AMD XCKU3P-L2FFVB676E

Overview

XCKU3P-L2FFVB676E from AMD is a Kintex UltraScale+ FPGA featuring 352K logic cells, 14.4 GT/s transceivers, and integrated 100G Ethernet MAC blocks; it targets high-bandwidth data processing in 5G radio units and packet inspection systems.

For engineers reviewing the XCKU3P-L2FFVB676E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count, programmable logic density, embedded memory resources, and PCIe Gen4/100G Ethernet integration for telecom infrastructure design.

Technical Context

The XCKU3P-L2FFVB676E implements a heterogeneous architecture with programmable logic fabric, hardened 100G Ethernet MACs, and multi-protocol transceivers supporting 100G KR4, 25G KR/KR2, and PCIe Gen4 x16. It includes dual ARM Cortex-R5F processors for real-time control and configuration management.

It supports DDR4 memory interfaces up to 2400 MT/s across 4 banks, features 1280 DSP slices for high-throughput signal processing, and integrates hardened AES-256 encryption engines for secure bitstream loading and runtime authentication.

Key Specifications

Pinout & Package

Package: 676-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVB) with 0.8 mm pitch, thermal lid, and I/O bank grouping optimized for high-speed SerDes and memory interface routing.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XCKU5P-L2FFVB676E and XCKU060-L2FFVA1156E, the XCKU3P-L2FFVB676E offers optimal balance of 100G Ethernet integration, logic density, and power efficiency for compact 5G RU and packet broker designs where hardened MAC and PCIe Gen4 are critical but maximum scalability is not required.

Availability

XCKU3P-L2FFVB676E is available at Aetrix Electronics and suitable for 5G infrastructure, network security appliances, and high-speed test equipment requiring stable component supply and long-term lifecycle support.

Supply support for XCKU3P-L2FFVB676E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance computing, adaptive SoCs, and AI acceleration technologies.

The Kintex UltraScale+ family delivers cost-optimized, high-bandwidth programmable logic for wired communications, aerospace, and test instrumentation applications.

FAQ

What is the maximum supported DDR4 data rate for XCKU3P-L2FFVB676E?

The XCKU3P-L2FFVB676E supports DDR4 memory interfaces up to 2400 MT/s across four independent memory controllers. This capability enables high-bandwidth data buffering for packet processing and baseband computation. The device includes dedicated memory controller hard IP with calibration and training logic. XCKU3P-L2FFVB676E implements bank-level and chip-select timing controls compliant with JEDEC DDR4 standards.

Does XCKU3P-L2FFVB676E include hardened 100G Ethernet MAC blocks?

Yes, XCKU3P-L2FFVB676E integrates hardened 100G Ethernet MAC blocks compliant with IEEE 802.3bj for KR4 operation. These MACs include built-in FEC and CRC logic, eliminating external components for fronthaul and backhaul applications. XCKU3P-L2FFVB676E supports both KR4 and 25G KR2 modes through the same transceiver infrastructure.

What is the transceiver lane count and protocol support for XCKU3P-L2FFVB676E?

XCKU3P-L2FFVB676E provides 32 transceiver lanes operating up to 14.4 GT/s, configurable as 16 KR4 lanes or 32 KR2 lanes. It supports PCIe Gen4 x16, 100G Ethernet KR4, 25G Ethernet KR/KR2, and CEI-28G-VSR protocols. XCKU3P-L2FFVB676E includes per-lane PRBS generation and error detection for compliance testing.

Is XCKU3P-L2FFVB676E compatible with Vivado Design Suite 2022.2 or later?

Yes, XCKU3P-L2FFVB676E is fully supported in Vivado Design Suite 2022.2 and all subsequent versions. Device files, IP integrators, and timing closure tools are included out-of-the-box. XCKU3P-L2FFVB676E benefits from updated placement algorithms and power-aware synthesis flows introduced in Vivado 2023.1.

What security features are implemented in XCKU3P-L2FFVB676E?

XCKU3P-L2FFVB676E includes AES-256 bitstream encryption, HMAC-SHA256 authentication, and RSA-4096 secure boot. It supports tamper-resistant key storage in eFUSE and runtime bitstream integrity checking. XCKU3P-L2FFVB676E enables secure remote updates and hardware-enforced privilege separation between PS and PL domains.