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AMD XCKU5P-1FFVB676I
- Part No.:
- XCKU5P-1FFVB676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XCKU5P-1FFVB676I.pdf
- Description:
- IC FPGA 280 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,111
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Product details
Overview
XCKU5P-1FFVB676I from AMD is a high-performance Kintex UltraScale+ FPGA featuring 443K logic cells, 28.8 Mb of block RAM, and support for up to 32 GTY transceivers operating at 32.75 Gbps. It integrates hardened PCIe Gen4 x16, 100G Ethernet MAC, and DDR4 memory controllers, targeting high-bandwidth data processing in radar signal conditioning and 5G baseband subsystems.
For engineers reviewing the XCKU5P-1FFVB676I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed, on-chip memory depth, I/O voltage flexibility (1.2 V to 1.8 V), and thermal design power (TDP) envelope for air-cooled embedded deployments.
Technical Context
The XCKU5P-1FFVB676I implements a heterogeneous architecture with programmable logic fabric, UltraScale+ DSP slices (2,520 units), and hardened IP blocks including dual 100G Ethernet MACs and quad 10G/25G Ethernet PCS/PMA. Its GTY transceivers support PAM4 and NRZ modulation with integrated clock data recovery (CDR) and adaptive equalization.
It features 960 user I/Os across 24 banks with SelectIO™ technology supporting LVDS, SSTL, HSTL, and MIPI standards. The device includes integrated configuration security (AES-256 bitstream encryption, HMAC authentication) and supports partial reconfiguration for dynamic function swapping in real-time systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 443,000 - determines maximum combinational and sequential logic capacity for complex algorithm implementation |
| Block RAM | 28.8 Mb - enables large on-die buffering for video frame stores or packet queuing without external memory |
| GTY Transceivers | 32 lanes @ 32.75 Gbps - supports multi-lane 100G/400G Ethernet or CPRI/eCPRI interfaces with forward error correction |
| PCIe Interface | Gen4 x16 hard IP - provides 32 GB/s bidirectional throughput for host CPU/FPGA co-processing architectures |
| I/O Banks | 24 banks, 960 pins - allows mixed-voltage I/O interfacing (1.2 V–1.8 V) across multiple subsystems on one die |
| TDP | 25 W typical - defines thermal management requirements for conduction-cooled or forced-air enclosures |
Pinout & Package
The XCKU5P-1FFVB676I is housed in a 676-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVB) package with 1.0 mm pitch, designed for high-signal-integrity PCB routing and thermal dissipation via central thermal ball array.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTAVCC | Analog supply for GTY transceivers | Must be independently filtered and regulated to ±3% for jitter-sensitive serial link stability |
| VRP/VRN | Reference voltage pair for differential I/O standards | Defines termination voltage for LVDS/HSTL; requires matched trace length and local decoupling |
| CCLK | Configuration clock input | Drives internal configuration state machine; frequency ≤ 50 MHz; must be stable before INIT_B deassertion |
| INIT_B | Configuration status output | Active-low open-drain signal indicating bitstream loading success or CRC failure |
| PROGRAM_B | Configuration reset input | Pulse-low initiates full reconfiguration; asynchronous to all clocks and resets internal logic |
Key Features
| Feature | Design Value |
|---|---|
| Hardened 100G Ethernet MAC | Reduces RTL integration effort and timing closure risk for OTN or IEEE 802.3bs-compliant line cards |
| AES-256 bitstream encryption | Prevents reverse engineering and unauthorized cloning of FPGA configuration in deployed edge infrastructure |
| Partial Reconfiguration Support | Enables runtime swapping of functional modules (e.g., modulator/demodulator blocks) without system reset |
| Dual 100G MAC + Quad 25G PCS/PMA | Allows concurrent 100G transport and 4×25G fronthaul interface handling within single device footprint |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler filtering in airborne AESA radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFTs and CFAR detection; GTY transceivers interface with ADC/DAC JESD204B converters. Use Value: On-die 28.8 Mb RAM buffers full chirp waveforms; hardened PCIe Gen4 enables low-latency telemetry streaming to host processor. | Use Scenario: Digital pre-distortion (DPD) and uplink/downlink channel processing in 5G macro base stations. IC Role / Device Role / Timing Role: Configurable logic implements adaptive DPD algorithms; 32 GTY lanes connect to multiple RFICs via eCPRI over 25G links. Use Value: Dual 100G MACs handle fronthaul aggregation; 443K logic cells support concurrent multi-carrier LTE/NR waveform generation. |
| High-Frequency Trading Acceleration | Test & Measurement Instrumentation |
Use Scenario: Latency-critical order matching and market data parsing in FPGA-accelerated trading engines. IC Role / Device Role / Timing Role: Deterministic low-latency path between 10G/25G network interfaces and custom match-engine logic; DDR4 controller manages order book state. Use Value: Sub-100 ns packet-to-action latency achieved via bypassing software stack; hardened Ethernet MAC eliminates PHY-layer jitter. | Use Scenario: Real-time protocol analysis and signal generation in 100G oscilloscopes and BERT systems. IC Role / Device Role / Timing Role: GTY transceivers act as physical layer test ports; DSP slices perform real-time eye diagram analysis and jitter decomposition. Use Value: Integrated 32.75 Gbps transceivers eliminate external retimers; on-chip memory stores multi-million-sample capture buffers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-2FFVA1156I | Higher logic density (765K cells), larger package (1156-pin FCBGA), higher TDP (35 W) | Better suited for multi-100G transport switching where logic capacity exceeds XCKU5P limits | Select when >500K logic cells or >48 GTY lanes required; verify thermal and PCB routing constraints |
| XCKU3P-1FFVD900I | Fewer GTY lanes (16), lower block RAM (18.2 Mb), smaller 900-pin package, lower TDP (18 W) | Targeted at cost-optimized 25G/50G fronthaul and compact radar EW subsystems | Choose for space-constrained designs needing <30 W TDP and ≤16 high-speed serial lanes |
Compared with XCKU5P-1FFVB676I, the XCKU15P offers greater scalability for future bandwidth growth but demands more board area and cooling; the XCKU3P reduces cost and power at the expense of transceiver count and memory depth-making it suitable only where those resources are underutilized.
