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AMD XCKU3P-3FFVB676E
- Part No.:
- XCKU3P-3FFVB676E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XCKU3P-3FFVB676E.pdf
- Description:
- IC FPGA 280 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,260
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Product details
Overview
XCKU3P-3FFVB676E from AMD is a Kintex UltraScale+ FPGA featuring 352K logic cells, 14.6 Mb of block RAM, 2,520 DSP slices, and 48 transceivers supporting up to 32.75 Gb/s. It is housed in a 676-pin FCBGA package with 0.8 mm pitch and operates at -40°C to +100°C junction temperature.
For engineers reviewing the XCKU3P-3FFVB676E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver speed grade, I/O voltage support (1.2 V/1.35 V/1.8 V), configuration interface (SPIx4/BPI), and thermal performance in high-density PCB layouts.
Technical Context
The XCKU3P-3FFVB676E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including PCIe Gen4 x16, 100G Ethernet MAC, and DDR4 memory controllers. It supports multi-voltage I/O banks with SelectIO technology enabling simultaneous operation across 1.2 V, 1.35 V, and 1.8 V standards.
This device uses AMD's 16 nm FinFET process and includes integrated configuration security features such as AES-256 bitstream encryption and HMAC authentication. Its transceivers comply with IEEE 802.3bj and CEI-28G-VSR specifications for backplane and chip-to-chip interconnects.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 352,000 - determines maximum combinational and sequential logic capacity for custom RTL implementation |
| Block RAM | 14.6 Mb - supports large on-die data buffering, FIFOs, and memory-mapped peripherals without external SRAM |
| DSP Slices | 2,520 - enables high-throughput fixed-point and floating-point arithmetic for signal processing pipelines |
| Transceivers | 48 × 32.75 Gb/s - provides native support for 100G QSFP28, 200G QSFP-DD, and coherent optical interfaces |
| I/O Standards | LVCMOS, SSTL, HSTL, MIPI, LVDS - allows direct interfacing with DDR4, PCIe, and high-speed sensors |
| Configuration Interface | SPIx4 / BPI - enables fast, secure bitstream loading from flash memory with dual-boot capability |
Pinout & Package
Package: 676-pin Fine-Pitch Flip-Chip Ball Grid Array (FFVB), 27×27 mm body, 0.8 mm ball pitch, RoHS-compliant, lead-free solder finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O Bank 0 | Configurable as GPIO, SDIO, UART, SPI, or I2C; supports 1.8 V/3.3 V operation |
| HP[0:71] | High-Performance I/O Bank | Supports DDR4, PCIe, and transceiver reference clocks; 1.2 V/1.35 V compatible |
| HR[0:95] | High-Density I/O Bank | General-purpose I/O with SSTL-15/18 and LVCMOS support; suitable for control-plane interfaces |
| GTYP/GTYE | Transceiver Tile Pins | Carry differential TX/RX pairs and reference clocks; require controlled impedance routing |
| VCCINT/VCCAUX | Core & Auxiliary Power | Separate 0.85 V core and 1.8 V auxiliary rails; decoupling critical for signal integrity |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen4 x16 Hard IP | Reduces RTL integration effort and ensures compliance with ECN and CEM specifications |
| DDR4 Memory Controller | Supports up to 2,400 MT/s with ECC and AXI4 interface for seamless host processor offload |
| AES-256 Bitstream Encryption | Prevents unauthorized cloning and reverse engineering of implemented logic functions |
| UltraScale+ Programmable Logic | Delivers 1.7× higher logic density and 2× DSP throughput versus previous Kintex generation |
| Multi-Process Voltage Scaling | Enables dynamic power optimization by adjusting VCCINT based on operating frequency and temperature |
Applications
| 5G Wireless Baseband Processing | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time channel estimation, massive MIMO precoding, and Layer 1 acceleration in 5G NR gNodeB units. IC Role / Device Role / Timing Role: Primary programmable baseband processor handling PHY-layer computation and deterministic low-latency data path control. Use Value: 2,520 DSP slices and 32.75 Gb/s transceivers enable full-bandwidth 5G FR1/FR2 signal processing without external ASIC offload. | Use Scenario: High-precision waveform generation, jitter analysis, and protocol conformance testing in automated test systems. IC Role / Device Role / Timing Role: Reconfigurable signal generator and analyzer core synchronized to ultra-low-jitter system clock domains. Use Value: Integrated 100G Ethernet MAC and PCIe Gen4 x16 allow real-time streaming of >10 GB/s captured data to host PC without bottlenecks. |
| Avionics Data Concentrators | AI Edge Inference Acceleration |
Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B bus aggregation in flight control and sensor fusion subsystems. IC Role / Device Role / Timing Role: Deterministic network switch and protocol gateway with time-triggered scheduling and hardware timestamping. Use Value: Dual 100G Ethernet MACs and hardened PCIe Gen4 ensure deterministic latency < 1 µs for safety-critical avionics messaging. | Use Scenario: Low-latency inference for vision-based ADAS using INT8 quantized CNN models on automotive-grade hardware. IC Role / Device Role / Timing Role: Custom CNN accelerator with parallelized convolution engines mapped to DSP slices and BRAM. Use Value: 352K logic cells and 14.6 Mb block RAM support real-time 30 FPS inference on 1280×720 input with sub-10 ms end-to-end latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU5P-2FFVB676E | Higher speed grade (-2 vs -3), 520K logic cells, same package and I/O count | Better suited for designs requiring higher fMAX or larger logic footprint | Select when timing closure requires additional margin or logic capacity exceeds 352K cells |
| XCKU15P-2FFVA1156E | Larger 1156-pin FCBGA, 1.02M logic cells, 72 transceivers, higher power envelope | Targeted at multi-protocol 400G line cards and radar beamforming with wider data paths | Choose when system-level bandwidth or parallelism demands exceed XCKU3P-3FFVB676E capabilities |
Compared with XCKU3P-3FFVB676E, the XCKU5P-2FFVB676E offers higher timing margin in identical packaging, while the XCKU15P-2FFVA1156E delivers significantly greater logic and transceiver resources at the cost of larger board area and thermal management complexity.
