My Inquiry
My Account
AMD XCKU3P-L1SFVB784I
- Part No.:
- XCKU3P-L1SFVB784I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 784-BFBGA, FCBGA
- Datasheet:
-
XCKU3P-L1SFVB784I.pdf
- Description:
- IC FPGA 256 I/O 784FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,596
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XCKU3P-L1SFVB784I from AMD is a Kintex UltraScale+ FPGA featuring 352K logic cells, 19.2 Mb of block RAM, and 2,520 DSP slices; supports PCIe Gen4 x16, 32 GTY transceivers (up to 32.75 Gbps), and operates at -40°C to +100°C junction temperature for high-reliability industrial applications.
For engineers reviewing the XCKU3P-L1SFVB784I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver count and speed, logic density, thermal grade, and package I/O count for high-speed serial interface consolidation and adaptive compute acceleration.
Technical Context
The XCKU3P-L1SFVB784I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including PCIe Gen4 root port/endpoint, 100G Ethernet MAC, and DDR4 memory controllers. It integrates dual ARM Cortex-A53 processors in the Zynq UltraScale+ MPSoC variant-but this part is FPGA-only, excluding processing subsystem.
It uses 16nm FinFET process technology, supports JTAG and SelectMAP configuration modes, and features System Monitor for on-chip voltage/temperature sensing. Configuration is performed via Quad-SPI flash or BPI parallel NOR flash, with bitstream encryption and HMAC authentication enabled.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 352,000 - determines maximum combinational and sequential logic capacity for custom RTL implementation |
| Block RAM | 19.2 Mb - supports large on-die data buffering, FIFOs, and lookup tables without external memory |
| DSP Slices | 2,520 - enables high-throughput fixed/floating-point computation for signal processing and AI inference |
| GTY Transceivers | 32 × up to 32.75 Gbps - provides native support for 100G Ethernet, CPRI/eCPRI, and high-speed serial backplanes |
| PCIe Interface | Gen4 x16 - delivers 32 GB/s bidirectional bandwidth for host CPU/FPGA co-processing architectures |
| Operating Temp | -40°C to +100°C - qualified for extended-temperature industrial and aerospace environments |
| I/O Pins | 468 user-configurable - supports multi-standard signaling (LVDS, SSTL, HSTL) with programmable drive strength and termination |
Pinout & Package
Package: FCBGA-784 (23 mm × 23 mm, 1.0 mm pitch, 0.8 mm ball diameter). RoHS-compliant, lead-free, and moisture-sensitive level 3 (MSL3).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O | Configurable as GPIO, SDIO, UART, SPI, I2C, or CAN interfaces; shared with PS in MPSoC variants but unused here |
| HR Bank 0–3 | High-Range I/O | Supports 1.8V/2.5V/3.3V standards; includes dedicated differential termination and slew rate control |
| HP Bank 4–13 | High-Performance I/O | Supports 1.2V/1.35V/1.8V; optimized for DDR4, LPDDR4, and high-speed SerDes reference clocks |
| GTY_RXn/GTY_TXn | Transceiver Lane | Each pair routes full-duplex 32.75 Gbps serial data; requires matched-length PCB routing and AC coupling |
| VCCINT/VCCAUX/VCCO | Power Rails | Separate domains for core (0.85V), auxiliary (1.8V), and I/O (1.2–3.3V configurable) supply regulation |
Key Features
| Feature | Design Value |
|---|---|
| UltraScale+ Architecture | Enables time-multiplexed logic (SRL, LUTRAM) and hierarchical clocking for deterministic timing closure |
| Hardened PCIe Gen4 Block | Reduces RTL integration effort and verification overhead for host interface design |
| Integrated System Monitor | Provides real-time die temperature and supply voltage telemetry without external sensors |
| Bitstream Encryption & HMAC | Protects intellectual property against cloning and unauthorized reprogramming in deployed systems |
| Multi-Voltage I/O Banks | Allows direct interfacing with legacy and next-gen peripherals without level-shifter components |
Applications
| Radar Signal Processing | 5G Massive MIMO Radio Units |
|---|---|
Use Scenario: Real-time beamforming and digital down-conversion in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes adaptive filtering and FFT-based processing; GTY transceivers interface with ADC/DAC converters at 2.4–6 GHz IF bands. Use Value: 32 GTY lanes enable simultaneous multi-channel high-speed data ingestion; 2,520 DSP slices sustain >100 GOPS for pulse compression and CFAR detection. | Use Scenario: Baseband processing and fronthaul transport in active antenna systems with 64+ antenna elements. IC Role / Device Role / Timing Role: Implements eCPRI protocol stack, channel coding (LDPC/Polar), and dynamic resource allocation logic. Use Value: PCIe Gen4 x16 connects to host server for centralized control; 19.2 Mb block RAM buffers bursty IQ samples across multiple RF chains. |
| Industrial Machine Vision | High-Performance Computing Acceleration |
Use Scenario: Sub-millisecond image preprocessing and defect classification on factory-floor inspection lines. IC Role / Device Role / Timing Role: Configurable logic ingests 12-bit 120 fps camera streams via MIPI CSI-2 or SLVS-EC; runs CNN inference kernels in DSP-rich fabric. Use Value: HR I/O banks directly interface with CMOS image sensors; 352K logic cells accommodate multi-stage pipeline with pixel-level arithmetic and memory mapping. | Use Scenario: Offloading latency-sensitive compute kernels (e.g., financial risk modeling, genomics alignment) from CPU clusters. IC Role / Device Role / Timing Role: Acts as reconfigurable accelerator with DDR4 memory controller and PCIe Gen4 host link. Use Value: 468 user I/O pins support dual DDR4-2400 interfaces (up to 32 GB/s memory bandwidth); hardened transceivers feed data from NVMe storage arrays. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU5P-L1SFVB784I | Higher logic density (525K cells), more DSP slices (3,360), same package and transceiver count | Better suited for larger algorithmic workloads requiring deeper pipelines or wider vector operations | Select when design exceeds XCKU3P resource utilization by >20% and additional DSP or RAM is required |
| XCKU060-L1FFVA1156I | Larger FCBGA-1156 package, 634K logic cells, 4,720 DSP slices, 64 GTY transceivers | Targeted at multi-protocol aggregation (100G + 400G Ethernet, CXL, Gen5 PCIe) with higher I/O count and thermal margin | Choose when system demands >468 I/Os, >32 GTY lanes, or board layout accommodates 35 mm × 35 mm footprint |
Compared with XCKU5P-L1SFVB784I and XCKU060-L1FFVA1156I, the XCKU3P-L1SFVB784I offers optimal balance of transceiver bandwidth, logic resources, and thermal envelope in the 784-ball form factor-making it ideal for space-constrained, high-throughput edge compute platforms where cost and power efficiency are prioritized over raw scalability.
