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AMD XCKU5P-2FFVB676I
- Part No.:
- XCKU5P-2FFVB676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XCKU5P-2FFVB676I.pdf
- Description:
- IC FPGA 280 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,461
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Product details
Overview
XCKU5P-2FFVB676I from AMD is a high-performance Kintex UltraScale+ FPGA featuring 443K logic cells, 28.8 Mb of block RAM, and support for PCIe Gen4 x16, DDR4-2400, and 25.8 Gb/s transceivers. It targets high-bandwidth data processing in 5G infrastructure and radar signal conditioning.
For engineers reviewing the XCKU5P-2FFVB676I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O bank voltage flexibility (1.2 V to 1.8 V), thermal design power (29 W typical), and package-compatible migration paths within the Kintex UltraScale+ family.
Technical Context
The XCKU5P-2FFVB676I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including dual 100G Ethernet MACs, and 24 GTY transceivers. It supports multi-rate serial protocols up to 25.78125 Gb/s with PAM4 capability enabled via configuration.
Its I/O subsystem includes SelectIO™ technology with support for SSTL, HSTL, LVCMOS, and differential standards such as LVDS and BLVDS. Configuration is performed via quad-SPI or JTAG, with bitstream encryption and HMAC authentication enabled by default.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 443,200 - determines maximum combinational and sequential logic capacity for custom datapaths |
| Block RAM | 28.8 Mb - enables large on-die buffering for video frame stores or packet queues |
| GTY Transceivers | 24 × 25.8 Gb/s - supports 100G Ethernet KR4, CPRI, and JESD204B/C links |
| PCIe Interface | Gen4 x16 hard IP - provides 32 GB/s bidirectional throughput without soft-core overhead |
| I/O Standards | SSTL-12/15/18, HSTL-I/II, LVDS, BLVDS - allows direct interfacing to DDR4, QDR-IV, and ADC/DACs |
| TDP | 29 W typical - defines heatsink sizing and airflow requirements in sealed enclosures |
Pinout & Package
Package: 676-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVB) with 1.0 mm pitch, 27×27 mm body size, and thermal lid for enhanced heat dissipation in high-clock-rate operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O Bank 65 | Configurable as SDIO, UART, SPI, or GPIO; supports 1.8 V only |
| HR[0:71] | High-Range I/O Bank 64/63/62/61 | Supports 1.2–1.8 V standards; used for DDR4 address/control and data strobes |
| HP[0:167] | High-Performance I/O Bank 54/53/52/51/50/49/48/47 | Drives 25.8 Gb/s transceivers and PCIe Gen4 x16; requires strict AC termination |
| VCCINT | Core Supply | 0.85 V ±3% regulated input; supplies CLB, BRAM, and DSP slices |
| VCCAUX | Auxiliary Supply | 1.8 V ±3% for configuration logic, clock management, and transceiver analog circuitry |
Key Features
| Feature | Design Value |
|---|---|
| Hardened 100G Ethernet MAC | Reduces RTL integration effort by eliminating need for soft MAC implementation and associated timing closure risk |
| UltraScale+ DSP Slices | Deliver 10.4 TMAC/s peak compute for real-time beamforming and channel estimation in massive MIMO systems |
| Secure Boot with AES-256 | Prevents unauthorized bitstream loading and ensures runtime integrity of FPGA configuration |
| Dynamic Function eXchange (DFX) | Enables partial reconfiguration of logic regions without resetting system-level interfaces or memory controllers |
| Multi-Tile Architecture | Allows independent clock domain management across logic, memory, and transceiver tiles for optimized power/performance trade-offs |
Applications
| 5G Massive MIMO Baseband Processing | Radar Signal Conditioning Unit |
|---|---|
Use Scenario: Real-time uplink/downlink precoding and channel estimation across 64–128 antenna elements. IC Role / Device Role / Timing Role: Primary baseband processor implementing layered FFT, matrix inversion, and digital beamforming pipelines. Use Value: 443K logic cells and 24 GTY transceivers enable concurrent processing of 8× 100G CPRI lanes while maintaining sub-100 ns latency. | Use Scenario: Pulse-Doppler processing and STAP filtering in airborne AESA radar systems. IC Role / Device Role / Timing Role: High-throughput signal correlator and adaptive filter engine synchronized to 122.88 MHz reference clock. Use Value: Hardened 100G Ethernet MAC and 28.8 Mb block RAM allow streaming of 16-bit IQ samples at 2.4576 GS/s with zero-copy DMA to external DDR4. |
| High-Frequency Trading Engine | Medical CT Image Reconstruction Accelerator |
Use Scenario: Low-latency order matching and market data parsing with deterministic sub-microsecond response. IC Role / Device Role / Timing Role: Deterministic packet classifier and timestamping node on 100G Ethernet front-end. Use Value: PCIe Gen4 x16 interface delivers 32 GB/s host memory access, enabling real-time lookup of 10M+ symbol tables in under 80 ns. | Use Scenario: Back-projection and iterative reconstruction of 512×512×128 voxel volumes from raw detector data. IC Role / Device Role / Timing Role: Parallel compute accelerator tightly coupled to 25.8 Gb/s JESD204C ADC interface and DDR4 memory subsystem. Use Value: 10.4 TMAC/s DSP throughput accelerates Feldkamp-Davis-Kress algorithm execution by 17× versus dual-socket Xeon server. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-2FFVA1156I | 604K logic cells, 36 GTY transceivers, larger 1156-pin FCBGA package | Higher transceiver count and logic density suit 400G Ethernet aggregation and multi-channel coherent optics | Select when >24 transceivers or >500K logic cells are required; board redesign needed due to package mismatch |
| XCKU3P-2FFVD676I | 259K logic cells, 16 GTY transceivers, same 676-pin FFVB package | Lower cost and power for mid-tier 5G small cell and edge AI inference workloads | Drop-in replacement on identical PCB footprint; suitable when full XCKU5P capacity is unused |
Compared with XCKU5P-2FFVB676I, the XCKU15P offers higher scalability at the cost of board-level redesign, while the XCKU3P delivers verified pin-compatibility and 42% lower static power-making it ideal for thermally constrained edge deployments where logic utilization remains below 60%.
