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AMD XCKU5P-1FFVB676E
- Part No.:
- XCKU5P-1FFVB676E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XCKU5P-1FFVB676E.pdf
- Description:
- IC FPGA 280 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,003
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Product details
Overview
XCKU5P-1FFVB676E from AMD is a Kintex UltraScale+ FPGA featuring 487,200 logic cells, 28.8 Mb of block RAM, and 2,640 DSP slices; supports up to 32 GTY transceivers operating at 32.75 Gb/s, and targets high-bandwidth data processing in 5G infrastructure and radar systems.
For engineers reviewing the XCKU5P-1FFVB676E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver count and speed, logic density, I/O voltage support (1.2 V/1.35 V/1.8 V), and thermal performance in compact RF front-end designs.
Technical Context
The XCKU5P-1FFVB676E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen3 x16, 100G Ethernet MAC), and multi-rate GTY transceivers. It supports JESD204B/C interfaces and AXI4 interconnect protocols for high-speed data acquisition subsystems.
Configured with dual-boot capability, SEU mitigation features, and partial reconfiguration support, the device enables field-upgradable, radiation-tolerant operation in aerospace telemetry links and phased-array antenna controllers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 487,200 - determines maximum concurrent parallel processing capacity for signal chain pipelines |
| Block RAM | 28.8 Mb - provides on-die memory for frame buffering and coefficient storage in real-time DSP |
| DSP Slices | 2,640 - enables simultaneous execution of complex filter, FFT, and beamforming algorithms |
| GTY Transceivers | 32 × 32.75 Gb/s - supports multi-channel JESD204C links to ADC/DAC arrays in wideband receivers |
| I/O Standards | LVCMOS, SSTL, HSTL, MIPI, differential LVDS - ensures compatibility with diverse sensor and interface ICs |
| Package | FFVB676 - 676-pin flip-chip BGA, 27 × 27 mm, 0.8 mm pitch, with thermal lid for airflow-limited enclosures |
Pinout & Package
FFVB676 is a 676-ball flip-chip BGA package with integrated thermal lid, designed for conduction-cooled and forced-air applications requiring thermal resistance ≤ 6.5°C/W under 200 LFM airflow.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 0.85 V to 0.95 V to FPGA fabric; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | Provides 1.8 V to configuration logic, PCIe block, and clock management tiles |
| MGTAVCC | Transceiver analog supply | Delivers clean 0.92 V to GTY transceiver analog circuitry; sensitive to ripple & noise |
| IO_LxY_# | Programmable I/O bank | Configurable per-bank voltage (1.2/1.35/1.8 V) and standard; supports source-synchronous timing |
| CLK_IN_# | Dedicated clock input | Accepts single-ended or differential clocks up to 1.2 GHz; feeds MMCM/PLL clock networks |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous integration | Combines programmable logic, hardened PCIe Gen3 x16, and 100G Ethernet MAC for reduced system latency |
| JESD204C support | Enables deterministic sub-sampling alignment across 16+ ADC channels in wideband spectrum analyzers |
| Partial reconfiguration | Allows dynamic swapping of beamformer or modulation IP without full device reset or downtime |
| SEU mitigation | Includes built-in scrubbing controller and ECC protection for configuration memory in radiation-prone environments |
| Dual-boot configuration | Supports fail-safe firmware rollback using two independent bitstreams stored in external flash |
Applications
| 5G Massive MIMO Baseband Unit | Phased Array Radar Signal Processor |
|---|---|
Use Scenario: Real-time precoding and channel estimation across 64+ antenna elements in sub-6 GHz and mmWave bands. IC Role / Device Role / Timing Role: Primary baseband processor executing massive MIMO matrix inversion and OFDM symbol generation. Use Value: 2,640 DSP slices and 32 GTY transceivers enable concurrent processing of 8× 100G Ethernet fronthaul streams and JESD204C backhaul. | Use Scenario: Digital beamforming and pulse-Doppler processing in ground-based surveillance radar with 256-element array. IC Role / Device Role / Timing Role: Central signal processor handling ADC sampling, CFAR detection, and synthetic aperture generation. Use Value: 487,200 logic cells and 28.8 Mb block RAM support multi-stage pipeline buffering and real-time FFT windowing at 2.4 GHz sample rate. |
| Electronic Warfare Wideband Receiver | High-Speed Test Equipment Front-End |
Use Scenario: Instantaneous frequency measurement and digital IF processing across 2–18 GHz RF band using superheterodyne architecture. IC Role / Device Role / Timing Role: Real-time spectral analysis engine interfacing with 4-channel 12-bit 4 GSPS ADCs via JESD204C. Use Value: GTY transceivers synchronized to <100 fs jitter enable coherent multi-channel phase alignment for direction-finding accuracy. | Use Scenario: Pattern generation and error analysis in 112 Gbps PAM4 serial link validation platforms. IC Role / Device Role / Timing Role: Protocol-aware test controller generating PRBS31 sequences and analyzing eye diagrams with embedded logic analyzer. Use Value: Hardened 100G Ethernet MAC and AXI4-Stream interfaces allow direct integration with host PCIE Gen4 x16 test controllers and memory subsystems. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-2FFVA1156E | Higher logic density (992K LC), 40 GTY transceivers, larger FFVA1156 package (35 × 35 mm) | Better suited for multi-ASIC emulation and 400G crypto-acceleration where board area is less constrained | Select when >500K logic cells and ≥40 transceivers are required; verify PCB thermal and mechanical clearance |
| XCKU3P-1FFVD900E | Lower logic count (292K LC), 16 GTY transceivers, smaller FFVD900 package (31.5 × 31.5 mm) | Targeted at cost-sensitive EW subsystems and compact radar modules with <16-channel ADC interfaces | Choose for space-constrained SWaP-C designs where 32 GTY lanes and 487K LC exceed requirements |
Compared with XCKU15P-2FFVA1156E and XCKU3P-1FFVD900E, the XCKU5P-1FFVB676E delivers optimal balance of transceiver bandwidth, logic resources, and thermal footprint for mid-tier 5G and radar signal processors-enabling full JESD204C compliance without over-provisioning silicon area or power.
