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AMD XCKU5P-2FFVD900I
- Part No.:
- XCKU5P-2FFVD900I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XCKU5P-2FFVD900I.pdf
- Description:
- IC FPGA 304 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,114
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Product details
Overview
XCKU5P-2FFVD900I from AMD is a high-performance Kintex UltraScale+ FPGA featuring 471K logic cells, 28.8 Mb of block RAM, and support for PCIe Gen4 x16, DDR4-2400, and 25.8 Gb/s transceivers. It is deployed in 5G radio units, high-speed test equipment, and radar signal processing systems where deterministic latency and multi-protocol I/O are critical.
For engineers reviewing the XCKU5P-2FFVD900I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O bank voltage flexibility, thermal performance under sustained 28W TDP, and configuration security options including AES-256 bitstream encryption.
Technical Context
The XCKU5P-2FFVD900I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DMA), and dual ARM Cortex-R5F processors for real-time control. It supports partial reconfiguration and dynamic function exchange across multiple SLRs.
Configuration occurs via quad-SPI, BPI, or JTAG; bitstream authentication uses HMAC-SHA-256 and decryption employs AES-256 with key storage in eFUSE. Power management includes per-rail monitoring and adaptive voltage scaling.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 471,200 – determines maximum combinational/sequential logic capacity for complex digital signal processing pipelines |
| Block RAM | 28.8 Mb – enables large on-die data buffering for FFT, filtering, and frame storage without external memory |
| Transceiver Speed | 25.78125 Gb/s – supports CPRI/eCPRI, JESD204B/C, and 100G KR4 interfaces with PRBS31 pattern generation |
| PCIe Interface | Gen4 x16 – delivers 32 GT/s bidirectional throughput for host-FPGA co-processing in compute-accelerated systems |
| I/O Standards | LVDS, MIPI D-PHY, SSTL, HSTL, TMDS – allows direct interfacing to ADCs, DACs, image sensors, and display controllers |
| TDP | 28 W – defines thermal design envelope requiring active cooling and careful PCB copper pour planning |
| Security | AES-256 + HMAC-SHA-256 – ensures authenticated, encrypted configuration to prevent cloning and reverse engineering |
Pinout & Package
The XCKU5P-2FFVD900I is housed in a 900-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVBGA) package with 1.0 mm ball pitch, designed for high-density routing and thermal dissipation via central thermal ball array.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O | Configurable as SDIO, UART, SPI, I2C, or GPIO; connects directly to PS-side peripherals |
| HR Bank 0–3 | High-Range I/O | Supports 1.8V/2.5V/3.3V signaling; used for DDR4 address/control and high-speed parallel interfaces |
| HP Bank 4–13 | High-Performance I/O | Supports 1.2V/1.35V/1.8V; optimized for transceiver reference clocks and SerDes lanes |
| GTH Transceivers | Serial I/O | 24 lanes operating up to 25.78125 Gb/s; each lane includes TX/RX termination and CDR |
| VCCINT/VCCAUX/VCCO | Power Rails | Dedicated supplies for core (0.85V), auxiliary (1.8V), and I/O (1.2–3.3V) domains with independent sequencing |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous Processing | Integrated dual-core ARM Cortex-R5F with lockstep capability for safety-critical real-time control alongside PL acceleration |
| Hardened IP Blocks | PCIe Gen4 x16, 100G Ethernet MAC, and 100G Interlaken controller reduce RTL integration effort and timing closure risk |
| Partial Reconfiguration | Enables dynamic logic swapping in operational systems-e.g., switching between 5G NR and LTE waveform engines without reset |
| Advanced Security | eFUSE-based key storage, AES-256 decryption, and HMAC-SHA-256 authentication prevent unauthorized bitstream loading and tampering |
| Thermal Management | On-die temperature sensor with ±2°C accuracy feeds closed-loop fan control and throttling logic for sustained 28W operation |
Applications
| 5G Massive MIMO Radio Unit | High-Speed Automated Test Equipment |
|---|---|
Use Scenario: Real-time beamforming matrix computation and CPRI/eCPRI fronthaul interface handling in outdoor base station radios. IC Role / Device Role / Timing Role: Primary programmable logic fabric executing channel estimation, precoding, and multi-antenna synchronization with sub-100 ns jitter. Use Value: 25.78 Gb/s transceivers eliminate external retimers; hardened PCIe Gen4 enables direct connection to server-class host controllers. | Use Scenario: Parallel stimulus-response validation of SoCs and ASICs at speeds up to 10 Gb/s using custom protocol stacks. IC Role / Device Role / Timing Role: High-fidelity pattern generator and analyzer with deterministic timestamping and deep on-chip capture memory. Use Value: 28.8 Mb block RAM provides >1 ms full-rate capture at 10 Gb/s; LVDS and MIPI D-PHY I/O support direct probe-to-DUT connectivity. |
| Phased Array Radar Signal Processor | Industrial Vision Inspection System |
Use Scenario: Digital beam steering, pulse compression, and CFAR detection on airborne radar platforms with strict SWaP-C constraints. IC Role / Device Role / Timing Role: Real-time DSP accelerator offloading FFT, FIR filtering, and angle-of-arrival calculation from host processor. Use Value: 471K logic cells enable concurrent multi-beam processing; hardened 100G Interlaken handles sensor fusion data aggregation. | Use Scenario: Sub-millisecond defect classification on high-resolution CMOS image streams from production-line cameras. IC Role / Device Role / Timing Role: Low-latency image pipeline engine performing Bayer demosaic, noise reduction, and CNN inference acceleration. Use Value: Dual Cortex-R5F cores manage camera interface timing and trigger coordination; HP I/O banks interface directly to 12-bit ADCs and MIPI CSI-2 sensors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU5P-2FFVA900I | Same logic capacity and transceiver count but in FCBGA900 (flip-chip) vs FFVD900 (fine-pitch flip-chip); different thermal ball layout and solder mask definition | Targeted at legacy PCB designs using older AMD footprint libraries; lacks enhanced thermal dissipation features of FFVD variant | Select only when migrating existing FFVA900 designs; not drop-in compatible due to mechanical and thermal pad differences |
| XCKU15P-2FFVD900I | Higher logic density (742K cells), more transceivers (32 vs 24), and larger block RAM (42.2 Mb); identical FFVD900 package and pinout | Suitable for next-generation 5G DU/CU consolidation and AI-accelerated vision systems requiring additional compute headroom | Drop-in upgrade path with no PCB changes; requires updated power delivery and thermal design for 35W TDP |
Compared with XCKU5P-2FFVD900I, the XCKU15P-2FFVD900I offers scalable compute headroom within the same footprint, while the XCKU5P-2FFVA900I serves legacy layout reuse-neither replaces XCKU5P-2FFVD900I's balance of performance, power, and thermal optimization for new 5G and radar designs.