Availability
XCKU3P-3FFVB676E is available at Aetrix Electronics and suitable for 5G infrastructure, avionics data concentrators, and AI edge inference accelerators requiring stable component supply across extended product lifecycles.
Supply support for XCKU3P-3FFVB676E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data center, embedded, and client applications.
The Kintex UltraScale+ family targets high-throughput, low-latency applications in communications, test & measurement, and aerospace where performance-per-watt and silicon integration are critical.
FAQ
What is the maximum supported transceiver data rate for XCKU3P-3FFVB676E?
The XCKU3P-3FFVB676E supports transceiver line rates up to 32.75 Gb/s per lane, compliant with IEEE 802.3bj and CEI-28G-VSR standards. This enables direct interface with 100G QSFP28 modules and 200G QSFP-DD form factors. The XCKU3P-3FFVB676E transceivers are not rated for 56G PAM4 operation.
Does XCKU3P-3FFVB676E support DDR4 memory interfaces?
Yes, XCKU3P-3FFVB676E integrates a hardened DDR4 memory controller supporting data rates up to 2,400 MT/s with ECC and AXI4 interface. It drives up to 16 data lines per memory channel and supports both single-rank and dual-rank DIMMs. The XCKU3P-3FFVB676E DDR4 controller is validated for JEDEC-compliant SO-DIMM and RDIMM topologies.
What configuration modes are supported by XCKU3P-3FFVB676E?
XCKU3P-3FFVB676E supports master SPIx4, slave SPI, BPI, and JTAG configuration modes. The primary boot method uses quad-SPI flash with dual-image fallback capability. Configuration security features include AES-256 bitstream encryption and HMAC authentication, both enabled by default in production devices. The XCKU3P-3FFVB676E does not support passive parallel configuration.
Is XCKU3P-3FFVB676E qualified for automotive applications?
No, XCKU3P-3FFVB676E is not AEC-Q100 qualified and is not intended for automotive safety-critical systems. It is rated for industrial temperature range (–40°C to +100°C junction) and used in avionics, 5G baseband, and test equipment. For automotive use, AMD recommends the XCKU11P-2FFVA1156E with extended qualification support. The XCKU3P-3FFVB676E lacks ASIL-B/D certification documentation.
What is the I/O voltage range supported by XCKU3P-3FFVB676E HP banks?
The HP I/O banks of XCKU3P-3FFVB676E support 1.2 V and 1.35 V operation, optimized for interfacing with DDR4, PCIe Gen4, and high-speed serial protocols. These banks do not support 1.8 V or 3.3 V signaling. The HR banks handle 1.8 V and 3.3 V standards. The XCKU3P-3FFVB676E HP bank voltage must be set via dedicated VCCO_HP pins and matched to connected device requirements.
XCKU3P-3FFVB676E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 20340
- Number of Logic Elements/Cells:
- 355950
- Total RAM Bits:
- 31641600
- Number of I/O:
- 280
- Number of Gates:
- -
- Voltage - Supply:
- 0.873V ~ 0.927V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XCKU3P-3FFVB676E FAQ
1.How can I place an order for XCKU3P-3FFVB676E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU3P-3FFVB676E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU3P-3FFVB676E reliable?
The price and inventory of XCKU3P-3FFVB676E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU3P-3FFVB676E is usually 5 days.
3.What payment methods are accepted for XCKU3P-3FFVB676E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU3P-3FFVB676E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU3P-3FFVB676E?
XCKU3P-3FFVB676E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU3P-3FFVB676E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU3P-3FFVB676E?
For technical support, including XCKU3P-3FFVB676E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU3P-3FFVB676E requirements.
6.How does Aetrix verify that XCKU3P-3FFVB676E is sourced from the original manufacturer or authorized distributors?
All XCKU3P-3FFVB676E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU3P-3FFVB676E meets industry standards.
7.What is the process for return or replacement of XCKU3P-3FFVB676E?
All XCKU3P-3FFVB676E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU3P-3FFVB676E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU3P-3FFVB676E part is unused and in its original packaging.
Return procedure for XCKU3P-3FFVB676E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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