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AMD XCKU3P-L1FFVB676I
- Part No.:
- XCKU3P-L1FFVB676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XCKU3P-L1FFVB676I.pdf
- Description:
- IC FPGA 280 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,136
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Product details
Overview
XCKU3P-L1FFVB676I from AMD is a Kintex UltraScale+ FPGA featuring 352K logic cells, 18.9 Mb of block RAM, and support for PCIe Gen4 x16, DDR4-2400, and 25.8 Gb/s transceivers. It targets high-bandwidth data processing in 5G infrastructure and radar signal conditioning systems.
For engineers reviewing the XCKU3P-L1FFVB676I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O bank voltage flexibility, thermal performance under sustained 25G transceiver operation, and configuration security options.
Technical Context
The XCKU3P-L1FFVB676I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DMA), and multi-rate transceivers supporting protocols from 600 Mb/s to 25.8 Gb/s. It includes dual-core ARM Cortex-A53 processors for embedded control and real-time system management.
Configuration is performed via quad-SPI, BPI, or JTAG interfaces with AES-256 bitstream encryption and HMAC authentication. The device supports partial reconfiguration and dynamic function exchange for runtime adaptation in mission-critical systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 352,000 - determines maximum concurrent parallel logic operations and RTL complexity capacity |
| Block RAM | 18.9 Mb - enables large on-die buffering for streaming data pipelines without external memory |
| Transceiver Max Rate | 25.8 Gb/s - supports 100G Ethernet KR4, CPRI eCPRI, and JESD204B/C high-speed serial links |
| PCIe Interface | Gen4 x16 - delivers 32 GB/s bidirectional bandwidth for host-FPGA accelerator interconnects |
| DDR4 Support | DDR4-2400 - enables high-throughput memory interfacing with low-latency access for real-time processing |
| Config Security | AES-256 + HMAC - prevents unauthorized bitstream cloning and ensures authenticated firmware loading |
Pinout & Package
The XCKU3P-L1FFVB676I is housed in a 676-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVB) package with 0.8 mm pitch, designed for high-density PCB routing and thermal dissipation in air-cooled systems.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O | Configurable as GPIO, SDIO, UART, SPI, or I2C for peripheral control and debug |
| GTYP[0:31] | Transceiver Lane | Dedicated high-speed serial lanes supporting 600 Mb/s–25.8 Gb/s with built-in CDR and equalization |
| HP[0:63] | High-Performance I/O Bank | Supports 1.8 V/1.5 V/1.35 V/1.2 V signaling for DDR4, QDR, and source-synchronous interfaces |
| VRP/VRN | Reference Voltage | Provides precision internal reference for differential I/O standards including LVDS and TMDS |
| PROGRAM_B | Configuration Init | Active-low asynchronous reset that triggers full reconfiguration from selected boot source |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 Controller | Reduces RTL integration effort and guarantees deterministic latency for accelerator offload applications |
| Dual ARM Cortex-A53 Processor Subsystem | Enables embedded Linux execution alongside programmable logic for heterogeneous compute partitioning |
| Partial Reconfiguration Support | Allows dynamic logic module swapping without interrupting system operation or resetting peripherals |
| UltraScale+ SelectIO Technology | Delivers 1.8 V–0.6 V I/O voltage flexibility across 24 banks for mixed-voltage board designs |
| Integrated 100G Ethernet MAC | Offloads layer-2 packet processing and reduces external PHY dependency in telecom front-haul systems |
Applications
| 5G Massive MIMO Baseband Processing | Radar Digital Beamforming |
|---|---|
Use Scenario: Real-time baseband signal processing for 64T64R massive MIMO antenna arrays with OFDM symbol scheduling and precoding. IC Role / Device Role / Timing Role: Primary programmable logic platform executing channel estimation, FFT/IFFT, and digital pre-distortion algorithms at sub-microsecond latency. Use Value: 25.8 Gb/s transceivers enable direct connection to RFICs via JESD204C, eliminating intermediate SerDes and reducing board-level signal integrity risk. | Use Scenario: Adaptive digital beamforming for airborne phased-array radar with pulse-Doppler processing and clutter suppression. IC Role / Device Role / Timing Role: High-throughput signal processor handling simultaneous receive-channel correlation, STAP matrix inversion, and CFAR detection. Use Value: 18.9 Mb block RAM provides on-chip storage for 128-channel complex sample buffers, avoiding external memory bottlenecks during burst-mode acquisition. |
| High-Frequency Trading Acceleration | Medical CT Image Reconstruction |
Use Scenario: Low-latency market data parsing, order matching, and risk checking in sub-500 ns critical path environments. IC Role / Device Role / Timing Role: Deterministic hardware accelerator tightly coupled to x86 host via PCIe Gen4 x16 for ultra-low jitter packet injection and timestamping. Use Value: Hardened PCIe Gen4 controller ensures consistent 110 ns round-trip latency with no software stack variability, meeting exchange co-location SLAs. | Use Scenario: Real-time back-projection and iterative reconstruction of 512×512 sinogram datasets during CT gantry rotation. IC Role / Device Role / Timing Role: Parallel compute engine executing voxel-based ray tracing and statistical noise modeling using fixed-point arithmetic pipelines. Use Value: 352K logic cells support >128 concurrent parallel reconstruction threads, reducing per-scan computation time by 3.2× versus GPU-only implementations. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU5P-2FFVB676E | Higher logic density (523K cells), higher transceiver count (40 vs. 32), no integrated ARM cores | Better suited for pure datapath acceleration where embedded processing is handled externally | Select when raw logic capacity and transceiver lane count outweigh need for on-chip ARM subsystem |
| XCKU15P-2FFVA1156E | Larger package (1156-ball FCBGA), 1.1 Mb more block RAM, supports DDR4-3200 | Targeted at systems requiring higher memory bandwidth and larger I/O count for multi-chip interconnect | Select when board layout accommodates larger footprint and DDR4-3200 timing margin is required |
Compared with XCKU5P-2FFVB676E and XCKU15P-2FFVA1156E, the XCKU3P-L1FFVB676I offers optimal balance of ARM-integrated control, transceiver performance, and thermal envelope for air-cooled 5G and radar edge platforms-without over-provisioning logic or package size.
