AMD XCKU5P-2FFVA676E

Overview

XCKU5P-2FFVA676E from AMD is a high-performance Kintex UltraScale+ FPGA featuring 422K logic cells, 28.8 Mb of block RAM, and support for PCIe Gen4 x16, DDR4-2400, and 25.8 Gb/s transceivers. It is deployed in high-bandwidth data acceleration and real-time signal processing systems requiring deterministic latency and hardware-level parallelism.

For engineers reviewing the XCKU5P-2FFVA676E datasheet, pinout, applications, or equivalent options, key selection factors include I/O bank voltage flexibility (1.2 V to 1.8 V), transceiver lane count (56 GTY), thermal design power (TDP = 39 W), and package-specific routing constraints for FFVA676.

Technical Context

The XCKU5P-2FFVA676E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including PCIe Gen4 root port/endpoint, 100G Ethernet MAC, and UltraScale+ DSP slices optimized for 27×18 signed integer multiply-accumulate operations. It supports partial reconfiguration and AXI4-Stream interfaces for dynamic function swapping.

Configuration is performed via quad-SPI flash or JTAG, with bitstream encryption using AES-256 and HMAC-SHA256 authentication. The device operates across industrial temperature range (–40°C to +100°C) and meets JEDEC JESD8-12A I/O standards.

Key Specifications

Pinout & Package

Package: 676-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVA676), 27 × 27 mm, 0.8 mm pitch, RoHS-compliant, thermal lid integrated.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XCKU5P-2FFVA676E, the XCKU15P offers greater computational headroom at higher power, while the XCKU3P delivers identical serial I/O and memory bandwidth in a thermally lighter, more economical package-enabling scalable design reuse across performance tiers.

Availability

XCKU5P-2FFVA676E is available at Aetrix Electronics and suitable for 5G infrastructure, medical imaging systems, and high-frequency trading platforms requiring stable component supply and long-term lifecycle assurance.

Supply support for XCKU5P-2FFVA676E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing adaptive computing platforms for data center, embedded, and client applications.

The Kintex UltraScale+ family targets high-throughput, low-latency applications in wired communications, test equipment, and real-time processing where hardened IP and predictable timing closure are critical.

FAQ

What is the maximum supported DDR4 data rate for XCKU5P-2FFVA676E?

The XCKU5P-2FFVA676E supports DDR4 memory interfaces up to 2400 MT/s across four independent memory controller banks. This capability is implemented using dedicated hard memory controller IP, not soft logic, ensuring timing closure and signal integrity compliance without custom PHY design. XCKU5P-2FFVA676E achieves this rate with standard 1.2 V DDR4 signaling and supports both x8 and x16 configurations per bank.

Does XCKU5P-2FFVA676E include hardened PCIe Gen4 support?

Yes, XCKU5P-2FFVA676E integrates a hardened PCIe Gen4 x16 endpoint/root complex controller. It complies fully with PCI Express Base Specification Rev 4.0 and supports Advanced Error Reporting (AER), Message Signaled Interrupts (MSI-X), and ASPM L0s/L1 power states. XCKU5P-2FFVA676E does not require external retimers or protocol converters for Gen4 operation.

What transceiver technology is used in XCKU5P-2FFVA676E?

XCKU5P-2FFVA676E uses GTY transceivers capable of 25.8 Gb/s line rates with built-in PRBS generation/checking, eye diagram monitoring, and adaptive equalization. These transceivers support protocols including 100G Ethernet (CAUI-4), CPRI, and JESD204B/C. XCKU5P-2FFVA676E provides 56 GTY quads, each configurable as two independent 25.8 Gb/s lanes or one 51.5 Gb/s lane.

Is partial reconfiguration supported on XCKU5P-2FFVA676E?

Yes, XCKU5P-2FFVA676E supports dynamic partial reconfiguration (PR) through Vivado Design Suite tools. This allows designated logic regions to be updated at runtime without affecting other active functions. XCKU5P-2FFVA676E requires specific placement constraints and checkpoint-based bitstream generation, and PR is validated for industrial temperature operation per Xilinx UG909.

What is the thermal design power (TDP) rating for XCKU5P-2FFVA676E?

The XCKU5P-2FFVA676E has a specified thermal design power (TDP) of 39 W under typical operating conditions defined in AMD DS923. This value represents the maximum sustained power dissipation requiring active thermal management. XCKU5P-2FFVA676E TDP assumes worst-case logic utilization, memory traffic, and transceiver activity at junction temperature of 100°C.