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AMD XCKU5P-1FFVD900I
- Part No.:
- XCKU5P-1FFVD900I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XCKU5P-1FFVD900I.pdf
- Description:
- IC FPGA 304 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,182
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Product details
Overview
XCKU5P-1FFVD900I from AMD is a Kintex UltraScale+ FPGA featuring 443K logic cells, 28.8 Mb of block RAM, 2,640 DSP slices, and 900 I/O pins in a 900-pin FCBGA package; it supports PCIe Gen4 x16, DDR4-2400 memory interfaces, and operates at -40°C to +100°C junction temperature for high-performance compute-acceleration applications.
For engineers reviewing the XCKU5P-1FFVD900I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver count (32 GTY), I/O voltage support (1.2V/1.35V/1.8V), configuration interface (SPIx4/BPI), thermal design power (35W typical), and industrial-grade temperature rating.
Technical Context
The XCKU5P-1FFVD900I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including PCIe Gen4 root port/endpoint, 100G Ethernet MAC, and integrated ARM Cortex-R5F processors for real-time control. It supports partial reconfiguration and AXI4 interconnect for system-on-chip integration.
Configuration is performed via dual-boot SPI flash or JTAG, with bitstream encryption using AES-256 and HMAC authentication. The device includes dedicated clock management tiles with MMCM and PLL resources supporting jitter <150 fs RMS over 12 kHz–20 MHz bandwidth.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 443,000 - determines maximum combinational/sequential logic capacity for custom RTL implementation |
| Block RAM | 28.8 Mb - enables large on-die data buffering and FIFOs without external memory |
| DSP Slices | 2,640 - supports high-throughput fixed/floating-point math for AI inference or signal processing |
| GTY Transceivers | 32 × 32.75 Gb/s - provides native 100G Ethernet, PCIe Gen4, or CPRI/OBSAI connectivity |
| I/O Pins | 900 - allows wide parallel interfaces (e.g., DDR4 x72) and multi-protocol pin multiplexing |
| Operating Temp | -40°C to +100°C - qualified for industrial and aerospace environments without derating |
| TDP | 35 W typical - defines thermal solution requirements for sustained 100% utilization |
Pinout & Package
Package: 900-pin Fine-Pitch Flip-Chip Ball Grid Array (FFVD900), 31.0 mm × 31.0 mm, 0.8 mm pitch, RoHS-compliant, with thermal lid and underfill support.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O Bank 0 | Configurable as SDIO, UART, SPI, I2C, or GPIO; connects to PS subsystem |
| HP[0:63] | High-Performance I/O Bank | Supports DDR4-2400, LVDS, and SSTL-12/15; bank-specific VCCO and VRP routing |
| HR[0:47] | High-Density I/O Bank | Compatible with 1.2V/1.35V/1.8V standards; optimized for low-power parallel interfaces |
| GTY_TX/RX[0:31] | Multi-gigabit Transceiver Lane | Each pair supports 32.75 Gb/s PAM4 or NRZ; requires dedicated reference clocks and AC-coupling |
| CLK_IN_0/1 | Dedicated Clock Input | Accepts single-ended or differential clocks up to 1.2 GHz; feeds MMCM/PLL clock networks |
| PROGRAM_B | Configuration Initiate | Active-low asynchronous reset that clears configuration memory and restarts boot sequence |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen4 Hard IP | Integrated root port and endpoint blocks eliminate soft-core resource usage and guarantee timing closure |
| ARM Cortex-R5F Dual Core | Lockstep-capable real-time processor subsystem for safety-critical control and firmware offload |
| AES-256 Bitstream Encryption | Prevents IP theft and unauthorized configuration by enforcing secure boot and authenticated updates |
| Partial Reconfiguration | Enables dynamic logic swapping without resetting PL or PS, reducing system downtime |
| UltraScale+ Architecture | Delivers 2× logic density and 1.5× DSP throughput vs. previous Kintex generation at same power |
Applications
| 5G Radio Unit | AI Inference Accelerator |
|---|---|
Use Scenario: Real-time baseband processing and massive MIMO beamforming in open RAN infrastructure. IC Role / Device Role / Timing Role: FPGA fabric executes L1 PHY layer processing; GTY transceivers interface with eCPRI fronthaul links. Use Value: 32 GTY lanes enable 8× eCPRI 25G links; 2,640 DSP slices accelerate FFT/IFFT and channel estimation algorithms. | Use Scenario: Low-latency inference engine for edge vision systems using sparse CNN models. IC Role / Device Role / Timing Role: Configurable logic implements custom convolution pipelines; block RAM buffers feature maps between layers. Use Value: 443K logic cells support >10 TOPS INT8 throughput; DDR4-2400 interface sustains 19.2 GB/s memory bandwidth. |
| Industrial Machine Vision | Test & Measurement Equipment |
Use Scenario: High-speed image acquisition and real-time defect classification on factory floor cameras. IC Role / Device Role / Timing Role: FPGA processes pixel streams from CMOS sensors; MIPI CSI-2 receiver IP handles camera input. Use Value: 900 I/O pins support multi-sensor synchronization; -40°C to +100°C rating ensures operation in uncontrolled environments. | Use Scenario: Modular signal generator/analyzer with multi-channel arbitrary waveform synthesis. IC Role / Device Role / Timing Role: FPGA generates precise timing waveforms; GTY transceivers route digitized samples to host PC via PCIe Gen4. Use Value: 35W TDP enables fanless enclosure design; hardened PCIe Gen4 x16 delivers 32 GB/s sustained transfer rate. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-2FFVA1156E | Higher speed grade (-2), larger 1156-pin package, 752K logic cells, 4,560 DSP slices | Targeted at higher-bandwidth test equipment and radar processing where latency and throughput exceed XCKU5P limits | Select when >500K logic cells or >30W TDP budget is acceptable for performance gain |
| XCKU3P-1FFVD900I | Same 900-pin package but reduced resources: 259K logic cells, 16.2 Mb BRAM, 1,560 DSP slices, 24 GTY lanes | Suitable for cost-sensitive 5G small cells or edge AI where full XCKU5P capability is unused | Choose for BOM cost reduction while retaining identical PCB footprint and thermal profile |
Compared with XCKU5P-1FFVD900I, the XCKU15P-2FFVA1156E offers greater logic capacity and bandwidth at higher power and cost, while the XCKU3P-1FFVD900I delivers identical packaging and thermal behavior with scaled-down resources for tighter budgets.