Availability
XCKU3P-L1SFVB784I is available at Aetrix Electronics and suitable for radar signal processing, 5G radio units, and industrial machine vision applications requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for XCKU3P-L1SFVB784I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions, delivering CPUs, GPUs, FPGAs, and adaptive SoCs for data center, embedded, and client markets.
The Kintex UltraScale+ family targets high-bandwidth, low-latency applications such as wireless infrastructure, test & measurement, and aerospace systems-designed to deliver scalable logic, memory, and serial connectivity without compromising power efficiency.
FAQ
What is the maximum data rate supported by the GTY transceivers on the XCKU3P-L1SFVB784I?
The XCKU3P-L1SFVB784I features 32 GTY transceivers each capable of up to 32.75 Gbps line rate. This enables native support for protocols including 100G Ethernet (4×25G), CPRI Option 10, and PCIe Gen4. The actual achievable rate depends on PCB interconnect quality, reference clock stability, and receiver equalization settings configured in Vivado.
Does the XCKU3P-L1SFVB784I include a hard processor system (PS)?
No, the XCKU3P-L1SFVB784I is an FPGA-only device and does not integrate a hard ARM processor subsystem. Unlike Zynq UltraScale+ MPSoC variants, this part contains only programmable logic fabric, DSP slices, block RAM, and hardened I/O/transceiver blocks-making it suitable for pure hardware acceleration tasks without software-managed cores.
What configuration modes are supported by the XCKU3P-L1SFVB784I?
The XCKU3P-L1SFVB784I supports multiple configuration modes including Master/Slave SelectMAP, Serial/QSPI, and JTAG. Configuration can be loaded from external flash devices (Quad-SPI or BPI NOR) or through boundary-scan programming. Bitstream encryption and HMAC authentication are enabled to secure configuration data during boot and runtime.
Is the XCKU3P-L1SFVB784I pin-compatible with other Kintex UltraScale+ devices in the same package?
No, the XCKU3P-L1SFVB784I is not pin-compatible with other Kintex UltraScale+ FPGAs-even those in the same FCBGA-784 package-due to differences in I/O bank assignment, power rail distribution, and transceiver placement. Each device requires its own validated PCB layout and power delivery network per AMD's package-specific pinout documentation.
What is the operating temperature grade of the XCKU3P-L1SFVB784I?
The XCKU3P-L1SFVB784I is rated for industrial temperature operation from –40°C to +100°C junction temperature (denoted by the "I" suffix). This qualification ensures reliable functionality in harsh environments such as outdoor 5G base stations, avionics subsystems, and factory automation equipment without derating.
XCKU3P-L1SFVB784I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 784-BFBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 20340
- Number of Logic Elements/Cells:
- 355950
- Total RAM Bits:
- 31641600
- Number of I/O:
- 256
- Number of Gates:
- -
- Voltage - Supply:
- 0.698V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 784-FCBGA (23x23)
XCKU3P-L1SFVB784I FAQ
1.How can I place an order for XCKU3P-L1SFVB784I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU3P-L1SFVB784I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU3P-L1SFVB784I reliable?
The price and inventory of XCKU3P-L1SFVB784I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU3P-L1SFVB784I is usually 5 days.
3.What payment methods are accepted for XCKU3P-L1SFVB784I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU3P-L1SFVB784I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU3P-L1SFVB784I?
XCKU3P-L1SFVB784I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU3P-L1SFVB784I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU3P-L1SFVB784I?
For technical support, including XCKU3P-L1SFVB784I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU3P-L1SFVB784I requirements.
6.How does Aetrix verify that XCKU3P-L1SFVB784I is sourced from the original manufacturer or authorized distributors?
All XCKU3P-L1SFVB784I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU3P-L1SFVB784I meets industry standards.
7.What is the process for return or replacement of XCKU3P-L1SFVB784I?
All XCKU3P-L1SFVB784I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU3P-L1SFVB784I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU3P-L1SFVB784I part is unused and in its original packaging.
Return procedure for XCKU3P-L1SFVB784I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCKU3P-L1SFVB784I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
