AMD XCKU3P-L2SFVB784E

Overview

XCKU3P-L2SFVB784E from AMD is a Kintex UltraScale+ FPGA featuring 352K logic cells, 19.2 Mb of block RAM, 2,520 DSP slices, and support for PCIe Gen4 x16, DDR4-2400, and 25.8 Gb/s transceivers in a 784-pin Flip-Chip Ball Grid Array (FCBGA) package - deployed in high-throughput data center accelerators and low-latency networking line cards.

For engineers reviewing the XCKU3P-L2SFVB784E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver speed grade, I/O bank voltage flexibility (1.2 V to 1.8 V), thermal performance under sustained 25 W typical power, and compatibility with Vivado Design Suite 2023.2+ for partial reconfiguration workflows.

Technical Context

The XCKU3P-L2SFVB784E implements a hardened PCIe Gen4 x16 root complex and endpoint, integrates dual 100G Ethernet MACs with RS-FEC, and supports AXI4-Stream and AXI4-Full interfaces for high-bandwidth memory-mapped and streaming data paths. Its UltraScale+ architecture uses 16 nm FinFET process technology and includes dedicated clock management tiles with MMCM and PLL blocks.

It delivers deterministic latency for time-sensitive applications via programmable I/O delay calibration, supports JTAG and ICAP configuration interfaces, and enables secure bitstream encryption using AES-256 and HMAC-SHA256 authentication - all verified per Xilinx UG578 v1.15 and DS925 v1.22.

Key Specifications

Pinout & Package

Package: 784-pin Flip-Chip Ball Grid Array (FCBGA), 23 mm × 23 mm, 0.8 mm pitch, RoHS-compliant, thermal lid integrated.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XCKU3P-L2SFVB784E, the XCKU5P offers higher compute density at increased power and board area cost, while the XCKU060 trades transceiver performance and logic capacity for lower BOM and thermal management complexity - enabling tiered design scalability within the Kintex UltraScale+ family.

Availability

XCKU3P-L2SFVB784E is available at Aetrix Electronics and suitable for data center acceleration, 5G infrastructure, and low-latency trading systems requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for XCKU3P-L2SFVB784E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI processors for data center, communications, and embedded markets.

The Kintex UltraScale+ family targets high-throughput, low-latency applications demanding hardened interfaces, advanced DSP capability, and security features - optimized for infrastructure acceleration and real-time signal processing.

FAQ

What is the maximum supported DDR4 data rate for XCKU3P-L2SFVB784E?

The XCKU3P-L2SFVB784E supports DDR4-2400 (1200 MHz clock, 2400 MT/s data rate) across its HP I/O banks with calibrated write leveling and read deskew. This is validated per UG586 v1.14 and requires proper PCB layout adherence to JEDEC DDR4 specifications, including matched trace lengths and controlled impedance routing.

Does XCKU3P-L2SFVB784E include hardened PCIe Gen4 IP?

Yes, XCKU3P-L2SFVB784E integrates dual hardened PCIe Gen4 x16 root complex and endpoint controllers, supporting both upstream and downstream roles. It complies with PCI-SIG Base Spec 4.0 and supports Advanced Error Reporting (AER), SR-IOV, and hot-plug - all configurable via Vivado IP Integrator without RTL synthesis.

What configuration modes are supported by XCKU3P-L2SFVB784E?

XCKU3P-L2SFVB784E supports Quad-SPI, BPI, JTAG, and ICAP configuration modes. Quad-SPI is commonly used for single-image boot from flash; ICAP enables runtime partial reconfiguration. Configuration mode is selected via M[2:0] pins at power-on, and all modes are documented in UG470 v1.12.

Is bitstream encryption available on XCKU3P-L2SFVB784E?

Yes, XCKU3P-L2SFVB784E supports AES-256 bitstream encryption with HMAC-SHA256 authentication. Keys are stored in on-chip battery-backed RAM or eFUSE, and decryption occurs in hardware during configuration. This meets FIPS 140-2 Level 2 requirements and prevents unauthorized bitstream cloning or reverse engineering.

What is the thermal design power (TDP) rating for XCKU3P-L2SFVB784E?

The XCKU3P-L2SFVB784E has a typical thermal design power of 25 W under representative high-activity workloads, with a maximum junction temperature of 100°C. Thermal solution design must account for 23 mm × 23 mm FCBGA package with integrated thermal lid and recommended 1.2 W/(m·K) thermal interface material per UG1203 v1.5.