Availability
XCKU5P-1FFVD900I is available at Aetrix Electronics and suitable for 5G infrastructure, AI edge accelerators, and industrial machine vision systems requiring stable component supply across extended product lifecycles.
Supply support for XCKU5P-1FFVD900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, embedded, and client applications.
The Kintex UltraScale+ family targets high-performance, cost-optimized FPGA solutions for wired/wireless communications, video processing, and real-time embedded control.
FAQ
What is the maximum supported DDR4 memory speed for XCKU5P-1FFVD900I?
The XCKU5P-1FFVD900I supports DDR4-2400 (1200 MHz) with 72-bit wide interfaces using HP I/O banks. This requires proper termination, matched trace lengths, and adherence to AMD UG571 timing constraints. XCKU5P-1FFVD900I achieves this speed using calibrated ODT and write-leveling sequences built into its memory controller IP.
Does XCKU5P-1FFVD900I include hardened PCIe Gen4 controllers?
Yes, XCKU5P-1FFVD900I integrates dual hardened PCIe Gen4 x8 controllers - one configured as root port and one as endpoint - supporting full x16 lane aggregation. These blocks are verified per PCI-SIG specifications and require no soft logic implementation. XCKU5P-1FFVD900I uses these for high-throughput host communication in AI accelerator cards.
What configuration modes does XCKU5P-1FFVD900I support?
XCKU5P-1FFVD900I supports master SPIx4, slave SPI, BPI, and JTAG configuration modes. Dual-boot capability allows fallback to secondary bitstream stored in SPI flash. Configuration security includes AES-256 decryption and HMAC authentication, both enforced during every boot of XCKU5P-1FFVD900I.
Is XCKU5P-1FFVD900I qualified for automotive applications?
No, XCKU5P-1FFVD900I is rated for industrial temperature range (-40°C to +100°C) and is not AEC-Q100 qualified. For automotive use, AMD offers the XCKU5P-1FFVD900IV variant with additional screening and documentation. XCKU5P-1FFVD900I remains appropriate for industrial and telecom deployments.
How many GTY transceivers are available on XCKU5P-1FFVD900I?
XCKU5P-1FFVD900I provides 32 GTY transceiver quads, each supporting 32.75 Gb/s NRZ or 58 Gb/s PAM4 operation. All 32 lanes are fully routable and usable simultaneously, subject to power and thermal limits. This transceiver count enables XCKU5P-1FFVD900I to implement dual 100G Ethernet interfaces or eight 25G eCPRI links.
XCKU5P-1FFVD900I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 27120
- Number of Logic Elements/Cells:
- 474600
- Total RAM Bits:
- 41984000
- Number of I/O:
- 304
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XCKU5P-1FFVD900I FAQ
1.How can I place an order for XCKU5P-1FFVD900I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU5P-1FFVD900I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU5P-1FFVD900I reliable?
The price and inventory of XCKU5P-1FFVD900I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU5P-1FFVD900I is usually 5 days.
3.What payment methods are accepted for XCKU5P-1FFVD900I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU5P-1FFVD900I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU5P-1FFVD900I?
XCKU5P-1FFVD900I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU5P-1FFVD900I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU5P-1FFVD900I?
For technical support, including XCKU5P-1FFVD900I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU5P-1FFVD900I requirements.
6.How does Aetrix verify that XCKU5P-1FFVD900I is sourced from the original manufacturer or authorized distributors?
All XCKU5P-1FFVD900I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU5P-1FFVD900I meets industry standards.
7.What is the process for return or replacement of XCKU5P-1FFVD900I?
All XCKU5P-1FFVD900I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU5P-1FFVD900I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU5P-1FFVD900I part is unused and in its original packaging.
Return procedure for XCKU5P-1FFVD900I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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