AMD XCKU3P-L1FFVD900I

Overview

XCKU3P-L1FFVD900I from AMD is a Kintex UltraScale+ FPGA featuring 352K logic cells, 14.6 Mb of block RAM, 2,520 DSP slices, and 48 transceivers supporting up to 32.75 Gb/s. It is housed in a 900-pin flip-chip fine-pitch BGA (FFVD) package with -1 speed grade and industrial temperature range (-40°C to +100°C), deployed in high-bandwidth data acquisition systems.

For engineers reviewing the XCKU3P-L1FFVD900I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, I/O bank voltage support (1.2 V/1.35 V/1.8 V), configuration interface options (JTAG, SelectMAP, SPI), and thermal performance under sustained 28 W typical power dissipation.

Technical Context

The XCKU3P-L1FFVD900I implements a heterogeneous architecture integrating programmable logic, hardened IP blocks (PCIe Gen3 x16, 100G Ethernet MAC, DDR4 PHY), and multi-rate transceivers with PMA/PMD layers. It supports partial reconfiguration and AXI4-Stream interfaces for real-time data path adaptation.

Configuration occurs via dual-boot QSPI flash or JTAG, with bitstream encryption using AES-256 and HMAC authentication. Power management includes dynamic voltage and frequency scaling (DVFS) across multiple rail domains (VCCINT, VCCAUX, VCCO, VRP).

Key Specifications

Pinout & Package

Package: 900-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVD), 31 mm × 31 mm, 0.8 mm pitch, RoHS-compliant, thermal lid integrated.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XCKU5P-L1FFVD900I and XCKU060-L1FFVA1156I, the XCKU3P-L1FFVD900I offers optimal balance of transceiver count, hardened IP, and power efficiency for space-constrained 100G edge systems-without requiring PCB redesign or thermal overprovisioning.

Availability

XCKU3P-L1FFVD900I is available at Aetrix Electronics and suitable for radar signal processing, 5G radio units, and high-throughput test equipment requiring stable component supply across extended product lifecycles.

Supply support for XCKU3P-L1FFVD900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.

The Kintex UltraScale+ family targets high-bandwidth, low-latency applications demanding hardened connectivity IP, scalable logic, and industrial-grade reliability-optimized for 5G infrastructure, aerospace avionics, and real-time instrumentation.

FAQ

What is the maximum supported transceiver data rate for XCKU3P-L1FFVD900I?

The XCKU3P-L1FFVD900I supports transceiver line rates up to 32.75 Gb/s in PAM4 mode and 16.375 Gb/s in NRZ mode. This capability enables direct interface with 400G-FR4 optical modules and JESD204C ADC/DACs. The actual achievable rate depends on PCB stackup, reference clock stability, and equalization settings configured in Vivado.

Does XCKU3P-L1FFVD900I include a hardened PCIe controller?

Yes, the XCKU3P-L1FFVD900I integrates a hardened PCIe Gen3 x16 endpoint/root port controller compliant with PCI Express Base Specification Revision 3.1. It supports Advanced Error Reporting (AER), Message Signaled Interrupts (MSI-X), and hot-plug detection-reducing design time versus soft-core implementations. Configuration space is accessible via AXI4-Lite.

What I/O standards are supported by the HR banks in XCKU3P-L1FFVD900I?

The HR (High-Range) I/O banks in XCKU3P-L1FFVD900I support 1.2 V, 1.35 V, and 1.8 V operation with programmable output drive strength and input termination. They are qualified for DDR4 SDRAM interfaces (1.2 V), LPDDR4 (1.1 V with margin), and MIPI D-PHY (1.2 V). Each HR bank has dedicated VCCO and VREF pins.

Is bitstream encryption available on XCKU3P-L1FFVD900I?

Yes, XCKU3P-L1FFVD900I supports AES-256 encryption with HMAC-SHA256 authentication for bitstream confidentiality and integrity. Keys are stored in battery-backed SRAM or eFUSE, and decryption occurs in hardware during configuration. This feature prevents reverse engineering and unauthorized duplication of the programmed logic design.

What is the thermal design power (TDP) of XCKU3P-L1FFVD900I under typical operation?

The XCKU3P-L1FFVD900I has a typical power consumption of 28 W and a maximum junction temperature of 100°C under industrial temperature grade operation. Thermal solution design must maintain case temperature ≤ 85°C with ≤ 1.5°C/W total thermal resistance (junction-to-ambient). AMD's XPE tool provides accurate power estimates based on user-defined resource utilization.