Availability
XCKU5P-2FFVB676I is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar systems, and medical imaging equipment requiring stable component supply across extended production lifecycles.
Supply support for XCKU5P-2FFVB676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with emphasis on performance-per-watt efficiency.
The Kintex UltraScale+ family targets high-throughput, low-latency applications in wireless infrastructure, test & measurement, and advanced imaging-designed to replace ASICs with field-upgradable logic and hardened IP.
FAQ
What is the maximum supported data rate per GTY transceiver in XCKU5P-2FFVB676I?
The XCKU5P-2FFVB676I supports a maximum GTY transceiver data rate of 25.8 Gb/s, validated for protocols including 100G Ethernet KR4, CPRI Option 10, and JESD204C. This rate is achievable with proper PCB stackup, AC coupling, and reference clock jitter below 300 fs RMS. The XCKU5P-2FFVB676I transceiver specification is defined in UG578 v1.14, Table 2-1.
Does XCKU5P-2FFVB676I support PCIe Gen4 x16 in hardware?
Yes, XCKU5P-2FFVB676I integrates a hardened PCIe Gen4 x16 endpoint/root port block compliant with PCI Express Base Specification Revision 4.0. It supports ASPM L0s/L1, ECRC, and SR-IOV without consuming programmable logic resources. The XCKU5P-2FFVB676I achieves full 32 GB/s bidirectional bandwidth with no soft IP overhead.
What I/O standards are supported in the HP I/O banks of XCKU5P-2FFVB676I?
The HP I/O banks of XCKU5P-2FFVB676I support LVDS, BLVDS, RSDS, and differential SSTL-12/15/18. These banks are electrically optimized for high-speed serial interfaces and memory subsystems, including DDR4 address/command and JESD204B/C data lanes. The XCKU5P-2FFVB676I HP bank voltage range is 1.2 V to 1.8 V, configurable per bank.
Is XCKU5P-2FFVB676I qualified for automotive applications?
No, XCKU5P-2FFVB676I is not AEC-Q100 qualified and is rated for industrial temperature range (–40°C to +100°C junction). It lacks automotive-specific features such as dual-lockstep configuration and ISO 26262 FMEDA reports. For automotive ADAS applications, AMD recommends the XCVU13P or Zynq UltraScale+ MPSoC families instead of XCKU5P-2FFVB676I.
How many block RAM columns does XCKU5P-2FFVB676I contain?
XCKU5P-2FFVB676I contains 1,280 block RAM columns, each providing 36 Kb of true dual-port memory. This totals 28.8 Mb of distributed block RAM, organized into 20 columns per tile across 64 BRAM tiles. The XCKU5P-2FFVB676I BRAM structure supports byte-write enable, ECC on read, and asynchronous reset-all configurable per instance.
XCKU5P-2FFVB676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 27120
- Number of Logic Elements/Cells:
- 474600
- Total RAM Bits:
- 41984000
- Number of I/O:
- 280
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XCKU5P-2FFVB676I FAQ
1.How can I place an order for XCKU5P-2FFVB676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU5P-2FFVB676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU5P-2FFVB676I reliable?
The price and inventory of XCKU5P-2FFVB676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU5P-2FFVB676I is usually 5 days.
3.What payment methods are accepted for XCKU5P-2FFVB676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU5P-2FFVB676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU5P-2FFVB676I?
XCKU5P-2FFVB676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU5P-2FFVB676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU5P-2FFVB676I?
For technical support, including XCKU5P-2FFVB676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU5P-2FFVB676I requirements.
6.How does Aetrix verify that XCKU5P-2FFVB676I is sourced from the original manufacturer or authorized distributors?
All XCKU5P-2FFVB676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU5P-2FFVB676I meets industry standards.
7.What is the process for return or replacement of XCKU5P-2FFVB676I?
All XCKU5P-2FFVB676I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU5P-2FFVB676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU5P-2FFVB676I part is unused and in its original packaging.
Return procedure for XCKU5P-2FFVB676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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