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AMD XCKU3P-2SFVB784E
- Part No.:
- XCKU3P-2SFVB784E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 784-BFBGA, FCBGA
- Datasheet:
-
XCKU3P-2SFVB784E.pdf
- Description:
- IC FPGA 304 I/O 784FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,526
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Product details
Overview
XCKU3P-2SFVB784E from AMD is a Kintex UltraScale+ FPGA featuring 352K logic cells, 19.2 Mb of block RAM, and 2,520 DSP slices, packaged in a 784-pin flip-chip BGA (FVB) with 0.8 mm pitch. It supports PCIe Gen3 x16, DDR4-2400 memory interfaces, and operates at -40°C to +100°C junction temperature for industrial-grade reliability.
For engineers reviewing the XCKU3P-2SFVB784E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (520 user I/Os), transceiver line rate (16.3 Gb/s), and thermal design power (22 W typical), critical for high-bandwidth data acquisition and real-time signal processing systems.
Technical Context
The XCKU3P-2SFVB784E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including PCIe Gen3 root port and DMA engines, and multi-rate transceivers supporting protocols up to 16.3 Gb/s. It integrates dual 100G Ethernet MACs and AXI4-Stream interfaces for high-throughput packet processing.
Configuration is performed via quad-SPI or JTAG, with support for secure bitstream encryption using AES-256 and HMAC authentication. The device uses SelectIO technology with programmable I/O standards including LVDS, SSTL, and HSTL across 520 user pins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 352,000 - determines maximum combinational/sequential logic capacity for custom RTL implementation |
| Block RAM | 19.2 Mb - enables large on-die buffering for video frame stores or packet queues without external memory |
| DSP Slices | 2,520 - supports parallel FIR filtering, FFT computation, or matrix multiplication at >100 GOPS |
| User I/O Pins | 520 - provides scalable interface connectivity to ADCs, DACs, FMC carriers, and memory controllers |
| Transceiver Line Rate | 16.3 Gb/s - enables direct connection to 100G Ethernet PHYs or high-speed serial ADC/DACs |
| Operating Temperature | -40°C to +100°C - qualified for industrial and aerospace environments without derating |
| TDP | 22 W typical - defines heatsink sizing and airflow requirements in enclosed enclosures |
Pinout & Package
Package: 784-pin flip-chip BGA (FVB), 23 mm × 23 mm, 0.8 mm pitch, RoHS-compliant, thermal lid integrated.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 0.85 V ±3% to FPGA logic fabric; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | Provides 1.8 V to configuration logic, PCIe block, and transceiver reference circuits |
| MGTAVCC | Transceiver analog supply | Delivers 0.95 V ±2% to high-speed SerDes analog circuitry; sensitive to ripple and noise |
| CLK_IN_0 | Dedicated clock input | Accepts single-ended or differential reference clocks up to 800 MHz for PLL/MMCM locking |
| INIT_B | Configuration status | Open-drain output indicating bitstream load success/failure; pulled high externally |
| PROGRAM_B | Configuration trigger | Active-low signal initiating full reconfiguration from flash or host processor |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x16 Hard IP | Reduces RTL integration effort and timing closure risk for host interface designs |
| 100G Ethernet MAC + PCS | Enables line-rate packet forwarding without external MAC chips or firmware overhead |
| AES-256 Bitstream Encryption | Prevents reverse engineering and unauthorized cloning of proprietary FPGA configurations |
| SelectIO Technology | Supports mixed-voltage I/O banks with independent termination and slew rate control per bank |
| UltraScale+ Architecture | Delivers 1.5× higher logic density and 2× more DSP throughput than previous Kintex generation |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA acts as real-time digital front-end, performing ADC sample alignment, CFAR detection, and SAR image reconstruction. Use Value: 2,520 DSP slices enable simultaneous 128-channel FFTs at 100 MS/s; 16.3 Gb/s transceivers interface directly to RF sampling ADCs. | Use Scenario: Multi-channel oscilloscopes and spectrum analyzers capturing >1 GS/s per channel. IC Role / Device Role / Timing Role: Configurable logic synchronizes high-speed ADCs, buffers samples in block RAM, and streams data over PCIe Gen3 x16 to host PC. Use Value: 520 user I/Os support 32-channel parallel ADC interfacing; 19.2 Mb block RAM holds 2 million 16-bit samples before streaming. |
| 5G Wireless Baseband | Industrial Machine Vision |
Use Scenario: Massive MIMO baseband processing in sub-6 GHz 5G NR macrocells. IC Role / Device Role / Timing Role: Implements layer-1 PHY functions including LDPC decoding, OFDM modulation, and precoding matrix computation. Use Value: PCIe Gen3 x16 connects to host CPU for control plane; hardened Ethernet MACs handle fronthaul traffic to remote radio units. | Use Scenario: High-resolution, high-frame-rate inspection systems in semiconductor manufacturing. IC Role / Device Role / Timing Role: FPGA processes pixel data from CMOS image sensors, performs real-time defect classification, and triggers precision actuators. Use Value: SelectIO supports MIPI CSI-2 and SLVS-EC interfaces; -40°C to +100°C rating ensures operation inside sealed machine enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU5P-2FFVD900E | Higher logic density (525K LC), larger package (900-pin FFB), 28 W TDP | Better suited for multi-100G packet processing or AI inference acceleration requiring >400K LC | Select when additional logic, DSP, or transceiver resources are required beyond XCKU3P-2SFVB784E capacity |
| XCKU15P-2FFVA1156E | 1.1M logic cells, 1156-pin FFA package, 42 W TDP, supports PCIe Gen4 | Targeted at next-gen 400G/800G optical transport and AI training accelerators | Choose only if PCIe Gen4 x16 or >800 Gb/s aggregate bandwidth is mandatory |
Compared with XCKU3P-2SFVB784E, the XCKU5P offers moderate resource scaling within the same architecture and toolflow, while the XCKU15P introduces significant power, package, and interface upgrades-making it over-specified for most industrial and radar applications where XCKU3P-2SFVB784E delivers optimal cost-performance balance.
