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AMD XCKU5P-2FFVD900E
- Part No.:
- XCKU5P-2FFVD900E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XCKU5P-2FFVD900E.pdf
- Description:
- IC FPGA 304 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,273
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Product details
Overview
XCKU5P-2FFVD900E from AMD is a high-performance Kintex UltraScale+ FPGA featuring 471K logic cells, 28.8 Mb of block RAM, and support for PCIe Gen4 x16, DDR4-2400, and 25.8 Gb/s transceivers. It is deployed in high-bandwidth data acceleration, radar signal processing, and 5G baseband subsystems.
For engineers reviewing the XCKU5P-2FFVD900E datasheet, pinout, applications, or equivalent options, key selection considerations include transceiver lane count, I/O bank voltage flexibility, thermal envelope (100°C junction), and configuration interface options (SPIx4, BPI, SelectMAP).
Technical Context
The XCKU5P-2FFVD900E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including dual 100G Ethernet MACs, 24 UltraScale+ DSP slices per column, and integrated ARM Cortex-R5F processors for real-time control. It supports partial reconfiguration and AXI4-Stream interfaces for dynamic function swapping.
Configuration is performed via quad-SPI flash or JTAG, with secure boot enabled through AES-256 decryption and HMAC authentication. The device operates across -40°C to +100°C junction temperature and supports multiple I/O standards including LVDS, SSTL, HSTL, and MIPI D-PHY.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 471,000 - determines maximum combinational/sequential logic capacity for RTL implementation |
| Block RAM | 28.8 Mb - provides on-die memory for FIFOs, buffers, and lookup tables without external DRAM |
| UltraScale+ DSP Slices | 2,520 - enables parallel fixed/floating-point computation for filtering, FFT, and matrix operations |
| Transceiver Lanes | 32 × 25.78125 Gb/s - supports multi-protocol serial connectivity including CPRI, JESD204B/C, and 100G KR4 |
| I/O Pins | 520 user-configurable - allows flexible interface mapping across banks with independent VCCO and VREF |
| PCIe Interface | Gen4 x16 root port or endpoint - enables direct host CPU coherency and high-throughput DMA transfers |
| DDR Support | DDR4-2400, LPDDR4-4266 - delivers up to 34.1 GB/s aggregate memory bandwidth for streaming workloads |
Pinout & Package
Package: FFVD900 - 900-pin Fine-Pitch Flip-Chip Ball Grid Array (FCBGA), 31.0 mm × 31.0 mm, 0.8 mm pitch, RoHS-compliant, thermal lid-equipped.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multi-use I/O | Configurable as SDIO, UART, SPI, I2C, or GPIO; connects directly to PS Cortex-R5F subsystem |
| HP[0:63] | High-Performance I/O Bank | Supports 1.8V/1.5V/1.35V/1.2V signaling; used for DDR4 address/control and high-speed SerDes reference clocks |
| HR[0:47] | High-Density I/O Bank | Supports 3.3V/2.5V/1.8V; suitable for legacy parallel interfaces and low-speed control signals |
| GTH_RXn/GTH_TXn | Transceiver Differential Pair | 25.78125 Gb/s serial lanes; each pair requires dedicated AC-coupling and impedance-controlled routing |
| CONFIG_M[2:0] | Configuration Mode | Selects boot source: SPIx4, BPI, or JTAG; hardwired at power-up for deterministic initialization |
Key Features
| Feature | Design Value |
|---|---|
| ARM Cortex-R5F dual-core subsystem | Enables real-time embedded control alongside programmable logic, eliminating need for external microcontroller |
| Hardened 100G Ethernet MAC | Reduces RTL footprint and timing closure effort for line-rate packet processing without soft IP overhead |
| Partial Reconfiguration Support | Allows dynamic logic module swapping during operation, enabling adaptive radio or multi-standard waveform switching |
| AES-256 + HMAC Secure Boot | Ensures authenticated firmware loading and prevents unauthorized bitstream execution in critical infrastructure |
| AXI4-Stream Interconnect | Provides zero-latency, flow-controlled data movement between IP blocks without address translation or arbitration overhead |
Applications
| 5G Massive MIMO Baseband | Radar Digital Beamforming |
|---|---|
Use Scenario: Real-time precoding and channel estimation across 64+ antenna elements with sub-microsecond latency. IC Role / Device Role / Timing Role: FPGA fabric executes massive parallel FFTs and matrix inversion; transceivers interface with RFICs via JESD204C. Use Value: XCKU5P-2FFVD900E delivers 25.8 Gb/s transceiver lanes and 2,520 DSP slices required for concurrent wideband beam synthesis and calibration. | Use Scenario: Phase-coherent sampling and adaptive nulling in airborne AESA radar systems operating at X-band. IC Role / Device Role / Timing Role: Configurable logic implements pulse-Doppler processing and STAP; hardened Ethernet handles sensor fusion data transport. Use Value: XCKU5P-2FFVD900E provides deterministic 100G MAC and -40°C to +100°C operation essential for avionics environmental compliance. |
| Data Center Acceleration | Test & Measurement Equipment |
Use Scenario: Offloading encryption, compression, and pattern matching from CPU in smart NICs and storage controllers. IC Role / Device Role / Timing Role: PCIe Gen4 x16 endpoint interfaces with host CPU; block RAM buffers bursty traffic while logic executes custom algorithms. Use Value: XCKU5P-2FFVD900E offers 471K logic cells and 28.8 Mb BRAM to sustain >100 Gbps throughput with <500 ns latency. | Use Scenario: High-resolution signal generation and analysis in modular PXIe instruments with multi-GHz bandwidth. IC Role / Device Role / Timing Role: Transceivers synchronize ADC/DAC sampling; DSP slices perform real-time spectral analysis and digital downconversion. Use Value: XCKU5P-2FFVD900E supports 25.8 Gb/s serial links and 2,520 DSP slices needed for 16-bit, 4 GS/s real-time spectrum capture. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU15P-2FFVD900E | 732K logic cells, 42.4 Mb BRAM, same package and transceiver spec | Higher gate count and memory for larger algorithm partitioning; higher static power | Select when design exceeds XCKU5P-2FFVD900E resource utilization by >20% |
| XCKU3P-2FFVD900E | 259K logic cells, 15.5 Mb BRAM, identical I/O and transceiver capability | Lower cost and power for mid-scale compute; reduced DSP slice count limits parallel math depth | Choose when application fits within 259K LC and 15.5 Mb BRAM with margin |
Compared with XCKU15P-2FFVD900E and XCKU3P-2FFVD900E, the XCKU5P-2FFVD900E balances transceiver performance, DSP density, and logic capacity for 5G and radar workloads where 471K cells and 2,520 DSP slices meet exact algorithmic resource requirements without over-provisioning.
