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AMD XCKU5P-1FFVD900E
- Part No.:
- XCKU5P-1FFVD900E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XCKU5P-1FFVD900E.pdf
- Description:
- IC FPGA 304 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,193
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Product details
Overview
XCKU5P-1FFVD900E from AMD is a Kintex UltraScale+ FPGA featuring 487,200 logic cells, 2,880 DSP slices, and 42.5 Mb of block RAM, deployed in high-bandwidth data processing systems such as 100G Ethernet line cards and radar signal processors.
For engineers reviewing the XCKU5P-1FFVD900E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver count (64 GTY 32.75 Gbps lanes), I/O voltage support (1.2 V to 1.8 V), thermal design power (52 W typical), and package-specific routing constraints for FFVD900.
Technical Context
The XCKU5P-1FFVD900E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including PCIe Gen3 x16, 100G Ethernet MAC, and DDR4 memory controllers, and integrated transceivers supporting PAM4 and NRZ modulation. It targets deterministic low-latency signal path design in aerospace and test equipment.
Configuration occurs via dual-mode JTAG or quad-SPI flash, with bitstream encryption using AES-256 and HMAC authentication. The device supports partial reconfiguration and dynamic function exchange for runtime adaptation in mission-critical systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 487,200 - determines maximum combinational/sequential logic capacity for custom datapath implementation |
| DSP Slices | 2,880 - enables parallel execution of 27×18-bit multiply-accumulate operations per slice |
| Block RAM | 42.5 Mb - provides on-die memory for FIFOs, coefficient storage, and local buffering without external DRAM |
| GTY Transceivers | 64 lanes @ 32.75 Gbps - supports 100G KR4, CEI-28G-VSR, and proprietary serial protocols |
| I/O Standards | LVCMOS, SSTL, HSTL, MIPI, differential LVDS - enables direct interface to FPGAs, ADCs, DACs, and memory devices |
| TDP | 52 W typical - defines heatsink sizing and airflow requirements for sustained operation at full utilization |
Pinout & Package
The XCKU5P-1FFVD900E is housed in a 900-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVD900) package with 0.8 mm pitch, designed for high-density PCB routing and thermal dissipation via solder balls and exposed thermal pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O bank | Configurable as SDIO, UART, SPI, or GPIO; shared with PS peripherals in Zynq UltraScale+ MPSoC context but not applicable here |
| HR Bank 65 | High-range I/O bank | Supports 1.8 V/1.5 V/1.35 V/1.25 V signaling; requires dedicated VCCO and VRN/VRP resistors |
| GTY_RXN[0:63] | Differential transceiver input | AC-coupled, internally terminated; used for 100G Ethernet KR4 and CPRI fronthaul links |
| GTY_TXP[0:63] | Differential transceiver output | Programmable pre-emphasis and swing; compliant with IEEE 802.3bj CAUI-4 electrical specs |
| VCCAUX | Analog auxiliary supply | Must be regulated to 1.8 V ±3%; powers transceiver PLLs and configuration logic |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x16 controller | Reduces RTL integration effort and timing closure risk for host interface subsystems |
| DDR4 memory controller (up to 2,400 Mbps) | Eliminates need for external memory controller IC and simplifies board-level memory interface layout |
| AES-256 bitstream encryption | Enables secure field updates and protects intellectual property against reverse engineering |
| Partial reconfiguration capability | Allows functional modules to be swapped dynamically without resetting the entire device |
| UltraScale+ routing architecture | Provides predictable timing convergence and reduced interconnect delay variation across process corners |
Applications
| Radar Signal Processing | 100G Optical Transport |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler filtering in active electronically scanned array (AESA) radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes custom FFT and CFAR algorithms; GTY transceivers interface with high-speed ADC/DACs and optical modules. Use Value: 64 GTY lanes enable simultaneous multi-channel digitization at >2 GSPS aggregate throughput with sub-ns jitter tolerance. | Use Scenario: Line card implementation for OTN DWDM transport nodes handling 100G client-side interfaces. IC Role / Device Role / Timing Role: Implements MAC, FEC, and SerDes logic for OTU4 framing; interfaces to CFP2/CFP4 pluggables via CAUI-4. Use Value: Hardened 100G Ethernet MAC reduces latency by 128 ns versus soft IP and eliminates 40K LUTs of logic resource usage. |
| Test & Measurement Equipment | Avionics Data Concentrators |
Use Scenario: High-resolution digital oscilloscopes requiring real-time waveform analysis and protocol decoding up to PCIe Gen4. IC Role / Device Role / Timing Role: Hosts protocol analyzers, pattern generators, and time-interleaved ADC controllers; uses HR I/O banks for LVDS probe interfaces. Use Value: 42.5 Mb block RAM enables deep acquisition memory buffers without off-chip SRAM, reducing board area and power. | Use Scenario: ARINC 664 Part 7 (AFDX) end systems aggregating sensor data from flight control surfaces and environmental monitors. IC Role / Device Role / Timing Role: Implements deterministic AFDX switch fabric and time-triggered scheduler; interfaces to dual-redundant PHYs via RGMII. Use Value: PCIe Gen3 x16 hard IP enables high-bandwidth telemetry upload to avionics management units with guaranteed <1 μs interrupt latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-2FFVA1156E | Higher logic density (1,024,000 LC), larger package (1156-pin), 72 GTY lanes, 72 W TDP | Better suited for multi-100G packet processing and AI inference acceleration where resource headroom is critical | Select when >500K logic cells or >64 GTY lanes are required; verify PCB redesign for FFVA1156 footprint |
| XCKU3P-1FFVD900E | Fewer logic cells (351,000), same FFVD900 package, 40 GTY lanes, 38 W TDP | Targeted at cost-sensitive 40G/50G systems where bandwidth and logic budget are constrained | Choose for lower-power 50G line cards or embedded vision systems needing identical mechanical fit but reduced transceiver count |
Compared with XCKU5P-1FFVD900E, the XCKU15P-2FFVA1156E offers higher scalability at the cost of thermal and layout complexity, while the XCKU3P-1FFVD900E delivers mechanical compatibility with reduced performance envelope-enabling tiered system design within the same board family.
