AMD XCKU5P-2FFVB676E

Overview

XCKU5P-2FFVB676E from AMD is a Kintex UltraScale+ FPGA featuring 443K logic cells, 28.8 Mb of block RAM, and 2,640 DSP slices, configured in a 676-pin FCBGA package with 0.8 mm pitch and -2 speed grade for high-performance compute-accelerated data center workloads.

For engineers reviewing the XCKU5P-2FFVB676E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver count (32 GTY lanes), I/O voltage support (1.2 V to 1.8 V), thermal design power (39 W typical), and PCIe Gen4 x16 endpoint capability.

Technical Context

The XCKU5P-2FFVB676E implements a heterogeneous architecture integrating programmable logic, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 controller), and multi-rate GTY transceivers operating up to 32.75 Gbps. It supports AXI4-Stream and AXI4-Lite interfaces for system interconnect.

Configuration occurs via quad-SPI flash or JTAG, with secure boot enabled through AES-256 decryption and HMAC authentication. The device targets deterministic latency applications requiring sub-100 ns interrupt response and real-time DMA channel arbitration.

Key Specifications

Pinout & Package

Package: 676-pin Fine-Pitch Flip-Chip Ball Grid Array (FFVB), 27×27 mm body, 0.8 mm ball pitch, RoHS-compliant, lead-free, with thermal lid.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based acceleration applications.

Compared with XCKU5P-2FFVB676E, the XCKU15P offers greater scalability for memory-intensive workloads but demands more board area and cooling; the XCKU3P reduces BOM cost and power at the expense of transceiver count and logic capacity-making it suitable for tiered deployment architectures.

Availability

XCKU5P-2FFVB676E is available at Aetrix Electronics and suitable for AI inference acceleration, SmartNIC development, 5G baseband prototyping, and high-frequency trading systems requiring stable component supply across multi-year production cycles.

Supply support for XCKU5P-2FFVB676E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and client markets with emphasis on performance-per-watt and heterogeneous integration.

The Kintex UltraScale+ family delivers balanced logic, memory, and I/O resources for mid-range acceleration applications where cost, power, and performance must be tightly optimized-targeting cloud infrastructure, wired/wireless communications, and real-time signal processing.

FAQ

What is the maximum supported data rate for GTY transceivers on the XCKU5P-2FFVB676E?

The XCKU5P-2FFVB676E supports GTY transceivers operating up to 32.75 Gbps per lane. This rate is validated for PAM4 signaling in 100G Ethernet applications and NRZ mode for PCIe Gen4 and 32G Fibre Channel. The transceiver specification is documented in the UltraScale+ GTY Transceiver User Guide (UG578 v1.12).

Does the XCKU5P-2FFVB676E include a hardened PCIe Gen4 controller?

Yes, the XCKU5P-2FFVB676E integrates a hardened PCIe Gen4 x16 endpoint block. It supports link training, ASPM, SR-IOV, and Address Translation Services (ATS) without consuming programmable logic resources. Configuration space access and MSI-X vector handling are implemented in dedicated hardware.

What I/O standards are supported by the HP I/O banks of the XCKU5P-2FFVB676E?

The HP I/O banks of the XCKU5P-2FFVB676E support SSTL-12, SSTL-15, HSTL-I, HSTL-II, and differential standards including LVDS, BLVDS, and RSDS. These banks are electrically optimized for DDR4 memory interfaces and high-speed serial links, with programmable output drive strength and input termination.

Can the XCKU5P-2FFVB676E perform partial reconfiguration?

Yes, the XCKU5P-2FFVB676E supports dynamic partial reconfiguration (DPR) using the ICAP and FRAME_ECC primitives. Reconfigurable partitions can be swapped at runtime without resetting the entire device, enabling application-specific function updates-for example, switching between different CNN models in an AI inference pipeline.

What is the thermal design power (TDP) rating for the XCKU5P-2FFVB676E under typical operating conditions?

The XCKU5P-2FFVB676E has a typical thermal design power (TDP) of 39 W when operating at 250 MHz system clock frequency with full logic utilization and active GTY transceivers. This value assumes junction temperature ≤ 100°C and ambient temperature of 85°C, per AMD's Kintex UltraScale+ Data Sheet (DS923 v1.15).