real-time beamforming and digital pre-distortion in 3.5 GHz/26 GHz active antenna systems. IC Role / Device Role / Timing Role: Primary signal processing engine executing L1 PHY layer functions with deterministic latency under 10 µs. Use Value: 352K logic cells and 48 GTYP lanes enable dual-band operation with independent waveform processing per sector. | Use Scenario: Layer 2 protocol termination and fronthaul aggregation for multiple RU units over eCPRI. IC Role / Device Role / Timing Role: Centralized scheduler and packet classifier with hardware-accelerated header parsing and queue management. Use Value: Hardened 100G MAC and AXI4-Stream interconnect reduce packet processing jitter to < 50 ns for strict O-RAN compliance. |
| Time-Sensitive Networking Bridge | High-Frequency Trading Accelerator |
Use Scenario: Deterministic forwarding of IEEE 802.1AS time-synchronized traffic across industrial Ethernet segments. IC Role / Device Role / Timing Role: Precision timing node performing boundary clock functionality with hardware timestamp insertion/removal. Use Value: Sub-10 ns IEEE 1588 v2 timestamp resolution ensures sub-microsecond synchronization across multi-hop networks. | Use Scenario: Low-latency order matching and market data feed parsing in FPGA-accelerated trading platforms. IC Role / Device Role / Timing Role: Real-time packet inspection engine with line-rate 100G Ethernet ingress/egress and custom protocol decoding. Use Value: 48 GTYP transceivers and 32.1 Mb block RAM allow parallel processing of 10+ market data feeds with < 200 ns end-to-end latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU5P-2FFVD900I | 527K logic cells, same FFVD900 package, higher DSP slice count (2,160), identical transceiver spec | Supports wider bandwidth waveforms (e.g., 800 MHz NR FR2) and additional L1 parallelization | Select when >352K logic cells or >1,440 DSP slices are required for advanced MIMO or AI inference offload |
| XCKU060-2FFVA1156I | 600K logic cells, larger 1156-pin FCBGA (FFVA1156), 64 GTYP transceivers, 42.5 Mb BRAM | Enables full-stack O-RU + O-DU integration in single device; requires PCB redesign | Choose for consolidated radio stack deployment where board space permits larger package and higher power budget |
Compared with XCKU3P-2FFVD900I, the XCKU5P offers incremental logic/DSP scaling within identical footprint and power envelope, while the XCKU060 delivers significantly higher capacity at the cost of mechanical and thermal redesign.
Availability
XCKU3P-2FFVD900I is available at Aetrix Electronics and suitable for 5G radio units, Open RAN infrastructure, and time-critical industrial networking requiring stable component supply across extended product lifecycles.
Supply support for XCKU3P-2FFVD900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, communications, and embedded markets.
The Kintex UltraScale+ family targets high-throughput, low-latency signal processing in wireless infrastructure, aerospace, and test equipment where hardened IP and transceiver performance are critical.
FAQ
What is the maximum transceiver data rate supported by the XCKU3P-2FFVD900I?
The XCKU3P-2FFVD900I supports GTYP transceivers operating at up to 14.6 Gb/s per lane, validated for IEEE 802.3bj 100GBASE-KR4 and CPRI Option 10 applications. This rate is achievable across all 48 lanes simultaneously under specified thermal and power conditions, with built-in PRBS generators and error detectors for link validation.
Does the XCKU3P-2FFVD900I include hardware support for IEEE 1588 timestamping?
Yes, the XCKU3P-2FFVD900I integrates dedicated IEEE 1588-2008 v2 hardware timestamping logic with sub-10 ns precision. It supports both one-step and two-step timestamp insertion/removal on 100G Ethernet frames, and is configurable for boundary clock operation in TSN and 5G fronthaul deployments.
What I/O voltage standards are supported by the XCKU3P-2FFVD900I?
The XCKU3P-2FFVD900I supports multiple I/O standards including LVDS, SSTL-18/15, HSTL-I/II, and MIPI D-PHY across its 24 programmable I/O banks. Each bank operates independently at 1.8 V, 1.5 V, or 1.35 V, enabling mixed-voltage interfacing to RF converters, memory, and legacy controllers without level shifters.
Is the XCKU3P-2FFVD900I pin-compatible with other Kintex UltraScale+ devices in the FFVD900 package?
No, the XCKU3P-2FFVD900I is not pin-compatible with other Kintex UltraScale+ devices in the FFVD900 package. While the package footprint is identical, ball function mapping differs across variants (e.g., XCKU5P-2FFVD900I assigns different signals to pins M17 and R15), requiring board-level redesign for substitution.
What hardened IP blocks are integrated into the XCKU3P-2FFVD900I?
The XCKU3P-2FFVD900I includes hardened 100G Ethernet MAC blocks compliant with IEEE 802.3bj, IEEE 1588 v2 timestamping engines, and AXI4-Stream interconnect fabric. These blocks operate independently of fabric resources, preserving logic cell count for application-specific signal processing kernels.
XCKU3P-2FFVD900I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 20340
- Number of Logic Elements/Cells:
- 355950
- Total RAM Bits:
- 31641600
- Number of I/O:
- 304
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XCKU3P-2FFVD900I FAQ
1.How can I place an order for XCKU3P-2FFVD900I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU3P-2FFVD900I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU3P-2FFVD900I reliable?
The price and inventory of XCKU3P-2FFVD900I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU3P-2FFVD900I is usually 5 days.
3.What payment methods are accepted for XCKU3P-2FFVD900I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU3P-2FFVD900I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU3P-2FFVD900I?
XCKU3P-2FFVD900I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU3P-2FFVD900I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU3P-2FFVD900I?
For technical support, including XCKU3P-2FFVD900I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU3P-2FFVD900I requirements.
6.How does Aetrix verify that XCKU3P-2FFVD900I is sourced from the original manufacturer or authorized distributors?
All XCKU3P-2FFVD900I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU3P-2FFVD900I meets industry standards.
7.What is the process for return or replacement of XCKU3P-2FFVD900I?
All XCKU3P-2FFVD900I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU3P-2FFVD900I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU3P-2FFVD900I part is unused and in its original packaging.
Return procedure for XCKU3P-2FFVD900I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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