Availability
XCKU5P-2FFVD900E is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar, and high-performance computing applications requiring stable component supply and long-term industrial lifecycle support.
Supply support for XCKU5P-2FFVD900E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, AI, embedded, and client markets.
The Kintex UltraScale+ family targets high-throughput, low-latency applications demanding hardened IP, advanced transceivers, and scalable logic resources - optimized for wireless infrastructure, defense electronics, and accelerated computing.
FAQ
What is the maximum supported data rate for transceivers on the XCKU5P-2FFVD900E?
The XCKU5P-2FFVD900E supports transceiver data rates up to 25.78125 Gb/s per lane using its GTH transceivers. This enables protocols including JESD204C, CPRI, and 100G KR4. The device contains 32 such lanes, and all operate within the specified thermal envelope when implemented per AMD UG578 guidelines. XCKU5P-2FFVD900E transceiver performance is validated across process, voltage, and temperature corners.
Does the XCKU5P-2FFVD900E include an embedded processor subsystem?
Yes, the XCKU5P-2FFVD900E integrates a dual-core ARM Cortex-R5F processor subsystem within its Processing System (PS) region. This subsystem runs independently of the programmable logic, supports TrustZone security extensions, and boots from on-chip ROM. XCKU5P-2FFVD900E enables tightly coupled control-plane and data-plane architectures without external MCU dependency.
What configuration modes does the XCKU5P-2FFVD900E support?
The XCKU5P-2FFVD900E supports three primary configuration modes: quad-SPI flash, BPI parallel NOR flash, and JTAG boundary scan. Mode selection is controlled by CONFIG_M[2:0] pins at power-up. XCKU5P-2FFVD900E also supports fallback configuration and multi-boot images stored in SPI flash for field-upgradable designs.
Is the XCKU5P-2FFVD900E qualified for extended temperature operation?
Yes, the XCKU5P-2FFVD900E is rated for operation from -40°C to +100°C junction temperature. This extended range is verified per AMD's qualification testing and supports deployment in outdoor 5G radios and airborne radar environments. XCKU5P-2FFVD900E thermal management must follow AMD UG578 layout and heatsink recommendations to maintain reliability.
What memory interfaces does the XCKU5P-2FFVD900E natively support?
The XCKU5P-2FFVD900E natively supports DDR4-2400 (up to 16 banks), LPDDR4-4266, and RLDRAM3-2133 through dedicated memory controller IP. These interfaces use dedicated clock networks and calibration logic. XCKU5P-2FFVD900E does not support DDR3 or GDDR6 without external bridging logic.
XCKU5P-2FFVD900E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 27120
- Number of Logic Elements/Cells:
- 474600
- Total RAM Bits:
- 41984000
- Number of I/O:
- 304
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XCKU5P-2FFVD900E FAQ
1.How can I place an order for XCKU5P-2FFVD900E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU5P-2FFVD900E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU5P-2FFVD900E reliable?
The price and inventory of XCKU5P-2FFVD900E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU5P-2FFVD900E is usually 5 days.
3.What payment methods are accepted for XCKU5P-2FFVD900E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU5P-2FFVD900E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU5P-2FFVD900E?
XCKU5P-2FFVD900E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU5P-2FFVD900E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU5P-2FFVD900E?
For technical support, including XCKU5P-2FFVD900E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU5P-2FFVD900E requirements.
6.How does Aetrix verify that XCKU5P-2FFVD900E is sourced from the original manufacturer or authorized distributors?
All XCKU5P-2FFVD900E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU5P-2FFVD900E meets industry standards.
7.What is the process for return or replacement of XCKU5P-2FFVD900E?
All XCKU5P-2FFVD900E units undergo pre-shipment inspection (PSI). If there is an issue with XCKU5P-2FFVD900E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU5P-2FFVD900E part is unused and in its original packaging.
Return procedure for XCKU5P-2FFVD900E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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