Availability
XCKU3P-2SFVB784E is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and 5G wireless baseband applications requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for XCKU3P-2SFVB784E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded systems, and client devices through its FPGA, adaptive SoC, and GPU product lines.
The Kintex UltraScale+ family targets high-throughput, low-latency applications in aerospace, defense, wired communications, and test & measurement-designed to replace ASICs with field-upgradable flexibility and deterministic performance.
FAQ
What is the maximum supported DDR4 memory speed for XCKU3P-2SFVB784E?
The XCKU3P-2SFVB784E supports DDR4-2400 (1200 MHz) with a 16-bit or 32-bit interface using dedicated memory controller hard IP. This speed is validated across all speed grades and operating conditions specified in the device's DC and AC switching characteristics table. XCKU3P-2SFVB784E achieves this using calibrated I/O timing and on-die termination, eliminating need for external register components in standard DIMM layouts.
Does XCKU3P-2SFVB784E include hardened PCIe Gen3 endpoints?
Yes, XCKU3P-2SFVB784E integrates a hardened PCIe Gen3 x16 endpoint block compliant with PCI Express Base Specification Revision 3.1. It supports both root port and endpoint modes, with automatic link training, error reporting, and MSI/MSI-X interrupt handling. XCKU3P-2SFVB784E does not require soft-core PCIe implementations, reducing latency and resource usage in host-connected accelerator designs.
What configuration modes are supported by XCKU3P-2SFVB784E?
XCKU3P-2SFVB784E supports master SPI, slave SPI, JTAG, and BPI configuration modes. Quad-SPI mode enables fast bitstream loading from serial flash, while JTAG is used for debugging and boundary scan. Configuration is initiated by PROGRAM_B and monitored via INIT_B and DONE signals. XCKU3P-2SFVB784E also supports fallback configuration and dual-boot from two flash sectors.
Is XCKU3P-2SFVB784E qualified for automotive applications?
No, XCKU3P-2SFVB784E is rated for industrial temperature range (-40°C to +100°C) and is not AEC-Q100 qualified. It lacks automotive-specific process controls, failure-in-time (FIT) reporting, and extended reliability testing required for automotive ECUs. For automotive use cases, AMD offers the XCKU15P-2FFVA1156E with automotive qualification under separate part numbering and screening.
Can XCKU3P-2SFVB784E implement a 100G Ethernet MAC without external PHY?
XCKU3P-2SFVB784E includes hardened 100G Ethernet MAC + PCS blocks but requires an external 100G optical or electrical PHY for physical layer signaling. The MAC/PCS handles framing, scrambling, and Reed-Solomon FEC, while the transceivers provide the 4×25.78125 Gb/s PAM4 lanes. XCKU3P-2SFVB784E does not integrate CDR or analog driver/receiver circuitry needed for direct fiber or copper interface.
XCKU3P-2SFVB784E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 784-BFBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 20340
- Number of Logic Elements/Cells:
- 355950
- Total RAM Bits:
- 31641600
- Number of I/O:
- 304
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 784-FCBGA (23x23)
XCKU3P-2SFVB784E FAQ
1.How can I place an order for XCKU3P-2SFVB784E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU3P-2SFVB784E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU3P-2SFVB784E reliable?
The price and inventory of XCKU3P-2SFVB784E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU3P-2SFVB784E is usually 5 days.
3.What payment methods are accepted for XCKU3P-2SFVB784E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU3P-2SFVB784E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU3P-2SFVB784E?
XCKU3P-2SFVB784E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU3P-2SFVB784E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU3P-2SFVB784E?
For technical support, including XCKU3P-2SFVB784E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU3P-2SFVB784E requirements.
6.How does Aetrix verify that XCKU3P-2SFVB784E is sourced from the original manufacturer or authorized distributors?
All XCKU3P-2SFVB784E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU3P-2SFVB784E meets industry standards.
7.What is the process for return or replacement of XCKU3P-2SFVB784E?
All XCKU3P-2SFVB784E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU3P-2SFVB784E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU3P-2SFVB784E part is unused and in its original packaging.
Return procedure for XCKU3P-2SFVB784E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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