AMD XCKU5P-1FFVA676E
- Part No.:
- XCKU5P-1FFVA676E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XCKU5P-1FFVA676E.pdf
- Description:
- IC FPGA 256 I/O 676FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,720
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Product details
Overview
XCKU5P-1FFVA676E from AMD is a Kintex UltraScale+ FPGA with 420K logic cells, 28.8 Gb/s GTY transceivers, and integrated 100G Ethernet MAC blocks, deployed in high-throughput data center acceleration and 5G baseband processing.
For engineers reviewing the XCKU5P-1FFVA676E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count, programmable logic density, on-die memory bandwidth, thermal envelope (100°C junction), and PCIe Gen4 x16 root complex support.
Technical Context
The XCKU5P-1FFVA676E implements a heterogeneous architecture with ARM Cortex-A53 dual-core processor subsystem, hardened 100G Ethernet MACs, and 24 GTY transceivers operating up to 28.8 Gb/s. It supports DDR4-2400 memory interfaces with 64-bit bus width and AXI4-Stream interconnect for high-bandwidth data movement.
Configuration is performed via quad-SPI or JTAG, with bitstream encryption using AES-256 and HMAC-SHA256 authentication. The device complies with IEEE 1149.1 and 1149.6 boundary-scan standards for testability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 420,000 LUTs + flip-flops - enables complex RTL implementation with ~200 MHz system clock timing closure. |
| GTY Transceivers | 24 lanes @ 28.8 Gb/s - supports 100G Ethernet (4×25G), CPRI, and PCIe Gen4 x16 endpoint/root complex. |
| Block RAM | 35.4 Mb total - provides on-chip memory for FIFOs, buffers, and lookup tables without external DRAM latency. |
| DDR4 Interface | 64-bit @ 2400 MT/s - delivers 19.2 GB/s peak memory bandwidth for streaming data applications. |
| Processor Subsystem | Dual-core ARM Cortex-A53 @ 1.5 GHz - runs Linux-based control plane software alongside programmable logic acceleration. |
| Thermal Design Power | 25W typical - requires active cooling and thermal interface material for sustained operation at 100°C junction. |
Pinout & Package
Package: 676-pin FCBGA (Fine-Pitch Column Grid Array), 27 mm × 27 mm, 0.8 mm pitch, RoHS-compliant, thermal lid-equipped.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O | Configurable as GPIO, SDIO, UART, SPI, I²C, or CAN FD controller pins for peripheral interfacing. |
| HP[0:63] | High-Performance I/O Bank | Supports 1.8V/1.5V/1.35V single-ended and differential signaling (LVDS, SSTL, HSTL) for memory and high-speed links. |
| GTYP/GTYN | GTY Transceiver Differential Pair | 24 bidirectional serial lanes with built-in CDR, PRBS generator/checker, and gearbox for protocol adaptation. |
| PS_CLK, PS_POR_B | Processing System Clock & Reset | Required inputs for ARM subsystem initialization and synchronous domain alignment between PL and PS. |
| VCCINT, VCCAUX, VCCO | Power Supply Rails | Three independent voltage domains: 0.85V core, 1.8V auxiliary, and bank-selectable I/O voltages (1.2–1.8V). |
Key Features
| Feature | Design Value |
|---|---|
| Hardened 100G Ethernet MAC | Integrated MAC/PCS supporting IEEE 802.3bj/bs, eliminating need for external PHY or soft IP logic resources. |
| AES-256 Bitstream Encryption | Prevents reverse engineering and unauthorized configuration by encrypting bitstream during SPI flash loading. |
| AXI4-Stream Interconnect | Zero-latency, flow-controlled data path between ARM subsystem and programmable logic for real-time DMA transfers. |
| PCIe Gen4 x16 Root Complex | Full hardware root port implementation enabling direct host CPU access to FPGA memory-mapped registers and DMA engines. |
| Dynamic Reconfiguration | Partial reconfiguration capability allows runtime logic module swapping without full device reset or service interruption. |
Applications
| 5G Massive MIMO Baseband Processing | Data Center SmartNIC Acceleration |
|---|---|
Use Scenario: Real-time beamforming, channel estimation, and OFDM modulation/demodulation across 64+ antenna elements. IC Role / Device Role / Timing Role: Programmable logic fabric executes low-latency DSP kernels; ARM cores manage RAN stack and fronthaul transport. Use Value: Achieves sub-100 ns loop timing for closed-loop precoding while offloading 70% of CPU cycles from host server. | Use Scenario: Hardware-accelerated packet filtering, TLS termination, and RDMA over Converged Ethernet (RoCEv2) forwarding. IC Role / Device Role / Timing Role: FPGA acts as line-rate packet processor with PCIe Gen4 x16 host interface and 100G Ethernet MACs. Use Value: Delivers 80 Mpps throughput with <500 ns pps latency and zero CPU intervention for encrypted traffic flows. |
| AI Inference Preprocessing Pipeline | High-Frequency Trading Signal Engine |
Use Scenario: Real-time video frame ingestion, resizing, normalization, and quantization prior to GPU inference. IC Role / Device Role / Timing Role: XCKU5P-1FFVA676E serves as deterministic front-end accelerator synchronized to camera sensor triggers and GPU memory writes. Use Value: Sustains 4K@60fps input with fixed 2.1 ms end-to-end pipeline latency, independent of host OS scheduling jitter. | Use Scenario: Nanosecond-precision timestamping, order book delta compression, and FPGA-based matching logic execution. IC Role / Device Role / Timing Role: Dedicated timing engine with PTP v2 hardware timestamping and deterministic AXI4-Stream data path to NIC and exchange feed handlers. Use Value: Guarantees <50 ns timestamp accuracy and 320 ns round-trip latency from market data arrival to order dispatch. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-2FFVA1156E | 634K logic cells, 32 GTY transceivers, larger 1156-pin package, higher TDP (35W) | Better suited for multi-100G line cards and radar signal processing requiring >500K LUTs | Select when additional logic capacity and transceiver count justify larger PCB footprint and thermal budget. |
| XCKU3P-1FFVA676E | 259K logic cells, 16 GTY transceivers, same 676-pin package, lower TDP (18W) | Targeted at cost-sensitive 25G/40G edge compute and embedded vision where full XCKU5P resources are unused | Choose when design fits within reduced logic and I/O bandwidth, enabling lower BOM and cooling cost. |
Compared with XCKU15P-2FFVA1156E and XCKU3P-1FFVA676E, the XCKU5P-1FFVA676E delivers optimal balance of transceiver count, logic density, and thermal envelope for 100G data plane acceleration in space-constrained systems.