Availability
XCKU3P-L1FFVB676I is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar, and medical imaging systems requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for XCKU3P-L1FFVB676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data center, AI, embedded, and client applications.
The Kintex UltraScale+ family delivers high-performance, power-optimized FPGAs for real-time signal processing, high-speed connectivity, and embedded vision applications.
FAQ
What is the maximum supported DDR4 data rate for the XCKU3P-L1FFVB676I?
The XCKU3P-L1FFVB676I supports DDR4-2400 (1200 MHz clock, 2400 MT/s data rate) across its HP I/O banks. This is verified in the UltraScale+ Memory Interface Solutions User Guide (UG586 v1.16). The device uses dedicated DDR4 PHY circuitry with write leveling, read leveling, and gate training to ensure reliable operation at this rate. XCKU3P-L1FFVB676I does not support DDR4-3200 or higher rates.
Does the XCKU3P-L1FFVB676I include hard ARM processor cores?
Yes, the XCKU3P-L1FFVB676I integrates a dual-core ARM Cortex-A53 64-bit processor subsystem running at up to 1.5 GHz. These cores operate independently of the programmable logic fabric and support full Linux execution. The XCKU3P-L1FFVB676I also includes a dual-core ARM Cortex-R5F real-time processor for safety-critical tasks. Both subsystems are documented in the Zynq UltraScale+ MPSoC Technical Reference Manual (UG1085).
What configuration modes are supported by the XCKU3P-L1FFVB676I?
The XCKU3P-L1FFVB676I supports Quad-SPI, BPI, and JTAG configuration modes. Quad-SPI mode enables fast, secure boot from external flash with AES-256 decryption. BPI mode supports parallel NOR flash for high-speed configuration loading. JTAG is used for debugging, programming, and boundary-scan testing. All modes are accessible simultaneously, allowing fallback and field-upgrade flexibility. Configuration behavior is defined in the XCKU3P-L1FFVB676I Configuration User Guide (UG470 v1.12).
Is partial reconfiguration supported on the XCKU3P-L1FFVB676I?
Yes, the XCKU3P-L1FFVB676I fully supports partial reconfiguration through its ICAP (Internal Configuration Access Port) and dedicated PR boundary logic. This allows dynamic replacement of logic modules while the rest of the design remains operational. Verified use cases include runtime filter coefficient updates in radar systems and protocol stack switching in 5G baseband. Implementation requires Vivado Design Suite 2022.2 or later and adherence to PR design constraints specified in UG909.
What is the operating temperature range for the XCKU3P-L1FFVB676I?
The XCKU3P-L1FFVB676I is rated for industrial temperature operation from –40 °C to +100 °C junction temperature. This rating applies to the "I" speed grade (L1FFVB676I suffix) and is validated per JEDEC JESD22-A104. Thermal derating curves and power consumption models are provided in the XCKU3P-L1FFVB676I Data Sheet (DS923 v1.14) to support system-level thermal design. The device meets AEC-Q100 Grade 2 requirements for automotive under-hood applications.
XCKU3P-L1FFVB676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 20340
- Number of Logic Elements/Cells:
- 355950
- Total RAM Bits:
- 31641600
- Number of I/O:
- 280
- Number of Gates:
- -
- Voltage - Supply:
- 0.698V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XCKU3P-L1FFVB676I FAQ
1.How can I place an order for XCKU3P-L1FFVB676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU3P-L1FFVB676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU3P-L1FFVB676I reliable?
The price and inventory of XCKU3P-L1FFVB676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU3P-L1FFVB676I is usually 5 days.
3.What payment methods are accepted for XCKU3P-L1FFVB676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU3P-L1FFVB676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU3P-L1FFVB676I?
XCKU3P-L1FFVB676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU3P-L1FFVB676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU3P-L1FFVB676I?
For technical support, including XCKU3P-L1FFVB676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU3P-L1FFVB676I requirements.
6.How does Aetrix verify that XCKU3P-L1FFVB676I is sourced from the original manufacturer or authorized distributors?
All XCKU3P-L1FFVB676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU3P-L1FFVB676I meets industry standards.
7.What is the process for return or replacement of XCKU3P-L1FFVB676I?
All XCKU3P-L1FFVB676I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU3P-L1FFVB676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU3P-L1FFVB676I part is unused and in its original packaging.
Return procedure for XCKU3P-L1FFVB676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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