AMD XCKU5P-1SFVB784E

Overview

XCKU5P-1SFVB784E from AMD is a Kintex UltraScale+ FPGA featuring 443K logic cells, 28.8 Mb of block RAM, 2,520 DSP slices, and 48 transceivers supporting up to 32.75 Gb/s. It is housed in a 784-pin flip-chip BGA (FCBGA) package with 0.8 mm pitch and operates at -40°C to +100°C junction temperature.

For engineers reviewing the XCKU5P-1SFVB784E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver speed grade, I/O bank voltage support (1.2 V to 1.8 V), thermal design power (TDP = 29.5 W), and PCIe Gen4 x16 root complex capability.

Technical Context

The XCKU5P-1SFVB784E implements a heterogeneous architecture with programmable logic, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 controller), and high-speed serial transceivers using 16 nm FinFET process technology. It supports multi-standard SerDes operation including CPRI, JESD204B/C, and SATA.

Configuration is performed via quad-SPI, BPI, or JTAG; bitstream encryption and HMAC authentication are integrated for secure boot. The device includes dedicated clock management tiles with MMCM and PLL resources for low-jitter clock synthesis and distribution.

Key Specifications

Pinout & Package

Package: 784-pin Flip-Chip BGA (FCBGA), 23 mm × 23 mm, 0.8 mm pitch, RoHS-compliant, thermal lid.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XCKU15P-2SFVB784E and XCKU3P-1SFVA784E, the XCKU5P-1SFVB784E delivers balanced performance for mid-tier 100G/PCIe Gen4 systems-offering sufficient logic and transceiver resources without over-provisioning power or cost.

Availability

XCKU5P-1SFVB784E is available at Aetrix Electronics and suitable for 5G infrastructure, AI edge accelerators, and medical imaging systems requiring stable component supply across long production lifecycles.

Supply support for XCKU5P-1SFVB784E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and client markets with leadership in FPGA, CPU, GPU, and adaptive SoC technologies.

The Kintex UltraScale+ family targets high-throughput, low-latency applications in wired/wireless communications, test equipment, and real-time imaging where performance-per-watt and integration of hardened IP are critical.

FAQ

What is the maximum supported data rate per transceiver in XCKU5P-1SFVB784E?

The XCKU5P-1SFVB784E supports up to 32.75 Gb/s per transceiver lane using the GTH transceiver architecture. This enables native compliance with PCIe Gen4, 100G Ethernet (4×25G), and JESD204C. The actual achievable rate depends on board layout, reference clock stability, and signal integrity margin; full-rate operation requires AC-coupled differential routing with 85 Ω characteristic impedance.

Does XCKU5P-1SFVB784E include a hard processor system (PS)?

No, the XCKU5P-1SFVB784E is a fabric-only FPGA and does not integrate a hard ARM processor subsystem. It belongs to the Kintex UltraScale+ "F" series, which lacks the Zynq-style PS. For designs requiring integrated ARM cores, AMD offers the Zynq UltraScale+ MPSoC family; the XCKU5P-1SFVB784E relies on external processors or soft-core implementations within its programmable logic.

What I/O standards are supported by the HP I/O banks in XCKU5P-1SFVB784E?

The HP I/O banks in XCKU5P-1SFVB784E support LVDS, SSTL-12/15/18, HSTL-I/II, MIPI D-PHY, and TMDS. These banks operate at 1.2 V to 1.8 V and are optimized for high-speed interfaces such as DDR4 memory, PCIe Gen4, and display links. Each HP bank includes dedicated differential termination and programmable output drive strength up to 24 mA.

Is bitstream encryption supported on XCKU5P-1SFVB784E?

Yes, XCKU5P-1SFVB784E supports AES-256 bitstream encryption and HMAC-SHA256 authentication for secure configuration. Bitstream encryption prevents reverse engineering and unauthorized cloning. Keys are stored in on-chip eFUSE or external flash with encrypted key storage; secure boot flow validates authenticity before loading configuration into the FPGA fabric.

What is the thermal design power (TDP) of XCKU5P-1SFVB784E under typical operating conditions?

The thermal design power (TDP) of XCKU5P-1SFVB784E is 29.5 W at junction temperature of 100°C, based on worst-case utilization of logic, DSP, and transceivers. This value guides heatsink sizing and airflow requirements. Actual power consumption varies with design utilization, clock frequency, and I/O activity; AMD's Vivado Power Estimator provides accurate dynamic power modeling for specific implementations of XCKU5P-1SFVB784E.