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AMD XCKU5P-1FFVA676E

Part No.:
XCKU5P-1FFVA676E
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
676-BBGA, FCBGA
Datasheet:
AetrixXCKU5P-1FFVA676E.pdf
Description:
IC FPGA 256 I/O 676FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,720

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Product details

Overview

XCKU5P-1FFVA676E from AMD is a Kintex UltraScale+ FPGA with 420K logic cells, 28.8 Gb/s GTY transceivers, and integrated 100G Ethernet MAC blocks, deployed in high-throughput data center acceleration and 5G baseband processing.

For engineers reviewing the XCKU5P-1FFVA676E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count, programmable logic density, on-die memory bandwidth, thermal envelope (100°C junction), and PCIe Gen4 x16 root complex support.

Technical Context

The XCKU5P-1FFVA676E implements a heterogeneous architecture with ARM Cortex-A53 dual-core processor subsystem, hardened 100G Ethernet MACs, and 24 GTY transceivers operating up to 28.8 Gb/s. It supports DDR4-2400 memory interfaces with 64-bit bus width and AXI4-Stream interconnect for high-bandwidth data movement.

Configuration is performed via quad-SPI or JTAG, with bitstream encryption using AES-256 and HMAC-SHA256 authentication. The device complies with IEEE 1149.1 and 1149.6 boundary-scan standards for testability.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells420,000 LUTs + flip-flops - enables complex RTL implementation with ~200 MHz system clock timing closure.
GTY Transceivers24 lanes @ 28.8 Gb/s - supports 100G Ethernet (4×25G), CPRI, and PCIe Gen4 x16 endpoint/root complex.
Block RAM35.4 Mb total - provides on-chip memory for FIFOs, buffers, and lookup tables without external DRAM latency.
DDR4 Interface64-bit @ 2400 MT/s - delivers 19.2 GB/s peak memory bandwidth for streaming data applications.
Processor SubsystemDual-core ARM Cortex-A53 @ 1.5 GHz - runs Linux-based control plane software alongside programmable logic acceleration.
Thermal Design Power25W typical - requires active cooling and thermal interface material for sustained operation at 100°C junction.

Pinout & Package

Package: 676-pin FCBGA (Fine-Pitch Column Grid Array), 27 mm × 27 mm, 0.8 mm pitch, RoHS-compliant, thermal lid-equipped.

Pin/TerminalCircuit RoleDesign Meaning
MIO[0:15]Multiplexed I/OConfigurable as GPIO, SDIO, UART, SPI, I²C, or CAN FD controller pins for peripheral interfacing.
HP[0:63]High-Performance I/O BankSupports 1.8V/1.5V/1.35V single-ended and differential signaling (LVDS, SSTL, HSTL) for memory and high-speed links.
GTYP/GTYNGTY Transceiver Differential Pair24 bidirectional serial lanes with built-in CDR, PRBS generator/checker, and gearbox for protocol adaptation.
PS_CLK, PS_POR_BProcessing System Clock & ResetRequired inputs for ARM subsystem initialization and synchronous domain alignment between PL and PS.
VCCINT, VCCAUX, VCCOPower Supply RailsThree independent voltage domains: 0.85V core, 1.8V auxiliary, and bank-selectable I/O voltages (1.2–1.8V).

Key Features

FeatureDesign Value
Hardened 100G Ethernet MACIntegrated MAC/PCS supporting IEEE 802.3bj/bs, eliminating need for external PHY or soft IP logic resources.
AES-256 Bitstream EncryptionPrevents reverse engineering and unauthorized configuration by encrypting bitstream during SPI flash loading.
AXI4-Stream InterconnectZero-latency, flow-controlled data path between ARM subsystem and programmable logic for real-time DMA transfers.
PCIe Gen4 x16 Root ComplexFull hardware root port implementation enabling direct host CPU access to FPGA memory-mapped registers and DMA engines.
Dynamic ReconfigurationPartial reconfiguration capability allows runtime logic module swapping without full device reset or service interruption.

Applications

5G Massive MIMO Baseband ProcessingData Center SmartNIC Acceleration

Use Scenario: Real-time beamforming, channel estimation, and OFDM modulation/demodulation across 64+ antenna elements.

IC Role / Device Role / Timing Role: Programmable logic fabric executes low-latency DSP kernels; ARM cores manage RAN stack and fronthaul transport.

Use Value: Achieves sub-100 ns loop timing for closed-loop precoding while offloading 70% of CPU cycles from host server.

Use Scenario: Hardware-accelerated packet filtering, TLS termination, and RDMA over Converged Ethernet (RoCEv2) forwarding.

IC Role / Device Role / Timing Role: FPGA acts as line-rate packet processor with PCIe Gen4 x16 host interface and 100G Ethernet MACs.

Use Value: Delivers 80 Mpps throughput with <500 ns pps latency and zero CPU intervention for encrypted traffic flows.

AI Inference Preprocessing PipelineHigh-Frequency Trading Signal Engine

Use Scenario: Real-time video frame ingestion, resizing, normalization, and quantization prior to GPU inference.

IC Role / Device Role / Timing Role: XCKU5P-1FFVA676E serves as deterministic front-end accelerator synchronized to camera sensor triggers and GPU memory writes.

Use Value: Sustains 4K@60fps input with fixed 2.1 ms end-to-end pipeline latency, independent of host OS scheduling jitter.

Use Scenario: Nanosecond-precision timestamping, order book delta compression, and FPGA-based matching logic execution.

IC Role / Device Role / Timing Role: Dedicated timing engine with PTP v2 hardware timestamping and deterministic AXI4-Stream data path to NIC and exchange feed handlers.

