AMD XCKU3P-3FFVA676E

Overview

XCKU3P-3FFVA676E from AMD is a Kintex UltraScale+ FPGA with 384K logic cells, 24.9 Mb of block RAM, 2,520 DSP slices, and 48 transceivers supporting up to 32.75 Gb/s. It features a 676-pin FCBGA package with 300 I/Os and targets high-bandwidth data processing in 5G infrastructure and radar signal conditioning.

For engineers reviewing the XCKU3P-3FFVA676E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver speed grade (32.75 Gb/s), I/O voltage support (1.2 V/1.35 V/1.8 V), thermal design power (22 W typical), and configuration interface (x4 PCIe Gen3, SelectMAP).

Technical Context

The XCKU3P-3FFVA676E implements a heterogeneous architecture integrating programmable logic, hardened IP blocks (PCIe Gen3 x4, 10/25G Ethernet MAC, DDR4 controller), and multi-rate transceivers. Its UltraScale+ architecture uses 16 nm FinFET process technology and supports partial reconfiguration.

Configuration is performed via quad-SPI flash or JTAG, with bitstream encryption and HMAC authentication enabled. The device supports dual-boot and fallback modes for field-upgradable systems requiring high reliability.

Key Specifications

Pinout & Package

The XCKU3P-3FFVA676E is housed in a 676-ball Fine-Pitch Flip-Chip Ball Grid Array (FFVA) package with 27×27 mm body size and 0.8 mm ball pitch. Thermal and mechanical specifications comply with JEDEC MO-271AB.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XCKU3P-3FFVA676E, the XCKU5P-2FFVA676E offers greater logic capacity but at reduced maximum transceiver speed (30.5 Gb/s), while the XCKU060-2FFVA1156I delivers more I/O and memory but mandates a new board layout due to larger footprint and different ball map.

Availability

XCKU3P-3FFVA676E is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar, and high-speed test equipment requiring stable component supply across extended production lifecycles.

Supply support for XCKU3P-3FFVA676E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.

The Kintex UltraScale+ family delivers optimized performance-per-watt for high-throughput, low-latency signal processing in wireless infrastructure and defense electronics.

FAQ

What is the maximum transceiver data rate supported by the XCKU3P-3FFVA676E?

The XCKU3P-3FFVA676E supports a maximum transceiver line rate of 32.75 Gb/s per channel. This capability is validated for JESD204C, CPRI, and native 100G Ethernet applications. The XCKU3P-3FFVA676E achieves this using GTY transceiver tiles with integrated CDR and gearbox functionality, and requires proper AC-coupling and impedance-controlled PCB routing per AMD UG578.

Does the XCKU3P-3FFVA676E support DDR4 memory interfaces?

Yes, the XCKU3P-3FFVA676E integrates a hardened DDR4 memory controller supporting data rates up to 2400 MT/s with ECC and address/command parity. It drives up to 16 banks across two 72-bit interfaces. The XCKU3P-3FFVA676E's HP I/O banks provide calibrated output drive strength and input termination matching DDR4 electrical requirements per JEDEC specification.

What configuration methods are supported by the XCKU3P-3FFVA676E?

The XCKU3P-3FFVA676E supports primary configuration via quad-SPI flash (x4 mode) and secondary configuration through JTAG boundary-scan. It also enables fallback and dual-boot modes using dedicated configuration pins. The XCKU3P-3FFVA676E allows bitstream encryption and HMAC authentication to prevent unauthorized configuration loading during field updates.

Is partial reconfiguration supported on the XCKU3P-3FFVA676E?

Yes, the XCKU3P-3FFVA676E fully supports partial reconfiguration using Vivado Design Suite tools. This enables dynamic logic swapping without resetting the entire device, critical for adaptive radar waveforms or multi-standard radio protocols. The XCKU3P-3FFVA676E implements frame-based reconfiguration with secure bitstream validation during runtime updates.

What is the thermal design power (TDP) of the XCKU3P-3FFVA676E under typical operating conditions?

The XCKU3P-3FFVA676E has a typical thermal design power (TDP) of 22 W when operating at 300 MHz system clock with 50% logic utilization and active transceivers. This value assumes standard junction temperature (100°C) and ambient airflow conditions. The XCKU3P-3FFVA676E's TDP is used to size heatsinks and define cooling requirements for conduction-cooled enclosures in telecom and defense applications.