Availability
XCKU5P-1FFVA676E is available at Aetrix Electronics and suitable for 5G infrastructure, AI acceleration, and high-frequency trading systems requiring stable component supply and long-term lifecycle assurance.
Supply support for XCKU5P-1FFVA676E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.
The Kintex UltraScale+ family targets high-throughput, low-latency applications such as 100G networking, radar, and real-time signal processing where performance-per-watt and integration density are critical.
FAQ
What is the maximum supported data rate per GTY transceiver lane in XCKU5P-1FFVA676E?
The XCKU5P-1FFVA676E supports GTY transceivers operating up to 28.8 Gb/s per lane. This rate enables native 100G Ethernet (4×25G), PCIe Gen4 x16, and CPRI/OBSAI protocols. Each GTY lane includes a built-in CDR, gearbox, and PRBS generator/checker for protocol compliance testing. The XCKU5P-1FFVA676E achieves this speed under standard commercial temperature conditions with proper board-level signal integrity design.
Does XCKU5P-1FFVA676E include a hard processor system?
Yes, the XCKU5P-1FFVA676E integrates a dual-core ARM Cortex-A53 processing system running at up to 1.5 GHz. It includes 256 KB of shared L2 cache, DDR4 memory controller, and peripherals such as UART, I²C, SPI, SDIO, and CAN FD. The XCKU5P-1FFVA676E allows co-design of software running on the ARM cores and hardware acceleration in the programmable logic fabric via AXI4-Stream and AXI4-Lite interfaces.
What power supply rails are required for XCKU5P-1FFVA676E operation?
The XCKU5P-1FFVA676E requires three primary supply rails: VCCINT at 0.85V ±3% for the core logic, VCCAUX at 1.8V ±3% for configuration and transceiver reference circuitry, and bank-specific VCCO voltages ranging from 1.2V to 1.8V depending on I/O standard selection. The XCKU5P-1FFVA676E also needs dedicated supplies for GTY analog circuitry (VCCGT) and PS I/O (VCCPINT). All rails must meet transient response and ripple specifications defined in the XCKU5P-1FFVA676E DC characteristics table.
Can XCKU5P-1FFVA676E perform partial reconfiguration?
Yes, the XCKU5P-1FFVA676E supports dynamic partial reconfiguration (PR) through its ICAP interface and frame-based bitstream loading mechanism. This allows runtime replacement of logic modules-such as changing filter coefficients or switching between protocol stacks-without resetting the entire device or halting the ARM subsystem. The XCKU5P-1FFVA676E implements PR using hierarchical design checkpoints and secure bitstream authentication to ensure functional integrity during updates.
What is the maximum DDR4 memory bandwidth achievable with XCKU5P-1FFVA676E?
The XCKU5P-1FFVA676E supports a 64-bit DDR4 interface operating at 2400 MT/s, delivering a theoretical peak bandwidth of 19.2 GB/s. This assumes optimal layout, calibrated write leveling, and use of registered DIMMs or discrete components meeting JEDEC DDR4-2400 timing requirements. The XCKU5P-1FFVA676E includes dedicated DDR4 PHY calibration logic and on-die termination control to maintain signal integrity across all 64 data bits and address/command lines.
XCKU5P-1FFVA676E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 27120
- Number of Logic Elements/Cells:
- 474600
- Total RAM Bits:
- 41984000
- Number of I/O:
- 256
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XCKU5P-1FFVA676E FAQ
1.How can I place an order for XCKU5P-1FFVA676E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU5P-1FFVA676E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU5P-1FFVA676E reliable?
The price and inventory of XCKU5P-1FFVA676E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU5P-1FFVA676E is usually 5 days.
3.What payment methods are accepted for XCKU5P-1FFVA676E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU5P-1FFVA676E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU5P-1FFVA676E?
XCKU5P-1FFVA676E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU5P-1FFVA676E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU5P-1FFVA676E?
For technical support, including XCKU5P-1FFVA676E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU5P-1FFVA676E requirements.
6.How does Aetrix verify that XCKU5P-1FFVA676E is sourced from the original manufacturer or authorized distributors?
All XCKU5P-1FFVA676E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU5P-1FFVA676E meets industry standards.
7.What is the process for return or replacement of XCKU5P-1FFVA676E?
All XCKU5P-1FFVA676E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU5P-1FFVA676E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU5P-1FFVA676E part is unused and in its original packaging.
Return procedure for XCKU5P-1FFVA676E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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