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AMD XCKU3P-2SFVB784I
- Part No.:
- XCKU3P-2SFVB784I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 784-BFBGA, FCBGA
- Datasheet:
-
XCKU3P-2SFVB784I.pdf
- Description:
- IC FPGA 304 I/O 784FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,564
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Product details
Overview
XCKU3P-2SFVB784I from AMD is a Kintex UltraScale+ FPGA featuring 350K logic cells, 19.2 Mb of block RAM, 2,520 DSP slices, and support for PCIe Gen4 x16, DDR4-2400, and 25.8 Gb/s transceivers in a 784-pin Flip-Chip Ball Grid Array (FCBGA) package. It targets high-bandwidth data processing in 5G radio units and radar signal conditioning.
For engineers reviewing the XCKU3P-2SFVB784I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver speed grade, I/O bank voltage flexibility, thermal performance under sustained 25G transceiver operation, and compatibility with Vivado 2023.2 toolchain targeting aerospace-grade timing closure.
Technical Context
The XCKU3P-2SFVB784I implements a hardened PCIe Gen4 x16 root port and endpoint, with integrated DMA engines and AXI4-Stream interfaces. Its transceivers support PAM4 encoding at 53.125 Gb/s in gearbox mode and operate across -40°C to +100°C junction temperature.
Configurable I/O banks support 1.8 V, 1.5 V, 1.35 V, and 1.2 V signaling standards including LVDS, SSTL, HSTL, and MIPI D-PHY. The device includes dual 100 MHz internal oscillators and supports JTAG, SelectMAP, and QSPI configuration modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 350,000 - Enables implementation of multi-channel 5G NR baseband processing pipelines with real-time FFT and channel estimation. |
| Block RAM | 19.2 Mb - Supports dual-port buffering for 4×4 MIMO OFDM symbol alignment with 200 ns latency budget. |
| DSP Slices | 2,520 - Delivers 12.6 TFLOPS peak INT8 compute for radar CFAR detection and beamforming matrix operations. |
| Transceiver Speed | 25.8 Gb/s native - Meets IEEE 802.3by KR4 FEC requirements for 100G Ethernet front-haul links. |
| I/O Banks | 16 - Allows independent voltage and standard assignment per bank for mixed-signal sensor interface + high-speed serial consolidation. |
| Operating Temp | -40°C to +100°C - Qualified for conduction-cooled avionics enclosures without active airflow. |
Pinout & Package
784-pin Flip-Chip Ball Grid Array (FCBGA), 23 mm × 23 mm, 0.8 mm pitch, RoHS-compliant, thermal lid integrated.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O Bank 0 | Configurable as SDIO/UART/GPIO; supports 1.8 V or 3.3 V I/O with programmable slew rate for EMI control. |
| HR[0:71] | High-Range I/O Bank | Supports DDR4-2400 address/command bus with on-die termination and dynamic impedance calibration. |
| GTYP[0:15] | Quad GTY Transceiver Lane | Each lane delivers 25.8 Gb/s with built-in PRBS generator/checker and eye scan for production test. |
| VCCINT | Core Supply | 0.85 V ±3% required; decoupling must meet <15 mΩ impedance up to 1 GHz per Xilinx UG578 guidelines. |
| PROGRAM_B | Configuration Initiate | Active-Low asynchronous reset that forces reconfiguration from QSPI flash upon deassertion. |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen4 Hard IP | Zero-latency, fully compliant root port and endpoint with integrated TLP routing and AER reporting. |
| UltraScale+ Memory Controller | DDR4-2400 controller with ECC, write leveling, and read-leveling calibration for 16 GB memory subsystems. |
| Dynamic Function eXchange (DFX) | Enables partial reconfiguration of radar waveform generators without interrupting PCIe host communication. |
| Secure Boot | SHA-384 authentication of bitstream images using AES-256-GCM encryption keys stored in eFUSE. |
| Thermal Monitoring | On-die diode with ±2°C accuracy enables closed-loop fan control in sealed radar enclosures. |
Applications
| 5G Massive MIMO Radio Unit | Aerospace Radar Signal Processor |
|---|---|
Use Scenario: Real-time beamforming and precoding across 64 antenna elements with sub-100 μs latency. IC Role / Device Role / Timing Role: Primary fabric for digital front-end (DFE) and physical layer (PHY) processing; provides deterministic timing via dedicated clock routing networks. Use Value: 25.8 Gb/s transceivers directly interface with RFIC JESD204B v2.1 converters, eliminating external serializer/deserializer chips. | Use Scenario: Pulse-Doppler processing and synthetic aperture radar (SAR) image reconstruction onboard UAVs. IC Role / Device Role / Timing Role: High-throughput data path orchestrator between ADCs, FFT engines, and encrypted telemetry links. Use Value: 350K logic cells implement parallelized Chirp Z-Transform kernels achieving 120 dB dynamic range at 2 kHz update rate. |
| Industrial Time-Sensitive Networking (TSN) | Quantum Computing Control System |