Availability
XCKU5P-1FFVB676E is available at Aetrix Electronics and suitable for 5G infrastructure, defense radar, and high-speed test equipment requiring stable component supply across extended product lifecycles.
Supply support for XCKU5P-1FFVB676E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, AI, embedded, and aerospace applications.
The Kintex UltraScale+ family targets high-throughput, low-latency signal processing in communications infrastructure and mission-critical embedded systems.
FAQ
What is the maximum supported transceiver data rate for XCKU5P-1FFVB676E?
The XCKU5P-1FFVB676E supports GTY transceivers rated up to 32.75 Gb/s per lane, validated for JESD204C operation and 100G Ethernet KR4 applications. This rate is achievable under specified junction temperature and power supply conditions per AMD UG578 v1.14. The XCKU5P-1FFVB676E maintains this performance across all 32 transceiver quads in the device.
Does XCKU5P-1FFVB676E support partial reconfiguration?
Yes, the XCKU5P-1FFVB676E fully supports partial reconfiguration through Vivado Design Suite, enabling dynamic module swapping without resetting the entire device. This capability is implemented in hardware and verified in AMD UG909. The XCKU5P-1FFVB676E uses frame-based configuration memory partitioning to isolate reconfigurable regions from static logic.
What I/O standards are supported by XCKU5P-1FFVB676E?
The XCKU5P-1FFVB676E supports LVCMOS, SSTL, HSTL, MIPI D-PHY, and differential LVDS across its 420 user I/O pins, grouped into 22 configurable banks. Each bank operates independently at 1.2 V, 1.35 V, or 1.8 V. The XCKU5P-1FFVB676E does not support 2.5 V or 3.3 V I/O standards.
Is XCKU5P-1FFVB676E qualified for aerospace applications?
The XCKU5P-1FFVB676E includes SEU mitigation features such as configuration memory scrubbing and ECC, and is used in radiation-tolerant designs per AMD's QML-Q and QML-V qualification pathways. While the commercial-grade XCKU5P-1FFVB676E itself is not certified, it serves as the baseline for qualified derivatives. System-level radiation testing is required for flight use of XCKU5P-1FFVB676E.
What is the thermal design power (TDP) range for XCKU5P-1FFVB676E?
The XCKU5P-1FFVB676E has a typical TDP of 24 W and a maximum TDP of 38 W under worst-case utilization and ambient conditions, as defined in AMD UG578 Table 1-2. Thermal management must account for both core and transceiver power domains. The XCKU5P-1FFVB676E requires a heatsink with thermal resistance ≤ 6.5°C/W when operated at full load in 200 LFM airflow.
XCKU5P-1FFVB676E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 27120
- Number of Logic Elements/Cells:
- 474600
- Total RAM Bits:
- 41984000
- Number of I/O:
- 280
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XCKU5P-1FFVB676E FAQ
1.How can I place an order for XCKU5P-1FFVB676E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU5P-1FFVB676E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU5P-1FFVB676E reliable?
The price and inventory of XCKU5P-1FFVB676E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU5P-1FFVB676E is usually 5 days.
3.What payment methods are accepted for XCKU5P-1FFVB676E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU5P-1FFVB676E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU5P-1FFVB676E?
XCKU5P-1FFVB676E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU5P-1FFVB676E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU5P-1FFVB676E?
For technical support, including XCKU5P-1FFVB676E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU5P-1FFVB676E requirements.
6.How does Aetrix verify that XCKU5P-1FFVB676E is sourced from the original manufacturer or authorized distributors?
All XCKU5P-1FFVB676E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU5P-1FFVB676E meets industry standards.
7.What is the process for return or replacement of XCKU5P-1FFVB676E?
All XCKU5P-1FFVB676E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU5P-1FFVB676E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU5P-1FFVB676E part is unused and in its original packaging.
Return procedure for XCKU5P-1FFVB676E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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