Availability
XCKU5P-1FFVD900E is available at Aetrix Electronics and suitable for radar signal processing, 100G optical transport, and avionics data concentrators requiring stable component supply across extended production lifecycles.
Supply support for XCKU5P-1FFVD900E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.
The Kintex UltraScale+ family targets high-throughput, low-latency applications in wired communications, aerospace, and test equipment where performance-per-watt and silicon-proven IP integration are critical.
FAQ
What is the maximum supported data rate for GTY transceivers on the XCKU5P-1FFVD900E?
The XCKU5P-1FFVD900E supports GTY transceivers operating up to 32.75 Gbps per lane in NRZ mode and 58 Gbps in PAM4 mode. These rates are validated per IEEE 802.3bs and OIF-CEI-56G standards. The XCKU5P-1FFVD900E achieves this with calibrated TX pre-emphasis and RX equalization settings defined in UG578.
Does the XCKU5P-1FFVD900E support DDR4 memory interfaces?
Yes, the XCKU5P-1FFVD900E integrates a hardened DDR4 memory controller supporting data rates up to 2,400 Mbps across up to 32 data bits per interface. It supports ECC, write leveling, and read leveling calibration. The XCKU5P-1FFVD900E requires external DDR4 components and proper PCB layout per UG583 guidelines.
Is partial reconfiguration supported on the XCKU5P-1FFVD900E?
Yes, the XCKU5P-1FFVD900E fully supports partial reconfiguration through Vivado Design Suite v2022.1+. This allows dynamic swapping of logical partitions without resetting the entire device. The XCKU5P-1FFVD900E implements frame-based reconfiguration with CRC-protected bitstream loading and isolation boundary checking.
What configuration modes does the XCKU5P-1FFVD900E support?
The XCKU5P-1FFVD900E supports master SPI, slave SPI, JTAG, and BPI configuration modes. Quad-SPI flash is the most common method for production deployment. The XCKU5P-1FFVD900E also supports fallback configuration and multi-boot from different flash sectors for field-upgrade resilience.
What is the thermal design power (TDP) of the XCKU5P-1FFVD900E?
The XCKU5P-1FFVD900E has a typical thermal design power of 52 W under full utilization at junction temperature of 85°C. This value assumes default voltage and clock settings per DS923. The XCKU5P-1FFVD900E requires a heatsink with ≥0.35°C/W thermal resistance and ≥200 LFM airflow for reliable long-term operation.
XCKU5P-1FFVD900E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 27120
- Number of Logic Elements/Cells:
- 474600
- Total RAM Bits:
- 41984000
- Number of I/O:
- 304
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XCKU5P-1FFVD900E FAQ
1.How can I place an order for XCKU5P-1FFVD900E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU5P-1FFVD900E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU5P-1FFVD900E reliable?
The price and inventory of XCKU5P-1FFVD900E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU5P-1FFVD900E is usually 5 days.
3.What payment methods are accepted for XCKU5P-1FFVD900E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU5P-1FFVD900E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU5P-1FFVD900E?
XCKU5P-1FFVD900E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU5P-1FFVD900E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU5P-1FFVD900E?
For technical support, including XCKU5P-1FFVD900E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU5P-1FFVD900E requirements.
6.How does Aetrix verify that XCKU5P-1FFVD900E is sourced from the original manufacturer or authorized distributors?
All XCKU5P-1FFVD900E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU5P-1FFVD900E meets industry standards.
7.What is the process for return or replacement of XCKU5P-1FFVD900E?
All XCKU5P-1FFVD900E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU5P-1FFVD900E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU5P-1FFVD900E part is unused and in its original packaging.
Return procedure for XCKU5P-1FFVD900E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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