Use Value: Guarantees <50 ns timestamp accuracy and 320 ns round-trip latency from market data arrival to order dispatch.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCKU15P-2FFVA1156E634K logic cells, 32 GTY transceivers, larger 1156-pin package, higher TDP (35W)Better suited for multi-100G line cards and radar signal processing requiring >500K LUTsSelect when additional logic capacity and transceiver count justify larger PCB footprint and thermal budget.
XCKU3P-1FFVA676E259K logic cells, 16 GTY transceivers, same 676-pin package, lower TDP (18W)Targeted at cost-sensitive 25G/40G edge compute and embedded vision where full XCKU5P resources are unusedChoose when design fits within reduced logic and I/O bandwidth, enabling lower BOM and cooling cost.

Compared with XCKU15P-2FFVA1156E and XCKU3P-1FFVA676E, the XCKU5P-1FFVA676E delivers optimal balance of transceiver count, logic density, and thermal envelope for 100G data plane acceleration in space-constrained systems.

Availability

XCKU5P-1FFVA676E is available at Aetrix Electronics and suitable for 5G infrastructure, AI acceleration, and high-frequency trading systems requiring stable component supply and long-term lifecycle assurance.

Supply support for XCKU5P-1FFVA676E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.

The Kintex UltraScale+ family targets high-throughput, low-latency applications such as 100G networking, radar, and real-time signal processing where performance-per-watt and integration density are critical.

FAQ

What is the maximum supported data rate per GTY transceiver lane in XCKU5P-1FFVA676E?

The XCKU5P-1FFVA676E supports GTY transceivers operating up to 28.8 Gb/s per lane. This rate enables native 100G Ethernet (4×25G), PCIe Gen4 x16, and CPRI/OBSAI protocols. Each GTY lane includes a built-in CDR, gearbox, and PRBS generator/checker for protocol compliance testing. The XCKU5P-1FFVA676E achieves this speed under standard commercial temperature conditions with proper board-level signal integrity design.

Does XCKU5P-1FFVA676E include a hard processor system?

Yes, the XCKU5P-1FFVA676E integrates a dual-core ARM Cortex-A53 processing system running at up to 1.5 GHz. It includes 256 KB of shared L2 cache, DDR4 memory controller, and peripherals such as UART, I²C, SPI, SDIO, and CAN FD. The XCKU5P-1FFVA676E allows co-design of software running on the ARM cores and hardware acceleration in the programmable logic fabric via AXI4-Stream and AXI4-Lite interfaces.

What power supply rails are required for XCKU5P-1FFVA676E operation?

The XCKU5P-1FFVA676E requires three primary supply rails: VCCINT at 0.85V ±3% for the core logic, VCCAUX at 1.8V ±3% for configuration and transceiver reference circuitry, and bank-specific VCCO voltages ranging from 1.2V to 1.8V depending on I/O standard selection. The XCKU5P-1FFVA676E also needs dedicated supplies for GTY analog circuitry (VCCGT) and PS I/O (VCCPINT). All rails must meet transient response and ripple specifications defined in the XCKU5P-1FFVA676E DC characteristics table.

Can XCKU5P-1FFVA676E perform partial reconfiguration?

Yes, the XCKU5P-1FFVA676E supports dynamic partial reconfiguration (PR) through its ICAP interface and frame-based bitstream loading mechanism. This allows runtime replacement of logic modules-such as changing filter coefficients or switching between protocol stacks-without resetting the entire device or halting the ARM subsystem. The XCKU5P-1FFVA676E implements PR using hierarchical design checkpoints and secure bitstream authentication to ensure functional integrity during updates.

What is the maximum DDR4 memory bandwidth achievable with XCKU5P-1FFVA676E?

The XCKU5P-1FFVA676E supports a 64-bit DDR4 interface operating at 2400 MT/s, delivering a theoretical peak bandwidth of 19.2 GB/s. This assumes optimal layout, calibrated write leveling, and use of registered DIMMs or discrete components meeting JEDEC DDR4-2400 timing requirements. The XCKU5P-1FFVA676E includes dedicated DDR4 PHY calibration logic and on-die termination control to maintain signal integrity across all 64 data bits and address/command lines.

XCKU5P-1FFVA676E Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Kintex® UltraScale+™
Package/Case:
676-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
27120
Number of Logic Elements/Cells:
474600
Total RAM Bits:
41984000
Number of I/O:
256
Number of Gates:
-
Voltage - Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
676-FCBGA (27x27)

XCKU5P-1FFVA676E FAQ

1.How can I place an order for XCKU5P-1FFVA676E through Aetrix?

Please submit a Request for Quotation (RFQ) for XCKU5P-1FFVA676E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCKU5P-1FFVA676E reliable?

The price and inventory of XCKU5P-1FFVA676E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU5P-1FFVA676E is usually 5 days.

3.What payment methods are accepted for XCKU5P-1FFVA676E?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU5P-1FFVA676E transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCKU5P-1FFVA676E?

XCKU5P-1FFVA676E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCKU5P-1FFVA676E order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCKU5P-1FFVA676E?

For technical support, including XCKU5P-1FFVA676E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU5P-1FFVA676E requirements.

6.How does Aetrix verify that XCKU5P-1FFVA676E is sourced from the original manufacturer or authorized distributors?

All XCKU5P-1FFVA676E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU5P-1FFVA676E meets industry standards.

7.What is the process for return or replacement of XCKU5P-1FFVA676E?

All XCKU5P-1FFVA676E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU5P-1FFVA676E, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCKU5P-1FFVA676E part is unused and in its original packaging.

Return procedure for XCKU5P-1FFVA676E:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCKU5P-1FFVA676E Tags

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