Availability
XCKU5P-1FFVB676I is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband subsystems, and high-frequency trading acceleration requiring stable component supply across long-life industrial and defense programs.
Supply support for XCKU5P-1FFVB676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, AI, embedded, and client markets with leadership in FPGA, CPU, GPU, and adaptive SoC technologies.
The Kintex UltraScale+ family targets high-throughput, low-latency applications in communications infrastructure, aerospace, and test equipment-designed to deliver hardened IP, scalable logic, and energy-efficient transceivers in a single die.
FAQ
What is the maximum supported data rate per GTY transceiver lane in XCKU5P-1FFVB676I?
The XCKU5P-1FFVB676I supports GTY transceivers rated up to 32.75 Gbps per lane using NRZ encoding. This rating is validated under specified temperature and voltage conditions per AMD UG578 v1.14. The XCKU5P-1FFVB676I achieves this speed with integrated CDR and adaptive equalization, enabling reliable 100G/400G Ethernet and CPRI links without external retimers.
Does XCKU5P-1FFVB676I support partial reconfiguration, and what tools enable it?
Yes, XCKU5P-1FFVB676I supports partial reconfiguration through Vivado Design Suite 2022.2 or later. The XCKU5P-1FFVB676I requires dedicated PR controller IP and constrained floorplanning to isolate reconfigurable partitions. This capability allows runtime updates of signal processing blocks-such as switching between OFDM and SC-FDMA modulators-without resetting the entire device.
What I/O standards are supported by XCKU5P-1FFVB676I's SelectIO resources?
XCKU5P-1FFVB676I supports LVDS, SSTL-12/15/18, HSTL-I/II, MIPI D-PHY, and differential signaling standards across its 24 I/O banks. Each bank operates at 1.2 V to 1.8 V, allowing mixed-voltage interfaces on a single device. The XCKU5P-1FFVB676I does not support 3.3 V I/O standards or RSDS.
Is XCKU5P-1FFVB676I compatible with AMD's Vitis Unified Software Platform?
Yes, XCKU5P-1FFVB676I is fully supported in AMD Vitis 2022.2 for hardware-accelerated application development. The XCKU5P-1FFVB676I integrates with Vitis HLS for C/C++-to-RTL synthesis and Vitis Kernel Development Flow for OpenCL-based kernels. Targeted platforms include Alveo U250 and custom carrier boards with proper PCIe and memory interfaces.
What configuration modes does XCKU5P-1FFVB676I support, and which is recommended for production?
XCKU5P-1FFVB676I supports Master SPI, Slave SelectMAP, and JTAG configuration modes. For production, Master SPI with QSPI flash is recommended due to reliability, single-bit error correction, and fast boot time (<100 ms). The XCKU5P-1FFVB676I also supports fallback configuration and dual-image switching for field-upgradable systems.
XCKU5P-1FFVB676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 27120
- Number of Logic Elements/Cells:
- 474600
- Total RAM Bits:
- 41984000
- Number of I/O:
- 280
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XCKU5P-1FFVB676I FAQ
1.How can I place an order for XCKU5P-1FFVB676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU5P-1FFVB676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU5P-1FFVB676I reliable?
The price and inventory of XCKU5P-1FFVB676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU5P-1FFVB676I is usually 5 days.
3.What payment methods are accepted for XCKU5P-1FFVB676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU5P-1FFVB676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU5P-1FFVB676I?
XCKU5P-1FFVB676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU5P-1FFVB676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU5P-1FFVB676I?
For technical support, including XCKU5P-1FFVB676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU5P-1FFVB676I requirements.
6.How does Aetrix verify that XCKU5P-1FFVB676I is sourced from the original manufacturer or authorized distributors?
All XCKU5P-1FFVB676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU5P-1FFVB676I meets industry standards.
7.What is the process for return or replacement of XCKU5P-1FFVB676I?
All XCKU5P-1FFVB676I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU5P-1FFVB676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU5P-1FFVB676I part is unused and in its original packaging.
Return procedure for XCKU5P-1FFVB676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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