Availability
XCKU5P-2FFVD900I is available at Aetrix Electronics and suitable for 5G infrastructure, defense radar, and automated test equipment requiring stable component supply across long product lifecycles.
Supply support for XCKU5P-2FFVD900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company specializing in adaptive computing, graphics, and AI technologies, with leadership in FPGA, CPU, GPU, and adaptive SoC development.
The Kintex UltraScale+ family targets high-throughput, low-latency applications in wireless infrastructure, aerospace, and instrumentation-designed to deliver hardened IP, security, and scalability without sacrificing power efficiency.
FAQ
What is the maximum supported transceiver line rate for XCKU5P-2FFVD900I?
The XCKU5P-2FFVD900I supports a maximum transceiver line rate of 25.78125 Gb/s per GTH lane. This enables compliance with CPRI, JESD204C, and 100G KR4 standards. All 24 transceiver lanes on the XCKU5P-2FFVD900I are rated to this speed under specified voltage and temperature conditions per AMD DS922.
Does XCKU5P-2FFVD900I include integrated processors?
Yes, the XCKU5P-2FFVD900I integrates dual ARM Cortex-R5F processors within its Processing System (PS) domain. These cores operate in lockstep mode for functional safety applications and run at up to 600 MHz. The PS includes dedicated peripherals such as Gigabit Ethernet, USB, and SDIO, all accessible without utilizing programmable logic resources.
What configuration security features does XCKU5P-2FFVD900I provide?
XCKU5P-2FFVD900I provides AES-256 bitstream encryption, HMAC-SHA-256 authentication, and eFUSE-based key storage. Configuration can be authenticated and decrypted on-the-fly during boot. These features are implemented in hardware and require no user RTL-enabling secure field updates and protection against cloning for the XCKU5P-2FFVD900I.
Is XCKU5P-2FFVD900I pin-compatible with other Kintex UltraScale+ devices?
XCKU5P-2FFVD900I shares the FFVD900 package footprint with XCKU15P-2FFVD900I and is pin-compatible for all I/O, power, and configuration signals. However, it is not pin-compatible with FFVA900 or FFVB900 variants due to differing ball maps and thermal pad layouts. Always verify pin mapping using AMD UG570 v1.15 for the XCKU5P-2FFVD900I.
What is the typical power consumption of XCKU5P-2FFVD900I under full utilization?
The XCKU5P-2FFVD900I has a thermal design power (TDP) of 28 W under worst-case operating conditions, including full transceiver usage, maximum logic toggling, and DDR4 interface activity. Typical power in real-world 5G radio applications ranges from 18–22 W, depending on clock gating and partial reconfiguration usage-verified using AMD Vivado Power Estimator v2023.2 for the XCKU5P-2FFVD900I.
XCKU5P-2FFVD900I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex® UltraScale+™
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 27120
- Number of Logic Elements/Cells:
- 474600
- Total RAM Bits:
- 41984000
- Number of I/O:
- 304
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XCKU5P-2FFVD900I FAQ
1.How can I place an order for XCKU5P-2FFVD900I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCKU5P-2FFVD900I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCKU5P-2FFVD900I reliable?
The price and inventory of XCKU5P-2FFVD900I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCKU5P-2FFVD900I is usually 5 days.
3.What payment methods are accepted for XCKU5P-2FFVD900I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCKU5P-2FFVD900I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCKU5P-2FFVD900I?
XCKU5P-2FFVD900I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCKU5P-2FFVD900I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCKU5P-2FFVD900I?
For technical support, including XCKU5P-2FFVD900I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCKU5P-2FFVD900I requirements.
6.How does Aetrix verify that XCKU5P-2FFVD900I is sourced from the original manufacturer or authorized distributors?
All XCKU5P-2FFVD900I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCKU5P-2FFVD900I meets industry standards.
7.What is the process for return or replacement of XCKU5P-2FFVD900I?
All XCKU5P-2FFVD900I units undergo pre-shipment inspection (PSI). If there is an issue with XCKU5P-2FFVD900I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCKU5P-2FFVD900I part is unused and in its original packaging.
Return procedure for XCKU5P-2FFVD900I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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