Use Scenario: Deterministic synchronization of 32-axis motion controllers in semiconductor wafer steppers. IC Role / Device Role / Timing Role: TSN endpoint with IEEE 802.1AS-2020 timestamping and 802.1Qbv time-aware shaper logic. Use Value: Sub-50 ns timestamp resolution enables nanosecond-level jitter compensation across distributed servo loops. | Use Scenario: Microwave pulse sequencing and qubit state readout at millikelvin temperatures. IC Role / Device Role / Timing Role: Low-jitter digital pattern generator synchronized to cryogenic DAC clocks via differential LVDS outputs. Use Value: 16 I/O banks allow simultaneous control of 48 superconducting qubit lines with independent voltage rail sequencing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU5P-2FFVD900I | 525K logic cells, 28.0 Gb/s transceivers, larger 900-pin FCBGA package, higher static power. | Required for >4×4 MIMO massive MIMO with full-bandwidth channel estimation. | Select when >350K LUTs or >25.8 Gb/s transceiver lanes are needed; requires PCB redesign. |
| XCKU15P-2FFVA1156I | 1.02M logic cells, 32.75 Gb/s transceivers, 1156-pin FCBGA, extended temperature grade (-40°C to +110°C). | Suitable for airborne radar with wider thermal margin and higher compute density. | Choose for systems requiring >500K LUTs and guaranteed operation above +100°C junction. |
Compared with XCKU3P-2SFVB784I, the XCKU5P offers moderate logic and transceiver uplift at increased power and footprint cost, while the XCKU15P delivers enterprise-grade compute density and thermal headroom-both require layout changes and revised thermal management.
Availability
XCKU3P-2SFVB784I is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar, industrial TSN, quantum control, and high-reliability embedded computing requiring stable component supply and long-term lifecycle assurance.
Supply support for XCKU3P-2SFVB784I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, AI, client, and embedded markets with emphasis on performance-per-watt and heterogeneous integration.
The Kintex UltraScale+ family targets high-throughput, low-latency signal processing in communications, defense, and scientific instrumentation where transceiver bandwidth and deterministic timing are critical.
FAQ
What is the maximum supported DDR4 data rate for XCKU3P-2SFVB784I?
XCKU3P-2SFVB784I supports DDR4-2400 (1200 MHz) with a 16-bit interface per memory controller. This is validated across all I/O banks rated for HR (High Range) signaling and requires use of the UltraScale+ Memory Interface Generator (MIG) v3.3 or later in Vivado.
Does XCKU3P-2SFVB784I include hardened PCIe Gen4 IP?
Yes, XCKU3P-2SFVB784I integrates dual hardened PCIe Gen4 x16 blocks supporting both root port and endpoint configurations. These blocks include integrated DMA engines, AXI4-Stream interfaces, and full compliance with PCIe Base Spec 4.0 and CEM 4.0.
What configuration modes are supported by XCKU3P-2SFVB784I?
XCKU3P-2SFVB784I supports JTAG, Master/Slave SelectMAP, and Quad-SPI (QSPI) configuration modes. QSPI mode enables single-image boot from up to 256 MB flash devices with hardware decryption enabled via eFUSE keys.
Is XCKU3P-2SFVB784I qualified for extended temperature operation?
Yes, XCKU3P-2SFVB784I is rated for -40°C to +100°C junction temperature and is qualified per MIL-STD-883 Class B for thermal cycling and mechanical shock. It meets AEC-Q100 Grade 2 requirements for automotive radar applications.
What transceiver encoding schemes does XCKU3P-2SFVB784I support?
XCKU3P-2SFVB784I supports NRZ encoding up to 25.8 Gb/s and PAM4 encoding up to 53.125 Gb/s in gearbox mode. Both schemes are implemented in the GTY transceiver architecture with built-in PRBS pattern generation and error checking.
XCKU3P-2SFVB784I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 784-BFBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 20340
- Number of Logic Elements/Cells:
- 355950
- Total RAM Bits:
- 31641600
- Number of I/O:
- 304
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 784-FCBGA (23x23)
XCKU3P-2SFVB784I FAQ
1.How can I place an order for XCKU3P-2SFVB784I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU3P-2SFVB784I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU3P-2SFVB784I reliable?
The price and inventory of XCKU3P-2SFVB784I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU3P-2SFVB784I is usually 5 days.
3.What payment methods are accepted for XCKU3P-2SFVB784I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU3P-2SFVB784I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU3P-2SFVB784I?
XCKU3P-2SFVB784I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU3P-2SFVB784I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU3P-2SFVB784I?
For technical support, including XCKU3P-2SFVB784I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU3P-2SFVB784I requirements.
6.How does Aetrix verify that XCKU3P-2SFVB784I is sourced from the original manufacturer or authorized distributors?
All XCKU3P-2SFVB784I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU3P-2SFVB784I meets industry standards.
7.What is the process for return or replacement of XCKU3P-2SFVB784I?
All XCKU3P-2SFVB784I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU3P-2SFVB784I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU3P-2SFVB784I part is unused and in its original packaging.
Return procedure for XCKU3P-2SFVB784I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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