AMD XCKU5P-1SFVB784I

Overview

XCKU5P-1SFVB784I from AMD is a Kintex UltraScale+ FPGA featuring 327,200 logic cells, 1,440 DSP slices, and 28.2 Mb of block RAM, packaged in a 784-pin Flip-Chip Ball Grid Array (FCBGA) with 0.8 mm pitch; it targets high-throughput data processing in 5G baseband and radar signal conditioning systems.

For engineers reviewing the XCKU5P-1SFVB784I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 1.8 V), transceiver line rates up to 32.75 Gb/s, thermal design power of 29.5 W, and industrial temperature grade (-40°C to +100°C).

Technical Context

The XCKU5P-1SFVB784I implements a heterogeneous architecture with programmable logic fabric, hardened 32.75 Gb/s GTY transceivers, and integrated ARM Cortex-R5F processors for real-time control. It supports PCI Express Gen4 x16, DDR4-2400 memory interfaces, and IEEE 1588 timestamping for deterministic timing.

Configuration occurs via quad-SPI or BPI flash, with bitstream encryption using AES-256 and HMAC authentication. The device includes dedicated clock management tiles with MMCM and PLL resources supporting jitter below 150 fs RMS over 12 kHz–20 MHz.

Key Specifications

Pinout & Package

Package: 784-pin Flip-Chip Ball Grid Array (FCBGA), 23 mm × 23 mm, 0.8 mm ball pitch, RoHS-compliant, thermal lid-equipped.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XCKU5P-1SFVB784I, the XCKU5P-2FFVD900E offers tighter timing margins at higher junction temperatures, while the XCKU15P-1FFVD900I delivers 2.3× more logic and 1.8× more DSP for scalable algorithm partitioning-both retain identical GTY transceiver behavior and PCIe Gen4 hard IP compatibility.

Availability

XCKU5P-1SFVB784I is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar systems, and high-speed test instrumentation requiring stable component supply across multi-year production cycles.

Supply support for XCKU5P-1SFVB784I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, embedded, and client applications.

The XCKU5P-1SFVB784I belongs to the Kintex UltraScale+ family, engineered for high-bandwidth, low-latency signal processing in communications and defense systems where power efficiency and deterministic timing are critical.

FAQ

What is the maximum supported transceiver line rate for the XCKU5P-1SFVB784I?

The XCKU5P-1SFVB784I supports a maximum transceiver line rate of 32.75 Gb/s using its hardened GTY transceivers. This enables compliance with 100G Ethernet, CPRI Option 8, and JESD204C standards. The device achieves this rate with adaptive equalization and built-in PRBS pattern generation for link validation. All GTY channels on the XCKU5P-1SFVB784I are rated for this speed under industrial temperature conditions.

Does the XCKU5P-1SFVB784I include an integrated processor subsystem?

Yes, the XCKU5P-1SFVB784I integrates a dual-core ARM Cortex-R5F processor subsystem with 256 KB tightly coupled memory (TCM) and AXI coherency. This subsystem operates independently of the programmable logic and supports real-time control tasks such as configuration management, peripheral interface handling, and safety monitoring. The R5F cores are accessible via the XCKU5P-1SFVB784I's PS-PL interface and run at up to 600 MHz.

What I/O standards does the XCKU5P-1SFVB784I support?

The XCKU5P-1SFVB784I supports LVDS, SSTL, HSTL, MIPI D-PHY, and differential signaling standards across its I/O banks, with per-bank voltage ranging from 1.2 V to 1.8 V. Each bank can be configured independently, enabling mixed-voltage interfaces such as DDR4-2400 (1.2 V) alongside 1.8 V LVDS SerDes links. The XCKU5P-1SFVB784I also provides programmable slew rate and drive strength per pin group for signal integrity optimization.

Is the XCKU5P-1SFVB784I qualified for industrial temperature operation?

Yes, the XCKU5P-1SFVB784I is specified for industrial temperature operation from -40°C to +100°C (junction temperature). It undergoes full characterization and screening across this range, including timing closure, transceiver eye diagrams, and configuration reliability tests. The XCKU5P-1SFVB784I's thermal lid and FCBGA package support conduction-cooled mounting in sealed enclosures typical of outdoor 5G radio units and avionics systems.

How is configuration security implemented in the XCKU5P-1SFVB784I?

The XCKU5P-1SFVB784I implements configuration security using AES-256 bitstream encryption and HMAC-SHA256 authentication. Encrypted bitstreams are decrypted on-chip using keys stored in eFUSE or external secure memory. The XCKU5P-1SFVB784I validates authenticity before loading configuration data, preventing tampering or cloning. This security flow is enabled during bitstream generation in Vivado and enforced at every power-on or PROGRAM_B assertion.